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    MOLD COMPOUND Search Results

    MOLD COMPOUND Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-USBAA00000-002 Amphenol Cables on Demand Amphenol CS-USBAA00000-002 Molded USB 2.0 Cable - Type A-A 2m Datasheet
    CS-USBAB00000-001 Amphenol Cables on Demand Amphenol CS-USBAB00000-001 Molded USB 2.0 Cable - Type A-B 1m Datasheet
    CS-USBAB00000-002 Amphenol Cables on Demand Amphenol CS-USBAB00000-002 Molded USB 2.0 Cable - Type A-B 2m Datasheet
    CS-USBAA00000-003 Amphenol Cables on Demand Amphenol CS-USBAA00000-003 Molded USB 2.0 Cable - Type A-A 3m Datasheet
    CS-USBAA00000-005 Amphenol Cables on Demand Amphenol CS-USBAA00000-005 Molded USB 2.0 Cable - Type A-A 5m Datasheet

    MOLD COMPOUND Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    PCN0515

    Abstract: sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC
    Text: PROCESS CHANGE NOTIFICATION PCN0515 MOLD COMPOUND CHANGE FOR FBGA PACKAGES Change Description: Altera is adopting the Sumitomo G770 series mold compound as the standard mold material on Altera FineLine BGA® FBGA device packages. Devices in FBGA packages currently


    Original     		PDF PCN0515 HC-100 UL-94 1x1011 PCN0515 sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC

    PCN0414

    Abstract: EME-G700 SUMIKON EME-G700 G700 Sumikon EME-G700 datasheet mold compound EMEG700 Amkor mold compound Compound
    Text: PROCESS CHANGE NOTIFICATION PCN0414 STANDARDIZED EME-G700 MOLD COMPOUND FOR TQFP PACKAGES Change Description: Altera will be standardizing on Sumikon EME-G700 series mold compound for the mold compound used in Altera’s Thin Quad Flat Pack TQFP packages. All


    Original     		PDF PCN0414 EME-G700 PCN0414 SUMIKON EME-G700 G700 Sumikon EME-G700 datasheet mold compound EMEG700 Amkor mold compound Compound

    PCN0516

    Abstract: G770* G770 mold compound Sumitomo 1000 sumitomo g770 G770* sumitomo thermal conductivity of sumitomo g770 G770 mold compound G770 plaskon G770 mold compound data sheet G770 sumitomo
    Text: PROCESS CHANGE NOTIFICATION PCN0516 MOLD COMPOUND CHANGE FOR PBGA PACKAGES Change Description: Altera is adopting Sumitomo G770 series mold compound as the standard mold material on its plastic ball-grid array PBGA packaged devices. Devices in 225, 256, and 672 pin PBGA


    Original     		PDF PCN0516 x10-5/C x102N/mm2 UL-94 1X10E12 PCN0516 G770* G770 mold compound Sumitomo 1000 sumitomo g770 G770* sumitomo thermal conductivity of sumitomo g770 G770 mold compound G770 plaskon G770 mold compound data sheet G770 sumitomo

    PCN0404

    Abstract: SUMITOMO g700l sumitomo EME G700L G700L TQFP 144 PACKAGE Compound SUMITOMO mold compound TQFP 144 PACKAGE altera G700
    Text: PROCESS CHANGE NOTICE PCN0404 ADDITIONAL MOLD COMPOUND FOR TQFP 144 PACKAGE Change Description: The Sumitomo G700L mold compound is being added as additional mold compound choice for selected Altera devices in thin quad flat pack TQFP 144 lead packages assembled by


    Original     		PDF PCN0404 G700L PCN0404 SUMITOMO g700l sumitomo EME G700L TQFP 144 PACKAGE Compound SUMITOMO mold compound TQFP 144 PACKAGE altera G700

    PCN0602

    Abstract: sumitomo G700 sumitomo G700 Tg sumitomo epoxy sumitomo g700 type g700 mold compound G700 SUMITOMO Tg G700 sumitomo g700 mold compound sumitomo epoxy G700
    Text: PROCESS CHANGE NOTIFICATION PCN0602 MOLD COMPOUND CHANGE FOR CYCLONE II PQFP & TQFP PACKAGES Change Description: Altera is adopting the Sumitomo G700 series mold compound as the standard mold material on its Cyclone™ II low-k dielectric Plastic Quad Flat Pack PQFP and Plastic Thin Quad


