E115797
Abstract: ablebond 84-1 LMI ABLEBONd 84-1 Ablebond 84-1 SR4 E115797 ablebond 84-1 LMI Ablebond 84-1 SR4 thyristor catalogue TICP106M-S 1015 to-92 mold compound std883
Text: October, 2005 Circuit Protection Division Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team N IT CU ECTIO R I C ROT P Thyristor Surge Protector Product Change Notification PCN Tracking Number 39 Mold Compound Change - TO-92 & DO-92 Packages
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DO-92
ST-7100-GX,
TICP106M-S
LT401LQ
TIPP116-S
TA208LQ
TISP4350H3LM-S
TA230LQ
E115797
ablebond 84-1 LMI
ABLEBONd 84-1
Ablebond 84-1 SR4
E115797 ablebond 84-1 LMI Ablebond 84-1 SR4
thyristor catalogue
TICP106M-S
1015 to-92
mold compound
std883
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"Current Loop Converter"
Abstract: No abstract text available
Text: ADC08831/2 Qualification Package Click Here For ADC08831 Web Info Click Here For ADC08832 Web Info Single/Dual Channel A/D Converters 1.00 0.80 0.60 0.40 0.20 0.00 -0.20 -0.40 -0.60 -0.80 -1.00 255 ADC08831/ADC08832 QUALIFICATION PACKAGE Table of Contents
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ADC08831/2
ADC08831
ADC08832
14-pin
"Current Loop Converter"
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ablebond 84-1 LMI
Abstract: E115797 Ablebond 84-1 SR4 ABLEBONd 84-1 mil std 1015 R3752-1-S CS 110 thyristor 84-1 LMI plaskon TICP106M
Text: October, 2005 Circuit Protection Division Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team N IT CU ECTIO R I C ROT P Thyristor Surge Protector Product Change Notification PCN Tracking Number 39 Mold Compound Change - TO-92 & DO-92 Packages
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DO-92
ST-7100-GX,
TICP106M-S
LT401LQ
TIPP116-S
TA208LQ
TISP4350H3LM-S
TA230LQ
ablebond 84-1 LMI
E115797
Ablebond 84-1 SR4
ABLEBONd 84-1
mil std 1015
R3752-1-S
CS 110 thyristor
84-1 LMI
plaskon
TICP106M
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BAI 59
Abstract: plaskon FBGA PACKAGE thermal resistance
Text: Cypress Semiconductor Package Qualification Report 000201 VERSION 1.0 October, 2000 48 Fine Pitch Ball Grid Array FBGA Level 3 7mm x 7 mm Cypress Philippines Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director (408) 432-7069
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CY62127VLL-BAI
CY62137VLL-BAIB
BAI 59
plaskon
FBGA PACKAGE thermal resistance
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RPM sensor
Abstract: digital tachometer design
Text: Home> Products > PCB level Position Sensors Miniature Plastic package > SS400 > Product Page Order Product and Get Support SS449A-S Search for product and support information. All Sensing and Control U.S. Authorized Distributors SS400 Series Unipolar Hall-Effect Digital
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SS400
SS449A-S
SS400
000/Bag
RPM sensor
digital tachometer design
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RPM sensor
Abstract: plaskon 3300h
Text: Home> Products > PCB level Position Sensors Miniature Plastic package > SS400 > Product Page Order Product and Get Support SS443A-S Search for product and support information. All Sensing and Control U.S. Authorized Distributors SS400 Series Unipolar Hall-Effect Digital
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SS400
SS443A-S
SS400
000/Bag
RPM sensor
plaskon 3300h
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lm1117-3.3v
Abstract: n05a code N05A N03A LM1117MP-3.3 LM1117 lm1117 3.3V LM1117MPX-5 LM1117MP-5.0 N06A
Text: LM1117 Qualification Package t u o p o r D w o L A r m o t a 800 ul g e R r a e n i L ! t i e Mad e W – d e k s rd a d You a n a St y r t us d h n t th i I i w w n a an r o t a l Regu cing Click Here for Web Information TTMM c i r P ge a t n a Adv r you?™
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LM1117
0-800mA
lm1117-3.3v
n05a code
N05A
N03A
LM1117MP-3.3
LM1117
lm1117 3.3V
LM1117MPX-5
LM1117MP-5.0
N06A
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MAX232
Abstract: EN-4088Z SN74ABT16240 SN74ABT16240A SN74ABT16241 SN74ABT16241A 1500KV ABT16241 Hitachi EN-4088Z ABT16240A
Text: TEXAS INSTRUMENTS Qualification Notification for the SN74ABT16240A and SN74ABT16241A, Die Revision D February 20, 1997 Abstract Texas Instruments qualified the SN74ABT16240A and SN74ABT16241A die revision D replacing die revision B. Die revision D includes an all layer change, which incorporates timing
