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    MIL-STD-883 WIRE BOND PULL METHOD 2011 Search Results

    MIL-STD-883 WIRE BOND PULL METHOD 2011 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TCTH011AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH022AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH021AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    DE6B3KJ151KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd

    MIL-STD-883 WIRE BOND PULL METHOD 2011 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Sumitomo CRM1076NS

    Abstract: SUMITOMO g600 CRM1076NS Compound R3589DR-S TISPA79R241DR-S J-STD-22 R3680DR-S crm1076 bourns R3679DR-S
    Text: THYRISTOR SURGE PROTECTORS August 2007 Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team PCN Tracking Number 45 New Assembly/Test Site & Green Mold Compound Bourns is qualifying an additional assembly/test site for manufacture of overvoltage protectors in


    Original     		PDF MS012, TISP3082F3DR-S TISP3125F3DR-S TISP3150F3DR-S TISP3180F3DR-S TISP3290F3DR-S TISP3380F3DR-S TISP4072F3DR-S TISP4125F3DR-S TISP4150F3DR-S Sumitomo CRM1076NS SUMITOMO g600 CRM1076NS Compound R3589DR-S TISPA79R241DR-S J-STD-22 R3680DR-S crm1076 bourns R3679DR-S

    Sumitomo CRM1076NS

    Abstract: SUMITOMO g600 G600 mold compound r3589 J-STD-22 G600 JEDEC 95 CRM1076NS TISP4072F3DR-S r36041
    Text: THYRISTOR SURGE PROTECTORS August 2007 Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team PCN Tracking Number 45 New Assembly/Test Site & Green Mold Compound Bourns is qualifying an additional assembly/test site for manufacture of overvoltage protectors in


    Original     		PDF MS012, TISP3082F3DR-S TISP3125F3DR-S TISP3150F3DR-S TISP3180F3DR-S TISP3290F3DR-S TISP3380F3DR-S TISP4072F3DR-S TISP4125F3DR-S TISP4150F3DR-S Sumitomo CRM1076NS SUMITOMO g600 G600 mold compound r3589 J-STD-22 G600 JEDEC 95 CRM1076NS TISP4072F3DR-S r36041

    ABLEBONd 84-1

    Abstract: JESD22-B116 Ablebond 84-1 LMISR4 JESD22-A101 LMISR4 A101 G600 JESD22 9110l
    Text: THYRISTOR SURGE PROTECTORS Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team May 6, 2009 PCN Tracking Number 48 Change from Gold to Copper Wire In 2Q08, Bourns qualified a change to the base metal composition of the wires used to bond overvoltage protection chips to the package terminals of the 8-pin SOP 150 mil package.


    Original     		PDF JESD22 J-STD-020 JESD22-A113 TISP61089HDMR-S TISP8200MDR-S TISP8201MDR-S TISP9110LDMR-S ABLEBONd 84-1 JESD22-B116 Ablebond 84-1 LMISR4 JESD22-A101 LMISR4 A101 G600 JESD22 9110l

    ABLEBONd 84-1

    Abstract: Ablebond 84-1 LMISR4 JESD22-B116 G600 TISP61089HDMR-S MIL-STD-883-2019 A101 B116 JESD22 TISP9110LDMR-S
    Text: THYRISTOR SURGE PROTECTORS Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team May 6, 2009 PCN Tracking Number 48 Change from Gold to Copper Wire In 2Q08, Bourns qualified a change to the base metal composition of the wires used to bond overvoltage protection chips to the package terminals of the 8-pin SOP 150 mil package.


    Original     		PDF JESD22 J-STD-020 JESD22-A113 TISP61089HDMR-S TISP8200MDR-S TISP8201MDR-S TISP9110LDMR-S ABLEBONd 84-1 Ablebond 84-1 LMISR4 JESD22-B116 G600 TISP61089HDMR-S MIL-STD-883-2019 A101 B116 JESD22 TISP9110LDMR-S

    "Sumitomo eme 6600"

    Abstract: R7W120DR TISPA79R241DR R3604-3DR CRM1033D JEDEC 95 R3763 tisp2180f3ds sumitomo 6600 TISP2180F3DR
    Text: CIRCUIT PROTECTION PRODUCTS April, 2006 Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team Thyristor Surge Protector Product Change Notification PCN Tracking Number 42 - New Assembly/Test Site