    Original     		PDF PCN0602 E730SJ Sumitomo-G700 EME-E730SJ x10-5/ x102N/mm2 UL-94 PCN0602 sumitomo G700 sumitomo G700 Tg sumitomo epoxy sumitomo g700 type g700 mold compound G700 SUMITOMO Tg G700 sumitomo g700 mold compound sumitomo epoxy G700

    Untitled

    Abstract: No abstract text available
    Text: DCS/PCN-1134 PRODUCT CHANGE NOTICE Initial Final Contact Date: Implementation Date: Alert Category: Alert Type: PCN #: April 30, 2009 May 30, 2009 Material Change Mold compound/die attach change PCN #: 1134 TITLE Conversion of Sumitomo mold compound EME-6300H being discontinued by manufacturer to Sumitomo equivalent mold


    Original     		PDF DCS/PCN-1134 EME-6300H EME6600CSP 84-1LMISR4. EME-6300CSP EME-63000H. EME-6600CSP EME-6300H. ad33K5L-13 AP1506-33K5L-U

    PCN0415

    Abstract: HC100-XJ Nitto Denko HC100-XJ Denko trace code altera HC100 HC100XJAA altera top marking nitto hc100 altera marking
    Text: PROCESS CHANGE NOTIFICATION PCN0415 ADDITIONAL MOLD COMPOUND FOR FBGA PACKAGES FROM ASE MALAYSIA Change Description: The Nitto Denko HC100-XJ series mold compound is being added as an additional mold compound choice for Altera FineLine BGA® packages assembled at ASE Malaysia. This change does not affect form, fit or function.


    Original     		PDF PCN0415 HC100-XJ HC100-XJAA PCN0415 Nitto Denko HC100-XJ Denko trace code altera HC100 HC100XJAA altera top marking nitto hc100 altera marking

    hitachi mold cel

    Abstract: 9200 hitachi CEL9200 cel hitachi cel-9200 cel 9200 Hitachi CEL 9200 140C 8361H
    Text: Cypress Semiconductor Qualification Report QTP# 97383 VERSION 1.0 January, 1998 32 Ld SOJ Package - Hitachi CEL9200 Mold Compound Omedata, Indonesia Assembly Cypress Semiconductor Assembly: Omedata, Indonesia Package: 32 Ld SOJ - Hitachi CEL 9200 Mold Compound


    Original     		PDF CEL9200 CEL9200 8361H CY7C109-VC 85C/85 CY7C107-VC hitachi mold cel 9200 hitachi cel hitachi cel-9200 cel 9200 Hitachi CEL 9200 140C 8361H

    shinetsu

    Abstract: TEXAS INSTRUMENTS, Mold Compound Compound Texas Instruments packaging material KMC288 KMC166 SN74CBT16211 SN74HCT245 TEXAS INSTRUMENTS, Mold
    Text: TEXAS INSTRUMENTS Initial Notification for the qualification of Shinetsu-KMC288 Mold Compound at the Malaysia and Mexico Assembly/Test Facilities December 11, 1997 Abstract Texas Instruments, Standard Linear and Logic group, is qualifying Shinetsu KMC288 mold


    Original     		PDF Shinetsu-KMC288 KMC288 KMC166 shinetsu TEXAS INSTRUMENTS, Mold Compound Compound Texas Instruments packaging material SN74CBT16211 SN74HCT245 TEXAS INSTRUMENTS, Mold

    EME 7320

    Abstract: Ablestik Ablestik 8361 7320 a144g SUMITOMO EME G A100A CY7C09579V-AC JESD22 ASE Cypress
    Text: Cypress Semiconductor Mold Compound Qualification Report QTP# 002403 VERSION 1.0 January, 2001 Sumitomo EME 7320 Mold Compound, MSL3 for DCD-Thin Quad Flat Pack, TQFP ASE Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director


    Original     		PDF 160-lead CY7C375I-AC EME 7320 Ablestik Ablestik 8361 7320 a144g SUMITOMO EME G A100A CY7C09579V-AC JESD22 ASE Cypress

    M24C16K

    Abstract: Nitto MP8000 QREE0016 Nitto MP8000 601 so8
    Text: QREE0016 QUALIFICATION REPORT MP8000 Mold Compound SO8 Shenzhen THIS REPORT This Qualification Report summarizes the reliability trials and results performed to qualify new Nitto Mold Compound called MP8000 used on SO8 package Small Outline Package in Shenzhen plan. This


    Original     		PDF QREE0016 MP8000 R99008) M24C16K M24C08L M24256N M24C16K Nitto MP8000 QREE0016 Nitto 601 so8

