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Cooper Crouse-Hinds LTB3890 Conduit Gland, 90Deg, Insulated, Iron, 0.375"; Conduit Configuration:90 Degree; Trade Size:3/8"; Conduit Material:Malleable Iron; Conduit Colour:Metallic - Zinc Electroplate; External Length:-; Ip/Nema Rating:- Rohs Compliant: Yes \|Crouse-Hinds LTB3890
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Newark	LTB3890	Bulk			50	1 - 10 - 100 $11.68 1000 $10.08 10000 $10.08	Buy Now
Master Electronics	LTB3890		5			1 - 10 $20.53 100 $17.11 1000 $16.68 10000 $16.68	Buy Now

TB389. Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
TB389		Intersil	PRISM 2.5 PCB Land Pattern Design and Surface Mount Guidelines for MLFP Packages		Original	PDF

TB389. Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
J-STD-005 Abstract: nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 TB389 XQFN Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief April 23, 2009 TB389.6 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently	Original	PDF	TB389 J-STD-005 nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 XQFN
J-STD-005 Abstract: land pattern for DFN qfn 10mm land pattern nozzle heater qfn Substrate design guidelines two tinned touch pads ipc-SM-782 PIC16F877A circuit diagram pitch 0.4mm BGA Technical Brief TB389 Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief March 27, 2008 TB389.5 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently	Original	PDF	TB389 J-STD-005 land pattern for DFN qfn 10mm land pattern nozzle heater qfn Substrate design guidelines two tinned touch pads ipc-SM-782 PIC16F877A circuit diagram pitch 0.4mm BGA Technical Brief TB389
J-STD-005 Abstract: nozzle heater paste profile qfn 10mm land pattern J-STD-001C solder joint IPC-SM-782 MO-220 TB389 MARK RAY QFN Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN MLFP Packages Technical Brief March 2004 TB389.2 Authors: Jim Benson, Mark Kwoka, Ray Claudio Introduction General Design Guidelines Intersil’s Quad Flat No Lead (QFN), Micro Lead Frame Plastic (MLFP) package is a relatively new packaging	Original	PDF	TB389 J-STD-005 nozzle heater paste profile qfn 10mm land pattern J-STD-001C solder joint IPC-SM-782 MO-220 MARK RAY QFN
qfn Substrate design guidelines Abstract: j-std-001d IPC-SM-782 MO-220 TB389 Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief August 17, 2006 TB389.3 Author: Mark Kwoka Introduction General Design Guidelines Intersil’s Quad Flat No Lead QFN package is a relatively new packaging concept that is currently experiencing rapid	Original	PDF	TB389 qfn Substrate design guidelines j-std-001d IPC-SM-782 MO-220
TB389 Abstract: No abstract text available Text: Technical Brief 389 Authors: Mark Kwoka and Jim Benson PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently experiencing	Original	PDF	TB389