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    WAFER FAB CONTROL PLAN Search Results

    WAFER FAB CONTROL PLAN Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    SSM6J808R Toshiba Electronic Devices & Storage Corporation MOSFET, P-ch, -40 V, -7 A, 0.035 Ohm@10V, TSOP6F, AEC-Q101 Visit Toshiba Electronic Devices & Storage Corporation
    SSM6K819R Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 100 V, 10 A, 0.0258 Ohm@10V, TSOP6F, AEC-Q101 Visit Toshiba Electronic Devices & Storage Corporation
    SSM6K809R Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 60 V, 6.0 A, 0.036 Ohm@10V, TSOP6F, AEC-Q101 Visit Toshiba Electronic Devices & Storage Corporation
    SSM6K504NU Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 30 V, 9.0 A, 0.0195 Ohm@10V, UDFN6B, AEC-Q101 Visit Toshiba Electronic Devices & Storage Corporation
    SSM3K361R Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 100 V, 3.5 A, 0.069 Ohm@10V, SOT-23F, AEC-Q101 Visit Toshiba Electronic Devices & Storage Corporation

    WAFER FAB CONTROL PLAN Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    intersil DATE CODE MARKING

    Abstract: pin diagram details of CD4015 y2010 R4573 B TA3842 wafer fab control plan TA388* transistor ESD test plan ta5142 R4573
    Text: Status of Document is: RELEASED Effective from: 07-AUG-2000 09:48:23 to Date Printed: 07-Aug-2000 10:33:38 Controlled Document QML QUALITY MANAGEMENT PLAN Title: QML QUALITY MANAGEMENT PLAN Specification Type: DOCS Specification Number :999015 Issue :24 Page :1 of 100


    Original     		PDF 07-AUG-2000 28-SEP-1995 03-NOV-1995 21-SEP-1995 28-SEP-1995 intersil DATE CODE MARKING pin diagram details of CD4015 y2010 R4573 B TA3842 wafer fab control plan TA388* transistor ESD test plan ta5142 R4573

    APPLICATION CD4094

    Abstract: ta3842 tA 1507 989XXXX icl7667 die TA384 TA5072 ta1313 TA07667B 51122A
    Text: Status of Document is:RELEASED Effective from: 19-SEP-1997 14:23:42 to Date Printed: 09/24/97 7:48 AM Controlled Document SECTION 3.0 QML TECHNOLOGY SPECIFIC GENERAL This section of the Harris QM Plan provides a description of the database systems used to control the


    Original     		PDF 19-SEP-1997 APPLICATION CD4094 ta3842 tA 1507 989XXXX icl7667 die TA384 TA5072 ta1313 TA07667B 51122A

    EPIC-1S

    Abstract: WAFER SN74ACT245 wafer fab control plan
    Text: TEXAS INSTRUMENTS Initial Notification for the Planned 150mm Diameter Wafer Qualification of the Sherman, Texas Wafer Fab December 8, 1998 Abstract The Texas Instruments Wafer Fabrication Facility in Sherman, Texas SFAB plans to convert the wafer diameter from 125mm to 150mm for the EPIC-1S wafer fabrication technology. The product


    Original     		PDF 150mm 125mm SN74ACT245 60sec EPIC-1S WAFER wafer fab control plan

    wafer fab control plan

    Abstract: SPC3 SPC2 LINEAR TECHNOLOGY flowchart
    Text: STATISTICAL PROCESS CONTROL STATISTICAL PROCESS CONTROL Linear Technology Corporation LTC has an active Statistical Process Control (SPC) system. It operates via the interrelated mechanisms of: a structure, control charts with built-in contingency action plans, operational area


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    wafer fab control plan

    Abstract: LINEAR TECHNOLOGY flowchart
    Text: STATISTICAL PROCESS CONTROL Linear Technology Corporation LTC has an active Statistical Process Control (SPC) system. It operates via the interrelated mechanisms of: a structure, control charts with built-in contingency action plans, operational area documentation (flowcharts and control plan details), an


    Original     		PDF

    statistical process control

    Abstract: wafer fab control plan pareto process control system spc data sheet SPC Technology TIONA wafer fab control SPC-2 SPC-3
    Text: STATISTICAL PROCESS CONTROL STATISTICAL PROCESS CONTROL Linear Technology Corporation LTC has an active Statistical Process Control (SPC) system. It operates via the interrelated mechanisms of: a structure, control charts with built-in contingency action plans, operational area


    Original     		PDF

    DAC8412

    Abstract: TS16949
    Text: 1 PCN PCN #: 06_0126 Title: DAC8412/3 redesign and fab process change. Date Published: November 3, 2006 Type: Device Part Number: DAC8412/3 Proposed Change: ADI sent customers an advance PCN 05_0126 dated December 23, 2005 outlining plans to transfer processes from ADI's Silicon