    EME-7351

    Abstract: Sumitomo 1000 sumitomo epoxy sumitomo silver epoxy Compound JESD22-A112 EME7351 mold compound SUMITOMO 140C
    Text: Cypress Semiconductor Qualification Report QTP# 97351 VERSION 1.0 January, 1998 32 Ld TSOP Package - Sumitomo EME 7351 Mold Compound Anam, Korea Assembly Cypress Semiconductor Assembly: Anam, Korea Package: TSOP - Sumitomo EME-7351/S351 Mold Compound QTP# 97351, V. 1.0


    Original     		PDF EME-7351/S351 EME-7351 30C/60 CY7C109-ZC Sumitomo 1000 sumitomo epoxy sumitomo silver epoxy Compound JESD22-A112 EME7351 mold compound SUMITOMO 140C

    shinetsu

    Abstract: KMC288 SLL-28 EN-4088Z KMC-166 TEXAS INSTRUMENTS, Mold EPIC-1S
    Text: TEXAS INSTRUMENTS Final Notification for the Qualification of Shinetsu KMC-288 Mold Compound at the Hiji, Malaysia, and Mexico Assembly/Test Facilities May 19, 1998 Abstract Texas Instruments, Mixed Signal and Logic group, is qualifying Shinetsu KMC-288 mold


    Original     		PDF KMC-288 KMC-288 KMC-166 SN74ACT16241DGG JESD22 KMC-166 SN74ACT16841DGG SN74ABT16823DGV shinetsu KMC288 SLL-28 EN-4088Z TEXAS INSTRUMENTS, Mold EPIC-1S

    MP8000

    Abstract: MP-8000 Nitto MP8000 QREE0023 mold compound
    Text: QREE0023 QUALIFICATION REPORT MP8000 Mold Compound SO14 Muar THIS REPORT This Qualification Report summarizes the reliability trials and results performed to qualify new Nitto Mold Compound called MP8000 used on SO14 package Small Outline Package in Muar plan. This material


    Original     		PDF QREE0023 MP8000 R99008) M93CS66F M93CS66F MP-8000 Nitto MP8000 QREE0023 mold compound

    PCN0712

    Abstract: GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE CEL-9750ZHF10AKL sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100
    Text: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0712 MOLD COMPOUND CHANGES FOR BGA, UBGA, MBGA AND FBGA PACKAGES Change Description: Altera is implementing mold compound material changes to the wire bonded Plastic Ball-Grid Array BGA , Ultra FineLine Ball-Grid Array (UBGA), Micro FineLine Ball-Grid Array


    Original     		PDF PCN0712 CEL-9750ZHF10AKL GE-100LFCS GE-100LFCS PCN0712 GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100

    P7060

    Abstract: KMC188-1 KMC-188-1 plaskon TEXAS INSTRUMENTS, Mold 5262a 500 mold compound EME6250 EME6750
    Text: TEXAS INSTRUMENTS Final Notification for PDIP/PLCC Package Mold Compound Change to Sumitomo EME6300HS September 20, 1996 Abstract Texas Instruments is making its final announcement of its implementation of the new mold compound material SUMITOMO EME6300HS in its manufacturing facility in TI Philippines, Inc.


    Original     		PDF EME6300HS EME6300HS) P7060 KMC188-1 KMC-188-1 plaskon TEXAS INSTRUMENTS, Mold 5262a 500 mold compound EME6250 EME6750

    PCN0504

    Abstract: EME-G700 SUMITOMO G700 SUMIKON EME-G700 SUMITOMO EME G700 MPM7128 EME-G700 datasheet G700 SUMItomo EME-G700 Sumikon
    Text: PROCESS CHANGE NOTICE PCN0504 STANDARDIZED EME-G700 SERIES MOLD COMPOUND FOR QFP PACKAGES Change Description: Altera will be standardizing on Sumikon EME-G700 series mold compound in Altera’s quad flat pack QFP packages. All QFP packages assembled at ASE in Malaysia and Amkor in


    Original     		PDF PCN0504 EME-G700 MP8000 EME-6300HJ EPF8452A, EPF8636A, EPF8820A, PCN0504 SUMITOMO G700 SUMIKON EME-G700 SUMITOMO EME G700 MPM7128 EME-G700 datasheet G700 SUMItomo EME-G700 Sumikon

