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    G600 MOLD COMPOUND Search Results

    G600 MOLD COMPOUND Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-USBAA00000-002 Amphenol Cables on Demand Amphenol CS-USBAA00000-002 Molded USB 2.0 Cable - Type A-A 2m Datasheet
    CS-USBAB00000-001 Amphenol Cables on Demand Amphenol CS-USBAB00000-001 Molded USB 2.0 Cable - Type A-B 1m Datasheet
    CS-USBAB00000-002 Amphenol Cables on Demand Amphenol CS-USBAB00000-002 Molded USB 2.0 Cable - Type A-B 2m Datasheet
    CS-USBAA00000-003 Amphenol Cables on Demand Amphenol CS-USBAA00000-003 Molded USB 2.0 Cable - Type A-A 3m Datasheet
    CS-USBAA00000-005 Amphenol Cables on Demand Amphenol CS-USBAA00000-005 Molded USB 2.0 Cable - Type A-A 5m Datasheet

    G600 MOLD COMPOUND Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    PCN0512

    Abstract: G600 mold compound SUMITOMO g600 Nitto MP8000 EP1800I SUMITOMO-G600 altera EPM7032S mold compound altera EPM7032B ep600i
    Text: PROCESS CHANGE NOTIFICATION PCN0512 IMPLEMENTING STANDARD SUMITOMO-G600 SERIES MOLD COMPOUND FOR PLCC PACKAGES Change Description: Altera will implement a standard Sumitomo-G600 series mold compound on its Plastic J-Lead Chip Carrier PLCC packages. All devices in PLCC packages assembled at ASE Malaysia


    Original     		PDF PCN0512 SUMITOMO-G600 MP8000 EPC1064 EPC1064V EPC1213 EPC1441 PCN0512 G600 mold compound SUMITOMO g600 Nitto MP8000 EP1800I altera EPM7032S mold compound altera EPM7032B ep600i

    PCN0702

    Abstract: SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound mp8000ch4 sumitomo G700 Tg
    Text: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0702 UPDATE MOLD COMPOUND CHANGE FOR PQFP, PDIP, AND RQFP PACKAGES Change Description: This is an update to PCN0702, published March, 2007. Altera is implementing mold compound material changes on the Plastic Quad Flat Pack PQFP , Plastic Dual In-Line


    Original     		PDF PCN0702 PCN0702, 6300HJ G700M PCN0702 MP8000CH4 48hrs) X10-5 UL-94 SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound sumitomo G700 Tg

    Sumitomo CRM1076NS

    Abstract: SUMITOMO g600 CRM1076NS Compound R3589DR-S TISPA79R241DR-S J-STD-22 R3680DR-S crm1076 bourns R3679DR-S
    Text: THYRISTOR SURGE PROTECTORS August 2007 Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team PCN Tracking Number 45 New Assembly/Test Site & Green Mold Compound Bourns is qualifying an additional assembly/test site for manufacture of overvoltage protectors in


    Original     		PDF MS012, TISP3082F3DR-S TISP3125F3DR-S TISP3150F3DR-S TISP3180F3DR-S TISP3290F3DR-S TISP3380F3DR-S TISP4072F3DR-S TISP4125F3DR-S TISP4150F3DR-S Sumitomo CRM1076NS SUMITOMO g600 CRM1076NS Compound R3589DR-S TISPA79R241DR-S J-STD-22 R3680DR-S crm1076 bourns R3679DR-S

    Sumitomo CRM1076NS

    Abstract: SUMITOMO g600 G600 mold compound r3589 J-STD-22 G600 JEDEC 95 CRM1076NS TISP4072F3DR-S r36041
    Text: THYRISTOR SURGE PROTECTORS August 2007 Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team PCN Tracking Number 45 New Assembly/Test Site & Green Mold Compound Bourns is qualifying an additional assembly/test site for manufacture of overvoltage protectors in


    Original     		PDF MS012, TISP3082F3DR-S TISP3125F3DR-S TISP3150F3DR-S TISP3180F3DR-S TISP3290F3DR-S TISP3380F3DR-S TISP4072F3DR-S TISP4125F3DR-S TISP4150F3DR-S Sumitomo CRM1076NS SUMITOMO g600 G600 mold compound r3589 J-STD-22 G600 JEDEC 95 CRM1076NS TISP4072F3DR-S r36041

