35502a
Abstract: No abstract text available
Text: 2A01G - 2A07G CREAT BY ART Pb 2.0 AMPS. Glass Passivated Rectifiers DO-15 RoHS COMPLIANCE Features Glass passivated chip junction High efficiency, Low VF High current capability High reliability High surge current capability Low power loss Green compound with suffix "G" on packing
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DO-15
2A01G
2A07G
MIL-STD-202,
260/10s
2A07G)
2A02G
2A03G
35502a
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material safety for neoprene rubber
Abstract: cas number 00840600 coc fire fighting
Text: Material Safety Data Sheet MSDS Information = Section 1. CHEMICAL PRODUCT SECTION Product Name: Silicone Free Heat Sink Compound Product Number: 1978 General Use: Product Description:
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/MSDS/ms1978
material safety for neoprene rubber
cas number
00840600
coc fire fighting
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Resistor 600 ohm 25W
Abstract: No abstract text available
Text: BVM Series Stackpole Electronics, Inc. Ceramic Housed Vertical Bracket Mount Resistor Features: • • • • • • Resistive Product Solutions Flameproof inorganic construction High temperature potting compound Non-inductive available up to 50Ω RoHS compliant / lead-free
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PDR5K
Abstract: PDR5K-13
Text: PDR5K 5A GLASS PASSIVATED RECTIFIER PowerDI 5 Features Mechanical Data • • • • • • Glass Passivated Die Construction Low Leakage Current Lead Free Finish, RoHS Compliant Note 1 "Green" Molding Compound (No Br, Sb) • • NEW PRODUCT • •
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J-STD-020
MIL-STD-202,
DS31979
621-PDR5K-13
PDR5K-13
PDR5K
PDR5K-13
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Untitled
Abstract: No abstract text available
Text: BC817 SERIES NPN GENERAL PURPOSE TRANSISTORS 45 Volt VOLTAGE POWER 330 mW • General purpose amplifier applications • NPN epitaxial silicon, planar design • Collector current IC = 500mA • Lead free in compliance with EU RoHS 2011/65/EU directive • Green molding compound as per IEC61249 Std. . Halogen Free
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BC817
500mA
2011/65/EU
IEC61249
OT-23,
MIL-STD-750,
BC817-16
BC817-25
BC817-40
2014-REV
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Untitled
Abstract: No abstract text available
Text: 2SC2411K NPN GENERAL PURPOSE SWITCHING TRANSISTOR VOLTAGE 32 Volts POWER 225mW • NPN epitaxial silicon,planar design • Collector-emitter voltage VCE=32V • Collector current IC=500mA • Lead free in comply with EU RoHS 2011/65/EU directives. • Green molding compound as per IEC61249 Std. . Halogen Free
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2SC2411K
225mW
500mA
2011/65/EU
IEC61249
OT-23
MIL-STD-750,
2013-REV
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Untitled
Abstract: No abstract text available
Text: LM5111 LM5111 Dual 5A Compound Gate Driver Literature Number: SNVS300F LM5111 Dual 5A Compound Gate Driver General Description The LM5111 Dual Gate Driver replaces industry standard gate drivers with improved peak output current and efficiency. Each “compound” output driver stage includes MOS and bipolar transistors operating in parallel that together sink more
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LM5111
LM5111
SNVS300F
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512nm
Abstract: 1000PPM 506nm
Text: COTCO LUMINANT DEVICE HUIZHOU LTD. SPECIFICATION FOR COTCO LED LAMP Document No : Model No: Rev. No : Date: SPE/ LD-700ABG1-D0 LD-700ABG1-D0 01 2005-09-16 Description: 7 x 7mm, QFN Type, High Power Bluish Green LED For Illumination, Clear Compound Encapsulated.
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LD-700ABG1-D0
SPE/LD-700ABG1-D0
FCN20050306
COTCO-D-074
512nm
1000PPM
506nm
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1000PPM
Abstract: LD-701CHR1-A5 5202 GE
Text: COTCO LUMINANT DEVICE HUIZHOU LTD. SPECIFICATION FOR COTCO LED LAMP Document No : Model No: Rev. No : Date: SPE/ LD-701CHR1-A5 LD-701CHR1-A5 04 2005-07-20 Description: 7 x 7mm, QFN Type, High Power Red LED For Illumination, Clear Compound Encapsulated. Dice Material:
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LD-701CHR1-A5
SPE/LD-701CHR1-A5
FCN20050197
COTCO-D-074
1000PPM
LD-701CHR1-A5
5202 GE
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1000PPM
Abstract: LD-300DWN1-70 4044v LD300
Text: COTCO LUMINANT DEVICE HUIZHOU LTD. SPECIFICATION FOR COTCO LED LAMP Document No : Model No: Rev. No : Date: SPE/LD-300DWN1-70 LD-300DWN1-70 01 2005-10-6 Description: 3 x 3mm, QFN Type, High Power White LED For Illumination, Clear Compound Encapsulated. Dice Material:
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SPE/LD-300DWN1-70
LD-300DWN1-70
FCN20050327
COTCO-D-074
1000PPM
LD-300DWN1-70
4044v
LD300
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QMI 509 epoxy
Abstract: SUMITOMO eme-6600hr 6600HR SOJ package MSL QMI 509 epoxy datasheet CY7C63001A-SC JESD22 EME6600HR mold compound EME 6600HR
Text: Cypress Semiconductor Package Qualification Report QTP# 023401 VERSION 2.0 GI July, 2004 32-lead SOIC package using Sumitomo EME 6600HR Mold Compound, MSL1 Cypress Philippines CML-R CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Mira Ben-Tzur Principal Reliability Engineer
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32-lead
6600HR
28-44lead
635mils
01BLL-SI
610221877M
CY62128BLL-SI
QMI 509 epoxy
SUMITOMO eme-6600hr
SOJ package MSL
QMI 509 epoxy datasheet
CY7C63001A-SC
JESD22
EME6600HR
mold compound
EME 6600HR
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Untitled
