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    dn729

    Abstract: P2254 P22154 P22264 P22328 P2252
    Text: RELIABILITY MONITOR DS1210S JAN '98 MONITOR-HYUNDAI DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1210 C1 9750 DN738347AAA 16 PIN SOIC HYUNDAI-KOREA HEI PROCESS Single Poly, Single Metal 3.0 µm POCL3 reFlow (3um only); FLASH E2PROM (all other tech. numbers)


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    PDF DS1210S DS1210 DN738347AAA P21776 P22233 P22310 P22312 P22230 P22309 P22311 dn729 P2254 P22154 P22264 P22328 P2252

    P21096

    Abstract: 208-MIL P2075
    Text: RELIABILITY MONITOR DS1000M-25 NOV.'97 MONITOR-OMEDATA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1000 E3 9727 DD711504ABA 8 PIN PDIP OMEDATA PROCESS Single Poly, Single Metal 1.2 µ Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7 β: 1


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    PDF DS1000M-25 DS1000 DD711504ABA P20931 P20962 P21300 P21353 P21354 P21355 P21356 P21096 208-MIL P2075

    P22328

    Abstract: P22157 p22230 mar 9746
    Text: RELIABILITY MONITOR PROCESS: 0.8 µm Double Poly, Single Metal STRESS: INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS2153 A7 JUN '98 P22294 9740 ANAM-KOREA AICL DN725561AAB 44 PIN PLCC 48 237 DS2153Q A7 MAR '98 P22292


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    PDF DS2153 DS2153Q P22294 P22292 P22556 DN725561AAB DN720030AAB DN733468AAB P22328 P22157 p22230 mar 9746

    P22157

    Abstract: P21637 9744 P2220 P22200 P22123 208mil
    Text: RELIABILITY MONITOR PROCESS: 0.8 µm Double Poly, Single Metal STRESS: INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS2153 A7 JUN '98 P22294 9740 ANAM-KOREA AICL DN725561AAB 44 PIN PLCC 48 237 DS2153Q A7 MAR '98 P22292


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    PDF DS2153 DS2153Q P22294 P22292 DN725561AAB DN720030AAB DS1302 DS1315 DS17485 P22157 P21637 9744 P2220 P22200 P22123 208mil

    P22243

    Abstract: DS1267E DN7-36 P22154 P21256
    Text: RELIABILITY MONITOR DS1000M-25 FEB '98 MONITOR-OMEDATA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1000 E3 9750 DD740614ABA 8 PIN PDIP OMEDATA PROCESS Single Poly, Single Metal 1.2 µ Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7 β: 1


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    PDF DS1000M-25 DS1000 DD740614ABA P21467 P21488 P21893 P21964 P21965 P21966 P21967 P22243 DS1267E DN7-36 P22154 P21256

    P2215

    Abstract: P22102 P22372 P22121 40Pn B1 9742 P22071 dallas date code ds1230 208mil P22403
    Text: RELIABILITY MONITOR STRESS: TEMP CYCLE CONDITIONS: -40 TO 85°C MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE READ POINT QTY FAIL DS2250T Y JUN 98 P22125 9814 DALLAS 101397 SIP STICK 100 11 DS2250T Y JUN 98 P22125 9814 DALLAS


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    PDF DS2250T P22125 DS1210 DS1210S P2215 P22102 P22372 P22121 40Pn B1 9742 P22071 dallas date code ds1230 208mil P22403

    h 9740

    Abstract: dallas date code ds12887 P21256 9735 h P21490 P2070 P22149 B1 9742 dallas date code DS80320
    Text: RELIABILITY MONITOR STRESS: TEMP CYCLE CONDITIONS: -40 TO 85°C MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE READ POINT QTY FAIL DS2250 na DEC 97 P21100 9743 DALLAS 096841 SIP STICK 100 11 DS2250 na DEC 97 P21100 9743 DALLAS


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    PDF DS2250 DS2290 P21100 P20430 DS80320 P20461 h 9740 dallas date code ds12887 P21256 9735 h P21490 P2070 P22149 B1 9742 dallas date code

    P21256

    Abstract: P22102 P22154 P22149 ds1302 dallas h 9740 P22021 P21308
    Text: RELIABILITY MONITOR STRESS: TEMP CYCLE CONDITIONS: -40 TO 85°C MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE READ POINT QTY FAIL DS2250T Y JUN 98 P22125 9814 DALLAS 101397 SIP STICK 100 11 DS2250T Y JUN 98 P22125 9814 DALLAS


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    PDF DS2250T P22125 DS1000 DS1210 P21256 P22102 P22154 P22149 ds1302 dallas h 9740 P22021 P21308

    DS80320

    Abstract: P21091
    Text: RELIABILITY MONITOR PROCESS: 0.8 µm Double Poly, Single Metal STRESS: INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS2153Q A7 DEC.'97 P21120 9730 ANAM-KOREA AICL DN718550AAE 44 PIN PLCC 48 233 DS2153Q A7 MAR '98 P22292


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    PDF DS2153Q P21120 P22292 DN718550AAE DN720030AAB P21171 DS80320 P21091