    G600 mold compound

    Abstract: TO263-5L TO252-5L G600 mold compound unisem G600 MIC29302WT mic29302 TO-263-5L 2525l MIC39152
    Text: Micrel TO-263,TO-220,TO-252 Power Packages High Temperature Operating Life +125 deg C, 1000 hours Device D/C Lot No Stress Hrs. Stress Hrs. Stress Hrs. Pkg M/C Assem. Loc Fab SS 168 H 1.0 KH MIC29302 MIC37302 MIC29302 MIC29302 MIC29302 MIC37302 WU WU WU WU


    Original     		PDF O-263 O-220 O-252 MIC29302 MIC37302 9A15518MEA G600 mold compound TO263-5L TO252-5L G600 mold compound unisem G600 MIC29302WT mic29302 TO-263-5L 2525l MIC39152

    G600 mold compound

    Abstract: SUMITOMO g600 g600 CDSOT23 CDNBS16-T03 CDNBS16-T03C CDNBS16-T05 CDNBS16-T05C CDNBS16-T08 CDNBS16-T08C
    Text: CHIP DIODES Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team November, 2009 Bourns Diode Products Addition of Second Wafer Fabrication Location and Change to Sumitomo’s Green Mold Compound


    Original     		PDF CDNBS16-T03 CDNBS16-T03C CDNBS16-T05 CDNBS16-T05C CDNBS16-T08 CDNBS16-T08C CDNBS16-T12 CDNBS16-T12C CDNBS16-T15 CDNBS16-T15C G600 mold compound SUMITOMO g600 g600 CDSOT23 CDNBS16-T03 CDNBS16-T03C CDNBS16-T05 CDNBS16-T05C CDNBS16-T08 CDNBS16-T08C

    Ablestik 84-1

    Abstract: Ablestik Ablestik LMISR4 SUMITOMO g600 Ablestik 84-1 lmis-r4 LMISR4 G600 mold compound G600 mold compound unisem 6300h sumitomo 6300h mold compound
    Text: October 26, 2009 CN-102609 Customer Notification M02045-2Y04-T and M02045G-2Y04-T Second Assembly Site Dear Valued Customer: This notification is for the purpose of informing you of a second assembly site for the M02045-2Y04-T and M02045G-2Y04-T, 16 pin SOIC package.


    Original     		PDF CN-102609 M02045-2Y04-T M02045G-2Y04-T M02045G-2Y04-T, Ablestik 84-1 Ablestik Ablestik LMISR4 SUMITOMO g600 Ablestik 84-1 lmis-r4 LMISR4 G600 mold compound G600 mold compound unisem 6300h sumitomo 6300h mold compound

    G600 mold compound

    Abstract: CDNBS08-T15 SUMITOMO g600 DIODES SGS CD143A-SR05 CD143A-SR12 CD143A-SR70 CDNBS08-T03 CDNBS08-T03C CDNBS08-T05C
    Text: CHIP DIODES Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team Revised October 7, 2009 Bourns Diode Products Addition of Second Wafer Fabrication Location and Change to Sumitomo’s Green Mold Compound


    Original     		PDF CD143A-SR70 CD143A-SR05 CD143A-SR12 CDSOT23-SRV05-4 CDNBS08-T03 CDNBS08-T03C CDNBS08-T05 CDNBS08-T05C CDNBS08-T08 CDNBS08-T08C G600 mold compound CDNBS08-T15 SUMITOMO g600 DIODES SGS CD143A-SR05 CD143A-SR12 CD143A-SR70 CDNBS08-T03 CDNBS08-T03C CDNBS08-T05C

    Untitled

    Abstract: No abstract text available
    Text: RELIABILITY REPORT DATE : 11/05/08 QUALITY ENG : PART NUMBER : Dinh Pham MIC2005-x.xLYM5 : Fixed Current Limit Power Distribution Switch. QUAL VEHICLES : PACKAGE TYPE : ASSEMBLY LOC. D/C # LOT # FAB LOC. M/C PROCESS MIC2005-0.5LYM5 SOT23-5L UNISEM 0835 8A26284MNK


