FTR-F4AK024T
Abstract: D300N relay tv3 FTR-F4AK012T D300 F4AK012T tv3 relay
Text: FTR-F4 SERIES POWER RELAY 2 POLE 5A/TV-3 RATED COMPACT TYPE FTR-F4 Series RoHS compliant n FEATURES Small high density type relay 288mm2 save 24% compared to VB l UL/CSA TV-3 rating l Insulation distance: minimum 6 mm between coil and contacts IEC65 Dielectric strength: 4 KVAV
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288mm2
IEC65)
0437L2
012jitsu
FTR-F4AK024T
D300N
relay tv3
FTR-F4AK012T
D300
F4AK012T
tv3 relay
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takamisawa relay tv-3
Abstract: FTR-F4AK024T takamisawa relay vb 24 12VDC TV-3 takamisawa takamisawa 24vdc coil relay takamisawa relay 12VDC 4 pole takamisawa relay takamisawa relay 24VDC takamisawa 9vdc takamisawa relay 12VDC vb
Text: FUJITSU TAKAMISAWA COMPONENT CATALOG POWER RELAY 2 POLE 5A/TV-3 RATED COMPACT TYPE FTR-F4 SERIES • FEATURES ● ● ● ● ● ● Small high density type relay 288mm2 save 24% compared to VB UL/CSA TV-3 rating Insulation distance: minimum 6 mm between coil and
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288mm2
IEC65)
takamisawa relay tv-3
FTR-F4AK024T
takamisawa relay vb 24
12VDC TV-3 takamisawa
takamisawa 24vdc coil relay
takamisawa relay 12VDC 4 pole
takamisawa relay
takamisawa relay 24VDC
takamisawa 9vdc
takamisawa relay 12VDC vb
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Untitled
Abstract: No abstract text available
Text: White Electronic Designs WEDPS512K32V-XBX 512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE FEATURES Access Times of 12, 15, 17, 20ns Low Power Data Retention 'L' Option Packaging TTL Compatible Inputs and Outputs • 143 PBGA, 16mm x 18mm, 288mm2 Fully Static Operation:
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WEDPS512K32V-XBX
512Kx32
288mm2
512Kx32;
1Mx16
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C805A
Abstract: No abstract text available
Text: FTR-F4 SERIES POWER RELAY 2 POLE 5A/TV-3 RATED COMPACT TYPE FTR-F4 Series RoHS compliant n FEATURES Small high density type relay 288mm2 save 24% compared to VB l UL/CSA/VDE/SEMKO/CQC approved l Insulation distance: minimum 6 mm between coil and contacts IEC60065
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288mm2
IEC60065
0437L2
C805A
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VDE 0435 time relay
Abstract: FTR-F4AK024T CQC 24vdc relay datasheet F4AK012T FTR-F4AK012T CQC 24vdc relay FTR-F4AK005T FTR-F4AK006T FTR-F4AK009T IEC60065
Text: FTR-F4 SERIES POWER RELAY 2 POLE 5A/TV-3 RATED COMPACT TYPE FTR-F4 Series RoHS compliant n FEATURES Small high density type relay 288mm2 save 24% compared to VB l UL/CSA/VDE/SEMKO/CQC approved l Insulation distance: minimum 6 mm between coil and contacts IEC60065
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PDF
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288mm2
IEC60065
0437L2
VDE 0435 time relay
FTR-F4AK024T
CQC 24vdc relay datasheet
F4AK012T
FTR-F4AK012T
CQC 24vdc relay
FTR-F4AK005T
FTR-F4AK006T
FTR-F4AK009T
IEC60065
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F4AK012T
Abstract: 250VA150W F4AK RELAYS FUJITSU relay tv3 FTR-F4AK012T FUJITSU RELAY led diode partnumber IEC60065 ftr-f4
Text: FTR-K1 SERIES POWER RELAY 2 POLE 5A/TV-3 RATED COMPACT TYPE FTR-F4 Series n FEATURES Small high density type relay 288mm2 save 24% compared to VB l UL/CSA/VDE/SEMKO/CQC approved l Insulation distance: minimum 6 mm between coil and contacts IEC60065 Dielectric strength: 4 KV
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288mm2
IEC60065
F4AK012T
250VA150W
F4AK
RELAYS FUJITSU
relay tv3
FTR-F4AK012T
FUJITSU RELAY
led diode partnumber
IEC60065
ftr-f4
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WEDPS512K32V-XBX
Abstract: Theta JB bga thermal resistance max2014
Text: White Electronic Designs WEDPS512K32V-XBX 512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE FEATURES Access Times of 12, 15, 17, 20ns Low Power Data Retention 'L' Option Packaging TTL Compatible Inputs and Outputs • 143 PBGA, 16mm x 18mm, 288mm2 Fully Static Operation:
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WEDPS512K32V-XBX
512Kx32
288mm2
512Kx32;
1Mx16
WEDPS512K32V-XBX
Theta JB
bga thermal resistance
max2014
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FTR-F4AK024T
Abstract: relay tv3 F4AK012T FTR-F4AK012T 250VA D300