    PCN0702

    Abstract: SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound mp8000ch4 sumitomo G700 Tg
    Text: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0702 UPDATE MOLD COMPOUND CHANGE FOR PQFP, PDIP, AND RQFP PACKAGES Change Description: This is an update to PCN0702, published March, 2007. Altera is implementing mold compound material changes on the Plastic Quad Flat Pack PQFP , Plastic Dual In-Line


    Original     		PDF PCN0702 PCN0702, 6300HJ G700M PCN0702 MP8000CH4 48hrs) X10-5 UL-94 SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound sumitomo G700 Tg

    PCN0310

    Abstract: EME-6300 MP-8000 MP8000 Nitto MP 7000 ASE QFP 8000 Series mold compound EME6300 Nitto MP 8000
    Text: PROCESS CHANGE NOTICE PCN0310 MOLD COMPOUND CHANGE FOR 100 LEAD QFP PACKAGE Change Description: ASE Malaysia will be extending the use of Nitto’s MP-8000 series mold compound to Altera’s 100 lead Quad Flat Package. Currently this package is using Sumitomo’s EME-6300 series


    Original     		PDF PCN0310 MP-8000 EME-6300 MP8000 PCN0310 Nitto MP 7000 ASE QFP 8000 Series mold compound EME6300 Nitto MP 8000

    sumitomo epoxy

    Abstract: sumitomo EME-7351LS EME7351LS EME7351UT Compound EME-7351
    Text: TO: ALL PERICOM CUSTOMERS SUBJECT: Sumitomo Epoxy Mold Compound Issue – EME7351UT Pericom’s current plastic encapsulated, Surface Mount Technology SMT packaged peripheral leaded products do not utilize Sumitomo’s EME7351UT mold compound. This epoxy uses a Particled Phosphorus Flame Retardant Agent, which was found by some


    Original     		PDF EME7351UT EME7351UT EME7351US. EME7351LS sumitomo epoxy sumitomo EME-7351LS Compound EME-7351

    mold compound

    Abstract: DS5000 Compound
    Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244–3292 214 450–0400 Date: June 25, 1996 Subject: PRODUCT CHANGE NOTICE – E62801 Description: 80 Pin QFP Mold Compound Change Description of Change: The mold compound being used by one of our assembly subcontractors (Anam, Korea) is being


    Original     		PDF E62801 6300HS DS5000 DS5001 DS5002 mold compound DS5000 Compound

    Hysol

    Abstract: MG-52F TEXAS INSTRUMENTS, Mold Compound 73X128 Compound EN-4088Z SN74ABT16245ADL SN75976A1DL MG52F SN74ACT16543
    Text: TEXAS INSTRUMENTS Qualification Notification for Hysol MG52F Mold Compound for DL SSOP Packages January 10, 1997 Abstract Texas Instruments is qualifying a new mold compound for the 28, 48, and 56 pin TSSOP DL packages. This new compound will be used in addition to the previously qualified compounds adding


    Original     		PDF MG52F MG52F this116/0 Hysol MG-52F TEXAS INSTRUMENTS, Mold Compound 73X128 Compound EN-4088Z SN74ABT16245ADL SN75976A1DL SN74ACT16543

    SUMITOMO EME-1100H

    Abstract: mold compound SUMITOMO Compound DS2400 1100-H 1100H CARSEM DS1233 DS1410D
    Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244–3292 214 450–0400 Date: March 6, 1997 Subject: PRODUCT CHANGE NOTICE – B70601 Description: Qual of 6710S Mold Compound at Carsem for SOT 233 Packages Description of Change: SOT 223 packages are currently assembled with SUMITOMO EME 1100H mold compound. Proposed


    Original     		PDF B70601 6710S 1100H 6710S. DS1233 DS2401 DS2223 DS2224 DS24S01 SUMITOMO EME-1100H mold compound SUMITOMO Compound DS2400 1100-H CARSEM DS1233 DS1410D

    ABLEBOND

    Abstract: M28945-13 HC100 HC100XJAA M28945 Nitto mold compound 28237-12 M28950-13 Amkor mold compound
    Text: August 7, 2009 CN 080709 Customer Notification Mold Compound Change Dear Valued Customer: This notification is for the purpose of informing you of a change to the mold compound material for the parts listed below. Purpose Amkor has notified Mindspeed that their supplier has discontinued the Cookson SMT-B1 and


    Original     		PDF HC100XJAA CX28398-27 M28947-13 M28945-13 M28950-13 M28946-13 ABLEBOND M28945-13 HC100 M28945 Nitto mold compound 28237-12 M28950-13 Amkor mold compound