    Original     		PDF MIC2005-x MIC2005-0 OT23-5L 8A26284MNK 8A20587MNK MIC2005-1 8A26319MNK

    SUMITOMO g600

    Abstract: SMDA05-6 CDSOT236-T15C G600 mold compound CDSOT236-T05 CDSOT236-T05C CDSOT236-T12 CDSOT236-T12C CDSOT236-T15 CDSOT236-T24
    Text: CHIP DIODES Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team July, 2010 Bourns Diode Products Addition of Second Wafer Fabrication Location and Change to “Green” Compound


    Original     		PDF CD143A-SR2 CD143A-SR3 CDNBS08-SMDA05-6 CDSOT236-T05 CDSOT236-T05C CDSOT236-T12 CDSOT236-T12C CDSOT236-T15 CDSOT236-T15C CDSOT236-T24 SUMITOMO g600 SMDA05-6 CDSOT236-T15C G600 mold compound CDSOT236-T05 CDSOT236-T05C CDSOT236-T12 CDSOT236-T12C CDSOT236-T15 CDSOT236-T24

    Ablebond 84-1*SR4

    Abstract: Ablebond 84-1LMISR4 ablebond 8290 84-1lmisr4 Ablebond SUMITOMO g600 Sumitomo 6730B SP491ECN-L SP3232EEN-L sp26lv431
    Text: PRODUCT CHANGE NOTICE PCN PART NUMBER(S): PCN No.: 09-0911-01 REFER TO ATTACHMENT A DATE: December 7, 2009 PART DESCRIPTION: See www.exar.com LEVEL OF CHANGE: [ ] Level I, Customer Approval. [X ] Level II, Customer Information. PRODUCT ATTRIBUTE AFFECTED:


    Original     		PDF SOICN-14 SOICN-16 6730B-L 84-1LMISR4 Abl691AEN-L/TR SP26LV432CN-L SP26LV432CN-L/TR SP26LV431CN-L SP26LV431CN-L/TR Ablebond 84-1*SR4 Ablebond 84-1LMISR4 ablebond 8290 84-1lmisr4 Ablebond SUMITOMO g600 Sumitomo 6730B SP491ECN-L SP3232EEN-L sp26lv431

    Untitled

    Abstract: No abstract text available
    Text: RELIABILITY REPORT DATE : 10/07/08 QUALITY ENG : PART NUMBER : Dinh Pham MIC5375/5376 : 150mA LNR Regulator Fixed Output Voltages . MIC5377/5378 : 150mA LNR Regulator (Adjustable Output Voltage) QUAL VEHICLE: PACKAGE TYPE : ASSEMBLY LOC D/C # LOT # FAB #


    Original     		PDF MIC5375/5376 150mA MIC5377/5378 MIC5375-1 8A09139MNR MIC5375-2 8A06678MNK MIC5376-2 8A10162MNG

    CEL9220

    Abstract: No abstract text available
    Text: RELIABILITY REPORT DATE: 9/15/2009 QUALITY ENG : PURPOSE: Dinh Pham MIC5205: 150mA Low-Noise LDO Regulator QUAL VEHICLE PACKAGE TYPE ASSEMBLY M/C D/C LOT # FAB LOCATION PROCESS MIC5205 2.9YM5 SOT-23-5L CARSEM CEL9220 0516 2A43078 San Jose BCC MIC5205 3.0YM5


    Original     		PDF MIC5205: 150mA MIC5205 OT-23-5L CEL9220 2A43078 4A44515EA MIC5205BM5 CEL9220

    SM712

    Abstract: SUMITOMO g600 CDNBS08-PLC03-6 CDSOT23-SLVU2 CDSOT23-SM712 G600
    Text: CHIP DIODES Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team April, 2010 Bourns Diode Products Addition of Second Wafer Fabrication Location and Change to “Green” Compliance


    Original     		PDF CDSOT23-SM712 CDNBS08-PLC03-6 CDNBS08-SLVU2 CDSOT23-SLVU2 ESD1011 SM712 SUMITOMO g600 CDNBS08-PLC03-6 CDSOT23-SM712 G600