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SN74ABT16240A
SN74ABT16241A,
SN74ABT16240A
SN74ABT16241A
SN74ABT16240
SN74ABT16241
ABT16241
ABT16241A
MAX232
EN-4088Z
1500KV
ABT16241
Hitachi EN-4088Z
ABT16240A
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ABT16541A
Abstract: SN74ABT16540 SN74ABT16540A SN74ABT16541 SN74ABT16541A abt245n ASL2B SN74ABT245 EN4088Z
Text: TEXAS INSTRUMENTS Qualification Notification for the SN74ABT16540A and SN74ABT16541A, Die Revision D May 14, 1997 Abstract Texas Instruments qualified the SN74ABT16540A and SN74ABT16541A die revision D, replacing die revision B. Die revision D includes an all layer change and improves the
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SN74ABT16540A
SN74ABT16541A,
SN74ABT16540A
SN74ABT16541A
SN74ABT16540
SN74ABT16541
SN74ABT16541
SN74ABT16541A
ABT16541A
abt245n
ASL2B
SN74ABT245
EN4088Z
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Ablebond 71-1
Abstract: Ablebond 71 BCT8373 SN74BCT8373 SN74BCT8373A 5247 8 pin
Text: TEXAS INSTRUMENTS Qualification Notification for the SN74BCT8373A, Die Revision B February 7, 1996 Abstract Texas Instruments has qualified the SN74BCT8373A, Die Revision B, to replace the SN74BCT8373, no die revision. Die revision B was redesigned to conform to IEEE Standard 1149.11990 JTAG . The die and device revision are necessary to change the TDO drive state controls to
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SN74BCT8373A,
SN74BCT8373,
Ablebond 71-1
Ablebond 71
BCT8373
SN74BCT8373
SN74BCT8373A
5247 8 pin
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SN74CBT16233
Abstract: eiaj datecode relco CBT16233 EN-4088Z SN74CBT16233DL ASL2B
Text: TEXAS INSTRUMENTS Qualification Notification for the SN74CBT16233, Die Revision B October 29, 1998 Abstract Texas Instruments has qualified a die revision for the CBT16233, die revision ‘B’. This device was redesigned in order to incorporate improved ESD protection circuitry.
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SN74CBT16233,
CBT16233,
SN74CBT16233
eiaj datecode
relco
CBT16233
EN-4088Z
SN74CBT16233DL
ASL2B
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SN74ABT5400
Abstract: SN74ABT5400A SN74ABT5402 SN74ABT5402A ABT5402A
Text: TEXAS INSTRUMENTS Qualification Notification for the SN74ABT5400A, Die Revision C SN74ABT5402A, Die Revision B April 26, 1996 Abstract Texas Instruments Advanced System Logic is issuing this notification to qualify the SN74ABT5400A, die revision C and the SN74ABT5402A, die revision B, to replace the
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SN74ABT5400A,
SN74ABT5402A,
SN74ABT5400,
SN74ABT5402,
ABT5402
ABT5402A
SN74ABT5400
SN74ABT5400A
SN74ABT5402
SN74ABT5402A
ABT5402A
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SN74ALS163A
Abstract: SN74ALS161A SN74ALS161B SN74ALS161BN SN74ALS163B
Text: TEXAS INSTRUMENTS Qualification Notice for Selected ALS-2 Products September 22, 1995 Abstract Texas Instruments Advanced System Logic is issuing this notification, one in a continuing series, to qualify a group of die revisions in the Advanced Low Power Schottky and Advanced Schottky families
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SN74ALS161B
SN74ALS163B
SN74ALS163A
SN74ALS161A
SN74ALS161BN
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28091
Abstract: Ablestik 2000
Text: 09/22/2004 RELIABILITY REPORT FOR DS21Q552, Rev B1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : [email protected]
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DS21Q552,
MIL-STD-883-2012
MIL-STD-883-2016
MIL-STD-883-2015
28091
Ablestik 2000
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Untitled
Abstract: No abstract text available
Text: ISO 9001 Registered PRX+2452 Part Number Contact Form A Switch Configuration SPST Rev. B World's Smallest Surface Mount Overmolded Reed Switch Features Advantages • Hermetically sealed contacts • Extended operations in extreme environments • Sensor materials are lead free and RoHS compliant
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SS400-S
Abstract: 3300h SS466A SS443A plaskon 3300h SS413A SS461A SS400 SS411A SS441A