    Original     		PDF 150mil) MS012, MS-012, RISP61521DR-S TISP6L7591DR TISP70151D TISP7015DR TISP7015L1D TISP7015L1DR "Sumitomo eme 6600" R7W120DR TISPA79R241DR R3604-3DR CRM1033D JEDEC 95 R3763 tisp2180f3ds sumitomo 6600 TISP2180F3DR

    copper bond wire

    Abstract: crm-1076NS CRM1076NS Sumitomo CRM1076NS J-STD-22 0834 CRM1076 r3589 SUMITOMO g600 G600
    Text: THYRISTOR SURGE PROTECTORS May, 2008 Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team Thyristor Surge Protector Product Change Notification PCN Tracking Number 46 — Change from Gold to Copper Wire


    Original     		PDF 150mil) MS012, TISP3125F3DR-S TISP3150F3DR-S TISP3180F3DR-S TISP3290F3DR-S TISP3380F3DR-S TISP4072F3DR-S TISP4125F3DR-S TISP4150F3DR-S copper bond wire crm-1076NS CRM1076NS Sumitomo CRM1076NS J-STD-22 0834 CRM1076 r3589 SUMITOMO g600 G600

    CRM1076NS

    Abstract: J-STD-22 r3589 Sumitomo CRM1076NS CS thyristor G600 CRM1076N
    Text: THYRISTOR SURGE PROTECTORS May, 2008 Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team Thyristor Surge Protector Product Change Notification PCN Tracking Number 46 — Change from Gold to Copper Wire


    Original     		PDF 150mil) MS012, TISP3125F3DR-S TISP3150F3DR-S TISP3180F3DR-S TISP3290F3DR-S TISP3380F3DR-S TISP4072F3DR-S TISP4125F3DR-S TISP4150F3DR-S CRM1076NS J-STD-22 r3589 Sumitomo CRM1076NS CS thyristor G600 CRM1076N

    CRM-1033

    Abstract: JEDEC 95 CRM1033D CRM1033 Product Change Notification PCN "Sumitomo eme 6600" R3602D r3589 TISP2180F3 TISPL758LF3DR
    Text: CIRCUIT PROTECTION PRODUCTS April, 2006 Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team Thyristor Surge Protector Product Change Notification PCN Tracking Number 42 - New Assembly/Test Site


    Original     		PDF 150mil) MS012, MS-012, RISP61521DR-S TISP6L7591DR TISP70151D TISP7015DR TISP7015L1D TISP7015L1DR CRM-1033 JEDEC 95 CRM1033D CRM1033 Product Change Notification PCN "Sumitomo eme 6600" R3602D r3589 TISP2180F3 TISPL758LF3DR

    7C80381A

    Abstract: 7C80381 CY2037-2WAF CY2037AWAF S2032 Mil-Std-883 Wire Bond Pull Method 2011
    Text: Cypress Semiconductor Product Qualification Report QTP# 98225VERSION 1.0 September, 2000 Single PLL Programmable Clock L28 Technology, Fab 2 CY2037AWAF CY2037-2WAF CY5037AWAF High Accuracy EPROM Programmable Die for Crystal Oscillators CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA:


    Original     		PDF 98225VERSION CY2037AWAF CY2037-2WAF CY5037AWAF CY2037AWAF/ CY2037-2WAF/ 85C/85 CY2273APVC 7C80381A 7C80381 CY2037-2WAF CY2037AWAF S2032 Mil-Std-883 Wire Bond Pull Method 2011

    CY7C199

    Abstract: EME-6300H JESD22 MP-8000
    Text: Cypress Semiconductor Qualification Report QTP# 97476 VERSION 1.0 December, 1997 32K x 8 Static RAM CY7C194/CY7C195/CY7C199 CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Kim Nguyen Staff Reliability Engineer 408 943-2136 Cypress Semiconductor 256K Static RAM, R28 Process, Fab 2 Qualification


    Original     		PDF CY7C194/CY7C195/CY7C199 CY7C199 28-pin, 300-mil CY7C199-VC 85C/85 CY7C199 EME-6300H JESD22 MP-8000

    7C43

    Abstract: 9748 CY7C42 CY7C42 qualification CY7C1049V33-VC
    Text: Cypress Semiconductor Product Qualification Report QTP# 97483 VERSION 2.0 November, 2000 Low Voltage Deep Synchronous FIFO High Speed 100-MHZ Operation R42D – Fab 4 CY7C4255V/CY7C4265V/CY7C4275V/CY7C4285V 8K/16K/32K/64K x 18 CY7C4261V/CY7C4271V/CY7C4281V/CY7C4291V