    CDSOD323-T05C

    Abstract: SUMITOMO g600 ESD1006 CDSOD323-T12C CDSOD323-T12LC CDSOD323-T24 CDSOD323-T24LC CDSOD323-T05 CDSOD323-T08 CDSOD323-T08C
    Text: CHIP DIODES Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team February, 2010 Bourns Diode Products Addition of Second Wafer Fabrication Location and Change to “Green” Compliance


    Original     		PDF CDSOD323-T05 CDSOD323-T05C CDSOD323-T08 CDSOD323-T08C CDSOD323-T12 CDSOD323-T12C CDSOD323-T15 CDSOD323-T15C CDSOD323-T18 CDSOD323-T18C CDSOD323-T05C SUMITOMO g600 ESD1006 CDSOD323-T12C CDSOD323-T12LC CDSOD323-T24 CDSOD323-T24LC CDSOD323-T05 CDSOD323-T08 CDSOD323-T08C

    CDSOD323-T18S

    Abstract: CDSOD323-T12S CDNBS08 CDNBS08-SRDA05-6 CDSOD323-T05SC CDSOD323-T15SC CDSOD323-T08S CDSOT23 SUMITOMO g600 CDSOD323-T08
    Text: CHIP DIODES Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team January, 2010 Bourns Diode Products Addition of Second Wafer Fabrication Location and Support of “Green” Products


    Original     		PDF CDSOD323-T03S CDSOD323-T03SC CDSOD323-T05S CDSOD323-T05SC CDSOD323-T08S CDSOD323-T08SC CDSOD323-T12S CDSOD323-T12SC CDSOD323-T15S CDSOD323-T15SC CDSOD323-T18S CDSOD323-T12S CDNBS08 CDNBS08-SRDA05-6 CDSOD323-T05SC CDSOD323-T15SC CDSOD323-T08S CDSOT23 SUMITOMO g600 CDSOD323-T08

    JESD22-C101

    Abstract: JESD22-A115 MIL-STD-883-2011 0732 g600 G600 mold compound UL flammability test ABLEBOND 8200T Ablestik 8290 SUMITOMO g600 UL JESD22A-115
    Text: 2/27/2008 RELIABILITY REPORT FOR DS1099, Rev A3 8" Maxim Integrated Products 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Don Lipps Staff Reliability Engineer Maxim Integrated Products 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email: [email protected]


    Original     		PDF DS1099, MIL-STD-883-2011 JESD22-C101 JESD22-A115 MIL-STD-883-2011 0732 g600 G600 mold compound UL flammability test ABLEBOND 8200T Ablestik 8290 SUMITOMO g600 UL JESD22A-115

    ABLEBONd 84-1

    Abstract: JESD22-B116 Ablebond 84-1 LMISR4 JESD22-A101 LMISR4 A101 G600 JESD22 9110l
    Text: THYRISTOR SURGE PROTECTORS Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team May 6, 2009 PCN Tracking Number 48 Change from Gold to Copper Wire In 2Q08, Bourns qualified a change to the base metal composition of the wires used to bond overvoltage protection chips to the package terminals of the 8-pin SOP 150 mil package.


    Original     		PDF JESD22 J-STD-020 JESD22-A113 TISP61089HDMR-S TISP8200MDR-S TISP8201MDR-S TISP9110LDMR-S ABLEBONd 84-1 JESD22-B116 Ablebond 84-1 LMISR4 JESD22-A101 LMISR4 A101 G600 JESD22 9110l

    EN4900GC

    Abstract: JESD22-A103 CEL9220HF JESD22-A113 CRM1076 Compound CEL9220HF cel-9220HF cel9220 JESD-22-A113 JESD22-A102
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1007-02 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: DATE: 2-Aug-2010 MEANS OF DISTINGUISHING CHANGED DEVICES:


    Original     		PDF A1007-02 2-Aug-2010 SSOP-28) 2-Nov-2010 JESD22-A113 LDS6000PYGI LDS6000PYGI8 LDS6003PYGI LDS6003PYGI8 EN4900GC JESD22-A103 CEL9220HF CRM1076 Compound CEL9220HF cel-9220HF cel9220 JESD-22-A113 JESD22-A102