Text: Solid State Sensors Digital Position Sensors FEATURES ɀ 3.8-30 VDC supply voltage ɀ Digital current sinking output ɀ 3 pin in-line PCB terminals ɀ Quad-Hall design virtually eliminates mechanical stress effects ɀ Temperature compensated magnetics ɀ Operate/release points can be
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3300H
SS400-S
SS400
SS411A
SS443A
SS466A
SS449A
SS441A
SS400-S
3300h
SS466A
SS443A
plaskon 3300h
SS413A
SS461A
SS411A
SS441A
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130C
Abstract: JESD22 Ablebond 8355
Text: Cypress Semiconductor Qualification Report QTP# 98193 VERSION 1.0 December, 1998 292-Pin BGA Package ASE, Taiwan Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Cypress Semiconductor Quality and Reliability Department Cypress Semiconductor Assembly: ASE, Taiwan
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292-Pin
30C/60
CY37256P256-BGC
7C37652AF-GBGC
130C
JESD22
Ablebond 8355
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SS461A
Abstract: SS411A SS443A SS466A 3300H SS400 SS400-S SS413A SS441A SS449A
Text: Interactive Catalog Replaces Catalog Pages Honeywell Sensing and Control has replaced the PDF product catalog with the new Interactive Catalog. The Interactive Catalog is a power search tool that makes it easier to find product information. It includes more
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SS411A
SS400
SS443A
SS466A
SS449A
SS441A
SS461A
SS413A
SS461A
SS411A
SS443A
SS466A
3300H
SS400-S
SS413A
SS441A
SS449A
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3300H
Abstract: No abstract text available
Text: SS461A SS400 Series Latching HallEffect Digital Position Sensor; radial lead IC package Actual product appearance may vary. Features • • • • • • • • Digital current sinking output Quad-Hall design virtually eliminates mechanical stress effects
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SS461A
SS400
3300H
SS400-S
000/Bag
SS400
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SS411A
Abstract: No abstract text available
Text: SS411A SS400 Series Bipolar HallEffect Digital Position Sensor; radial lead IC package Actual product appearance may vary. Features • • • • • • • • Digital current sinking output Quad-Hall design virtually eliminates mechanical stress effects
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SS411A
SS400
3300H
SS400-S
000/Bag
SS400
SS411A
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prx 2451
Abstract: plaskon
Text: www.hermeticswitch.com PO Box 2220 Chickasha, OK 73023 Phone: 405 224-4046 Fax: (405) 224-9423 ISO 9001 Registered PRX+2451 Part Number Contact Form A SPST Switch Configuration Rev. D World's Smallest and Most Magnetically Sensitive Overmolded Reed Switch
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TAIYO PSR 4000
Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).
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PCN0516
Abstract: G770* G770 mold compound Sumitomo 1000 sumitomo g770 G770* sumitomo thermal conductivity of sumitomo g770 G770 mold compound G770 plaskon G770 mold compound data sheet G770 sumitomo
Text: PROCESS CHANGE NOTIFICATION PCN0516 MOLD COMPOUND CHANGE FOR PBGA PACKAGES Change Description: Altera is adopting Sumitomo G770 series mold compound as the standard mold material on its plastic ball-grid array PBGA packaged devices. Devices in 225, 256, and 672 pin PBGA
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PCN0516
x10-5/C
x102N/mm2
UL-94
1X10E12
PCN0516
G770* G770 mold compound Sumitomo 1000
sumitomo g770
G770* sumitomo
thermal conductivity of sumitomo g770
G770 mold compound
G770
plaskon
G770 mold compound data sheet
G770 sumitomo
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Untitled
Abstract: No abstract text available
Text: 4551Ô3Q Solid State Sensors 0023750 147 SS400 Series Digital Position Sensors FEATURES • 3.8-30 VDC supply voltage • Digital current sinking output • 3 pin in-line PCB terminals • Quad-Hall design virtually eliminates mechanical stress effects • Temperature compensated
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OCR Scan
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3300H
SS400-S
SS400
0QE37S1
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