Text: POWER RELAY 2 POLE 5A/TV-3 RATED COMPACT TYPE FTR-F4 Series • FEATURES ● ● ● ● ● ● Small high density type relay 288mm2 save 24% compared to VB UL/CSA TV-3 rating Insulation distance: minimum 6 mm between coil and contacts IEC65 Dielectric strength: 4 KVAV
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Original
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PDF
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288mm2
IEC65)
FTR-F4AK024T
relay tv3
F4AK012T
FTR-F4AK012T
250VA
D300
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FTR-F4AK024T
Abstract: No abstract text available
Text: FTR-F4 SERIES POWER RELAY 2 POLE 5A/TV-3 RATED COMPACT TYPE FTR-F4 Series RoHS compliant • FEATURES ● ● ● ● ● ● ● Small high density type relay 288mm2 save 24% compared to VB UL/CSA TV-3 rating Insulation distance: minimum 6 mm between coil and
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Original
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PDF
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288mm2
IEC65)
0437L2
FTR-F4AK024T
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WEDPS512K32V-XBX
Abstract: No abstract text available
Text: White Electronic Designs WEDPS512K32V-XBX 512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE FEATURES Access Times of 12, 15, 17, 20ns Low Power Data Retention 'L' Option Packaging TTL Compatible Inputs and Outputs • 143 PBGA, 16mm x 18mm, 288mm2 Fully Static Operation:
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WEDPS512K32V-XBX
512Kx32
288mm2
512Kx32;
1Mx16
WEDPS512K32V-XBX
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p 602
Abstract: WEDPS512K32-XBX bga thermal resistance
Text: White Electronic Designs WEDPS512K32-XBX 512Kx32 SRAM MULTI-CHIP PACKAGE FEATURES Commercial, Industrial and Military Temperature Ranges Access Times of 12, 15, 17, 20, ns Packaging TTL Compatible Inputs and Outputs • 16mm x 18mm, 143 PBGA 5V Power Supply
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WEDPS512K32-XBX
512Kx32
512Kx32,
1Mx16
25-55ns
p 602
WEDPS512K32-XBX
bga thermal resistance
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Untitled
Abstract: No abstract text available
Text: WEDPS512K32V-XBX 512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE FEATURES Low Power Data Retention 'L' Option Access Times of 12, 15, 17, 20ns TTL Compatible Inputs and Outputs Packaging Fully Static Operation: 2 • 143 PBGA, 16mm x 18mm, 288mm
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WEDPS512K32V-XBX
512Kx32
288mm
512Kx32;
1Mx16
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Untitled
Abstract: No abstract text available
Text: 512K x 32 SRAM Multi-Chip Package Optimum Density and Performance in one Package WEDPS512K32-XBX* WEDPS512K32V-XBX* Performance Features • • • • • Access Times of 12ns, 15ns and 20ns. WEDPS512K32-XBX • +5.0V ±10% Power Supply WEDPS512K32V-XBX
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WEDPS512K32-XBX*
WEDPS512K32V-XBX*
WEDPS512K32-XBX
WEDPS512K32V-XBX
288mm2
WEDPS512K32-XBX
MCP007
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288mm2
Abstract: WEDPS512K32V-XBX WEDPS512K32-XBX
Text: 512K x 32 SRAM Multi-Chip Package Optimum Density and Performance in one Package WEDPS512K32-XBX* WEDPS512K32V-XBX* • • CE • Access Times of 12ns, 15ns and 20ns. WEDPS512K32-XBX • +5.0V ±10% Power Supply WEDPS512K32V-XBX • +3.3V ±5% Power Supply
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WEDPS512K32-XBX*
WEDPS512K32V-XBX*
WEDPS512K32-XBX
WEDPS512K32V-XBX
288mm2
WED2EL728S-BC
MCP007
288mm2
WEDPS512K32V-XBX
WEDPS512K32-XBX
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WEDPS512K32-XBX
Abstract: bga thermal resistance
Text: WEDPS512K32-XBX White Electronic Designs 512Kx32 SRAM MULTI-CHIP PACKAGE FEATURES Access Times of 12, 15, 17, 20, ns Packaging • 16mm x 18mm, 143 PBGA Organized as 512Kx32, User Configurable as 1Mx16 or 2Mx8 Commercial, Industrial and Military Temperature
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WEDPS512K32-XBX
512Kx32
512Kx32,
1Mx16
25-55ns
WEDPS512K32-XBX
bga thermal resistance
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Untitled
Abstract: No abstract text available
Text: WEDPS512K32-XBX 512Kx32 SRAM MULTI-CHIP PACKAGE FEATURES Access Times of 12, 15, 17, 20, ns TTL Compatible Inputs and Outputs Packaging 5V Power Supply Low Power CMOS • 16mm x 18mm, 143 PBGA Organized as 512Kx32, User Configurable as 1Mx16 or
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WEDPS512K32-XBX
512Kx32
512Kx32,
1Mx16
25-55ns
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