    1076ns

    Abstract: sumitomo 1076NS SP3232ECP-L SUMITOMO g600 SP3232ECP SP491ECP-L G600 SP202ECP-L SP202EEP-L SP232ACP-L
    Text: PRODUCT CHANGE NOTICE PCN PART NUMBER(S): PCN No.: 08-0929-01 Refer to Attachment A DATE: September 29, 2008 PART DESCRIPTION: See www.exar.com LEVEL OF CHANGE: [X] Level I, Customer Approval. [ ] Level II, Customer Information. PRODUCT ATTRIBUTE AFFECTED:


    Original     		PDF G0006-6 SP231ACP-L SP491CS-L SP491ECP-L SP491EEP-L SP491ES-L SP202ECP-L SP202EEP-L SP232ACP-L SP232AEP-L 1076ns sumitomo 1076NS SP3232ECP-L SUMITOMO g600 SP3232ECP SP491ECP-L G600 SP202ECP-L SP202EEP-L SP232ACP-L

    6730B-L

    Abstract: Sumitomo 6730B G600 mold compound unisem SUMITOMO g600 G600 SP310ACT-L SP310AET-L SP310ECT SP310ECT-L 6730B
    Text: PRODUCT CHANGE NOTICE PCN PART NUMBER(S): PCN No.: 08-1107-01 Refer to Attachment A DATE: 12/08/08 PART DESCRIPTION: See www.exar.com LEVEL OF CHANGE: [X] Level I, Customer Approval. [ ] Level II, Customer Information. PRODUCT ATTRIBUTE AFFECTED: [ ] [ ]


    Original     		PDF 6730B-L SP310ACT-L SP310AET-L SP310ECT SP310ECT-L SP310EET-L SP385ECT-L SP385EET-L SP312ACT-L SP312AET-L Sumitomo 6730B G600 mold compound unisem SUMITOMO g600 G600 SP310ACT-L SP310AET-L SP310ECT SP310ECT-L 6730B

    EME-G700

    Abstract: EME-G700 datasheet G600 mold compound EME G600 G600 kb-04 7140P EMEG700 G9911-05 Compound EME-G700
    Text: IDT Products : 7140 7140 Product Categories > Multi-Port Devices > Asynchronous Dual-Port RAMs > 5.0V > x8 > 7140 Related Documents Description: 1K x 8 Dual-Port RAM Datasheet Application Note Brochure Additional Information: Slave, Interrupts, Busy Logic


    Original     		PDF 59628687509XA 59628687509YA G9911-05, 7140J 7140P 7140PF EME-G700 EME-G700 datasheet G600 mold compound EME G600 G600 kb-04 EMEG700 G9911-05 Compound EME-G700

    ABLEBONd 84-1

    Abstract: Ablebond 84-1 LMISR4 JESD22-B116 G600 TISP61089HDMR-S MIL-STD-883-2019 A101 B116 JESD22 TISP9110LDMR-S
    Text: THYRISTOR SURGE PROTECTORS Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team May 6, 2009 PCN Tracking Number 48 Change from Gold to Copper Wire In 2Q08, Bourns qualified a change to the base metal composition of the wires used to bond overvoltage protection chips to the package terminals of the 8-pin SOP 150 mil package.


    Original     		PDF JESD22 J-STD-020 JESD22-A113 TISP61089HDMR-S TISP8200MDR-S TISP8201MDR-S TISP9110LDMR-S ABLEBONd 84-1 Ablebond 84-1 LMISR4 JESD22-B116 G600 TISP61089HDMR-S MIL-STD-883-2019 A101 B116 JESD22 TISP9110LDMR-S

    EME-G700

    Abstract: EME-G700 datasheet kb-04 A-0410-02 LCC 48 Compound EME-G700
    Text: IDT Products : 7140 7140 Product Categories > Multi-Port Devices > Asynchronous Dual-Port RAMs > 5.0V > x8 > 7140 Related Documents Description: 1K x 8 Dual-Port RAM Datasheet Application Note Brochure Additional Information: Slave, Interrupts, Busy Logic


    Original     		PDF 59628687509YA 59628687510YA G9911-05, 7140J 7140P 7140PF EME-G700 EME-G700 datasheet kb-04 A-0410-02 LCC 48 Compound EME-G700