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    JEDEC PACKAGE MO-220 VGGC Search Results

    JEDEC PACKAGE MO-220 VGGC Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    JEDEC PACKAGE MO-220 VGGC Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    MO-220-VGGC

    Abstract: MO-220 TB389
    Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L16.4x4 16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220-VGGC ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80


    Original     		PDF MO-220-VGGC TB389. MO-220 TB389

    jedec package MO-220 vggc

    Abstract: MO-220-VGGC 12-leadquad TB389 jedec package MO-220 MO-220 Technical Brief TB389
    Text: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L12.4x4 12 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220-VGGC ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80


    Original     		PDF MO-220-VGGC TB389. jedec package MO-220 vggc 12-leadquad TB389 jedec package MO-220 MO-220 Technical Brief TB389

    MO-220-VGGC

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Micro Lead Frame Plastic Package MLFP L16.4x4 2X 0.25 C A D A 16 LEAD MICRO LEAD FRAME PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220-VGGC ISSUE A) D/2 INCHES D1 SYMBOL D1/2 2X N 6 0.50 DIA. 0.25 C B 1 2 3 E1/2 E/2 E1


    Original     		PDF MO-220-VGGC