    Original     		PDF 100-MHZ CY7C4255V/CY7C4265V/CY7C4275V/CY7C4285V 8K/16K/32K/64K CY7C4261V/CY7C4271V/CY7C4281V/CY7C4291V 16K/32K/64K/128K CY7C4282V/CY7C4292V 64K/128K CY7C42 CY7C1021V33-VC 7C43 9748 CY7C42 qualification CY7C1049V33-VC

    Ablebond 84-1LMI

    Abstract: 84-1LMI JESD22 0/7C62126/7V
    Text: Cypress Semiconductor Qualification Report QTP# 97506, VERSION 1.0 May, 1998 1 Meg SRAM, R42 Technology, Fab 4 Qualification CY62126/7V 64K x 16 Static RAM, 2.7V - 3.6V Operation Cypress Semiconductor 1 Meg SRAM, R42 Technology, Fab 4 Devices:CY62126/7V Rev. A


    Original     		PDF CY62126/7V 44-pin CY7C1021V33-VC 30C/60 Ablebond 84-1LMI 84-1LMI JESD22 0/7C62126/7V

    CY62135V18

    Abstract: CY7C1329 8355F
    Text: Cypress Semiconductor Product Qualification Report QTP# 003108 VERSION 1.0 December 2000 2 Meg FCP MoBL2  SRAM Family R52D-3, Fab 4 CY62135V18 CY62136V18/CY62137V18 128K x 16 Static RAM MoBL  and More Battery life are Trade mark of Cypress Semiconductor Corporation.


    Original     		PDF R52D-3, CY62135V18 CY62136V18/CY62137V18 CY62136V18/CY62136V18/CY62137V18 R52D-3 CY7C1329-AC 30C/60 CY62135V18 CY7C1329 8355F

    CY7C1350B

    Abstract: CY7C1329 CY7C1351B CY7C1352B CY7C1353B
    Text: Cypress Semiconductor Product Qualification Report QTP# 99245 VERSION 3.0 December, 2000 4 Meg Synchronous SRAM R52D-3 Technology, Fab 4 CY7C1350B 128K x 36 Pipeline SRAM with NoBL Architecture CY7C1351B 128K x 36 Flow Through SRAM with NoBL™ Architecture


    Original     		PDF R52D-3 CY7C1350B CY7C1351B CY7C1352B CY7C1353B CY7C1329-AC 30C/60 CY7C1350B CY7C1329 CY7C1351B CY7C1352B CY7C1353B

    QMI2419

    Abstract: CY7C197 CY7C199 precondition DIP JEDEC
    Text: Cypress Semiconductor Product Qualification Report QTP# 001605 VERSION 1.0 October, 2000 256K FAST ASYNCHRONOUS SRAM R42HDHA Technology, Fab 4 CY7C194/195 64K x 4 Static RAM CY7C197 256K x 1 Static RAM CY7C198/199 32K x 8 Static RAM CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA:


    Original     		PDF R42HDHA CY7C194/195 CY7C197 CY7C198/199 CY7C199 7C1599G) R42HD 98------STRESS: CY7C109-VC QMI2419 CY7C197 CY7C199 precondition DIP JEDEC

    CY7C1021V33

    Abstract: Mil-Std-883 Wire Bond Pull Method 2011 JESD22
    Text: Cypress Semiconductor Qualification Report QTP# 97211, VERSION 1.1 October, 1997 1 Meg SRAM, R42D Technology, Fab 4 Qualification CY7C1021V33 64K x 16 Static RAM Cypress Semiconductor 1 Meg SRAM, R42 Technology, Fab 4 Devices:CY7C1021V33 Package: SOJ QTP# 97211, V1.1


    Original     		PDF CY7C1021V33 44-pin, CY7C1021V33-VC 30C/60 CY7C1021V33 Mil-Std-883 Wire Bond Pull Method 2011 JESD22

    Mil-Std-883 Wire Bond Pull Method 2011

    Abstract: 28-pin SOJ SRAM 9749 cel 9200 8361H CY62256V JESD22
    Text: Cypress Semiconductor Qualification Report QTP# 97496, VERSION 1.1 March 1999 256K SRAM, R42 Technology, Fab 4 Qualification CY62256V* 32K x 8 Micro Power Asynchronous SRAM 2.7V - 3.6V CY62256V25* 32K x 8 Micro Power Asynchronous SRAM (2.3V - 2.7V) CY62256V18*