Abstract: No abstract text available
Text: DATA SHEET COMPOUND TRANSISTOR AA1L4Z on-chip resistor NPN silicon epitaxial transistor For mid-speed switching FEATURES PACKAGE DRAWING UNIT: mm • On-chip bias resistor (R1 = 47 kΩ) • Complementary transistor with AN1L4Z ABSOLUTE MAXIMUM RATINGS (Ta = 25°°C)
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MARKING CODE 3J
Abstract: No abstract text available
Text: BC858W PNP General Purpose Transistor FEATURES • Ideally suited for automatic insertion • For Switching and AF Amplifier Applications MECHANICAL DATA • Case: SOT-323 Plastic • Case material: “Green” molding compound, UL flammability classification 94V-0, No Br. Sb. CI
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BC858W
OT-323
2002/95/EC
MARKING CODE 3J
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Untitled
Abstract: No abstract text available
Text: BC856 PNP General Purpose Transistor FEATURES • Ideally suited for automatic insertion • For Switching and AF Amplifier Applications MECHANICAL DATA • Case: SOT-23 Plastic • Case material: “Green” molding compound, UL flammability classification 94V-0, No Br. Sb. CI
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BC856
OT-23
2002/95/EC
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Untitled
Abstract: No abstract text available
Text: Formosa MS Chip Schottky Barrier Diodes FM320 THRU FM3100 Silicon epitaxial planer type Features SMC Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.283 7.2 0.260(6.6) For surface mounted applications.
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FM320
FM3100
MIL-S-19500
DO-214AB
MIL-STD-750,
300us
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Untitled
Abstract: No abstract text available
Text: Formosa MS Chip Schottky Barrier Diodes FM5817-L THRU FM5819-L Silicon epitaxial planer type Features SMA-L Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.205 5.2 0.189(4.8)
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FM5817-L
FM5819-L
MIL-S-19500
DO-214AC
MIL-STD-750,
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Untitled
Abstract: No abstract text available
Text: Formosa MS Chip Schottky Barrier Diodes FM320-B THRU FM3100-B Silicon epitaxial planer type Features SMB Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.213 5.4 0.197(5.0) 0.016(0.4) Typ.
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FM320-B
FM3100-B
MIL-S-19500
DO-214AA
MIL-STD-750,
300us
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Untitled
Abstract: No abstract text available
Text: Formosa MS Chip Silicon Rectifier FM4001 THRU FM4007 Glass passivated type Features SMA Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.189 4.8 0.165(4.2) 0.012(0.3) Typ. For surface mounted applications.
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FM4001
FM4007
MIL-S-19500
DO-214AC
MIL-STD-750,
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Untitled
Abstract: No abstract text available
Text: Formosa MS Low VF Chip Schottky Barrier Diodes SL32-A THRU SL34-A Silicon epitaxial planer type Features SMA Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.189 4.8 0.165(4.2)
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SL32-A
SL34-A
MIL-S-19500
DO-214AC
MIL-STD-750,
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Untitled
Abstract: No abstract text available
Text: Formosa MS Chip Schottky Barrier Diodes FM520-B THRU FM5100-B Silicon epitaxial planer type Features SMB Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.213 5.4 0.197(5.0) 0.016(0.4) Typ.
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FM520-B
FM5100-B
MIL-S-19500
DO-214AA
MIL-STD-750,
300us
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Untitled
Abstract: No abstract text available
Text: Formosa MS Chip Schottky Barrier Diodes FM1020-T1 THRU FM1040-T1 Silicon epitaxial planer type Features SMC-T1 Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.272 6.9 0.248(6.3)
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FM1020-T1
FM1040-T1
MIL-S-19500
DO-214AB
MIL-STD-750,
300us
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Untitled
Abstract: No abstract text available
Text: Formosa MS Chip Schottky Barrier Diodes FM120-S THRU FM1100-S Silicon epitaxial planer type Features SMA-S Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.205 5.2 0.189(4.8)
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FM120-S
FM1100-S
MIL-S-19500
DO-214AC
MIL-STD-750,
300us
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Untitled
Abstract: No abstract text available
Text: Special Connectors Battery Connectors 2.5mm/3.0mm Pitch 2.5mm Pitch, Plug Assembly 10 Position, Part Number : 1123684-7 Material and Finish : Housing — Thermoplastic Molding Compound, UL94V-0 -32.9-28.7- rated, black Contact — Copper Alloy, Nickel-underplated all over,
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OCR Scan
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PDF
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UL94V-0
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PHOTO SENSORS
Abstract: fiber optical photo detector LED Reflective Optical Sensor Infrared photosensor OPTICAL INTERRUPTER position infrared detector object detection
Text: S. Classification of Photo Sensors The Toshiba Photo Sensor is classified as follows: Infrared LED [Emitters Visible LED Photo Transistor Photo sensors• Photo Diode IDetectors Photo 1C : Photo Interrupter ; Compound ; sensors : Photo Reflective Sensor 3. Photosensor Applications
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OCR Scan
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