    Original     		PDF CY62256V* CY62256V25* CY62256V18* CY62256V 28-pin, 300-mil CY622= 85C/85 CY62256V-VC Mil-Std-883 Wire Bond Pull Method 2011 28-pin SOJ SRAM 9749 cel 9200 8361H CY62256V JESD22

    7C109A

    Abstract: CY7C109
    Text: Cypress Semiconductor Qualification Report QTP# 98064 VERSION 1.0 April, 1998 1 Meg SRAM, R42HD Technology, Fab 4 Qualification CY7C109/CY7C1009 128K x 8 SRAM 5V Operation Cypress Semiconductor, Inc. 128K x 8 SRAM - R42DH Technology - Fab 4 Device: CY7C109 (7C109H)


    Original     		PDF R42HD CY7C109/CY7C1009 R42DH CY7C109 7C109H) 32-pin, 400-mil CY7C109-VC 7C109A CY7C109

    Mil-Std-883 Wire Bond Pull Method 2011

    Abstract: 82440 82440LX 82430TX 82440FX
    Text: Cypress Semiconductor Qualification Report QTP# 97403 VERSION 1.0 April 1998 Pentium  and Pentium II  Clock Synthesizer/Driver  Pentim is a trademark of Intel Corporation CY2273 Clock Synthesizer/Driver for Intel 82430TX and Chipsets with 3 DIMM Support


    Original     		PDF CY2273 82430TX CY2274 82440FX CY2275 82440LX CY2276 CY2277 Mil-Std-883 Wire Bond Pull Method 2011 82440

    CY62137V

    Abstract: CY62138V
    Text: Cypress Semiconductor Qualification Report QTP# 99075 VERSION 1.0 April, 1999 MoBL SRAM, R52LD Technology, Fab 4 Qualification CY62136V/CY62137V 128K x 16 Static RAM CY62138V 256K x 8 Static RAM CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Cypress Semiconductor


    Original     		PDF R52LD CY62136V/CY62137V CY62138V CY62136V/62137V/62138V 7C62136/7A) CY62136V/62137V/62138V R52LD-3 CY62137V 44-pin CY62137V CY62138V

    CEL9200

    Abstract: 8361H A100R CY7C1329 JESD22
    Text: Cypress Semiconductor Technology Qualification Report QTP# 99311 VERSION 2.0 December, 2000 R52D-3Technology, Fab 4 Qualification CY7C1329 64K x 32 Synchronous-Pipelined Cache RAM CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director


    Original     		PDF R52D-3Technology, CY7C1329 R52D-3 CY7C1329-2Meg Pipeline00 CY7C1329-AC 30C/60 CEL9200 8361H A100R CY7C1329 JESD22

    plx 9030

    Abstract: EIA/JEDEC JESD22-A108 pci9030-aa60pi PCI 9030 uBGA 180 Failure rate plx 9052 PCI9054-AB50PI PCI9030-AA60BI PCI9054-AA50BI PCI9080-3 PCI 9030 FIT rate
    Text: Revision: Original October 2000 Website: Email: Phone: Fax: http://www.plxtech.com [email protected] 408-774-9060 800-759-3735 408-774-2169 2000 PLX Technology, Inc. All rights reserved. PLX Technology, Inc. retains the right to make changes to this product at any time, without notice.


    Original     		PDF

    40F-701-1-15

    Abstract: nikon STEPPER 71007 MIL-STD-883 method 5003 INCOMING MATERIAL INSPECTION procedure harris top marking product change notification
    Text: Status of Document is:RELEASED Effective from: 19-SEP-1997 14:23:42 to Date Printed: 09/24/97 7:46 AM SECTION 2.0 Controlled Document QML GENERAL NON-TECHNOLOGY SPECIFIC GENERAL Section 2.0 of this manual is written to describe the general (non-technology specific)


    Original     		PDF 19-SEP-1997 210XXX 710-010-XX 40F-400-0-0 40F-701-1-15 nikon STEPPER 71007 MIL-STD-883 method 5003 INCOMING MATERIAL INSPECTION procedure harris top marking product change notification

    MP 1009 es

    Abstract: BS-00001
    Text: ^EDI B c e tro n lc D e s ig n i Inc. Reliability Program Quality Assurance Policy The Quality Standard at Electronic Designs Incorpo­ rated EDI is defect free work. No other standard is acceptable. This policy is reflected in the attention given to the


    OCR Scan     		PDF MIL-STD-883. MIL-STD-883 MP 1009 es BS-00001