    Original     		PDF DAC8412/3 DAC8412/3 ISO9001 ISO14001 ISO/TS16949 MIL-PRF-38535) RQR03601, DAC8412 TS16949

    ta3842

    Abstract: APPLICATION CD4094 CD40110 equivalent cd40110 211026001 87XXXX alps-rh HA-5320 ta5072 TA388
    Text: Status of Document is:RELEASED Effective from: 02-JUN-1997 08:18:36 to Date Printed: 06/09/97 6:43 AM Controlled Document SECTION 3.0 QML TECHNOLOGY SPECIFIC GENERAL This section of the Harris QM Plan provides a description of the database systems used to control the


    Original     		PDF 02-JUN-1997 ta3842 APPLICATION CD4094 CD40110 equivalent cd40110 211026001 87XXXX alps-rh HA-5320 ta5072 TA388

    M38510 10102BCA

    Abstract: SCX6206 marking code E5 SMD ic jm38510/10101bga SCX6B48AIS SNJ54LS165J JM38510/30004bca JM38510/10102BCA JM38510/10102BIA 946DMQB
    Text: N ENHANCED SOLUTIONS DESIGN/PROCESS CHANGE NOTIFICATION formerly Military & Aerospace Division PCN Nr: 2000 Listing GIDEP Nr: GIDEP Category: Issued: 01/24/2000 TRB Nr: Product ID (Description): Proposed Date of Change: Description of Change: Effect of Change:


    Original     		PDF LM185BYH2 LM185BYH1 LM185E-1 LM185H-1 LM185WG-1 LM185H-2 M38510 10102BCA SCX6206 marking code E5 SMD ic jm38510/10101bga SCX6B48AIS SNJ54LS165J JM38510/30004bca JM38510/10102BCA JM38510/10102BIA 946DMQB

    TGC3000

    Abstract: wafer fab control plan ASIC TGC2000 Qual wafer fab control TEXAS INSTRUMENTS, die attach TGB2000 F642790
    Text: ASIC QRA / PROCESS & PACKAGE QUAL METHODOLOGY Design Libraries Specs Qual Cycle Time “GENERIC” QUALIFICATION Die Sizes Package Pincounts & Types Assembly Locations Wafer Fab Locations Wafer Fab Processes Texas Instruments - ASIC CQE Qual By Similarity


    Original     		PDF

    54ACT3301

    Abstract: 54ACT3301 die national semiconductor 54ls123j JM38510/30002BCA M38510/10304 5962R8773901VCA 01001BEA DM54LS244J/883 dm54ls74j 54154J
    Text: ENHANCED SOLUTIONS DESIGN/PROCESS CHANGE NOTIFICATION formerly Military & Aerospace Division PCN Nr: 2001 Listing      Issued: 01/09/2001   Product ID (Description): Proposed Date of Change: Description of Change: Effect of Change:


    Original     		PDF MA2001-01 MA2001-02 MA2001-03 MA2001-04 MA2001-05 MA2001-06 04/26/Spec H1A0134A LMD18200-2D-QV LMD18200-2D/883 54ACT3301 54ACT3301 die national semiconductor 54ls123j JM38510/30002BCA M38510/10304 5962R8773901VCA 01001BEA DM54LS244J/883 dm54ls74j 54154J

    LM723 pin details

    Abstract: LM723 application notes LM723 application note M38510-10104 lm723 54L73 DS26LV31 54L04 application lm723 945DM
    Text: ENHANCED SOLUTIONS DESIGN/PROCESS CHANGE NOTIFICATION formerly Military & Aerospace Division PCN Nr: 2002 Listing GIDEP Nr: GIDEP Category: Issued: 01/09/2002 TRB Nr: Product ID (Description): Proposed Date of Change: Description of Change: Effect of Change:


    Original     		PDF

    apqp MANUAL

    Abstract: quality acceptance plan wafer fab control plan FORD apqp manual Ford in-process quality ford ppap delco ic MATERIAL CONTROL PROCEDURE PPAP MANUAL Ford Part Number
    Text: Status of Document is:RELEASED Effective from: 07-NOV-1995 17:36:32 to Date Printed: 09/03/97 6:30 AM 1.0 Controlled Document Purpose The purpose of this document is to define the procedure for implementing Control Plans for integrated circuits designed for the automotive customers Chrysler, Ford or General


    Original     		PDF 07-NOV-1995 QOP-SMV-002 QOP-SMV-004 95QP004 apqp MANUAL quality acceptance plan wafer fab control plan FORD apqp manual Ford in-process quality ford ppap delco ic MATERIAL CONTROL PROCEDURE PPAP MANUAL Ford Part Number

    Evaluating pHEMT Process Improvements Using Wafer Level RF Tests

    Abstract: No abstract text available
    Text: Evaluating pHEMT Process Improvements Using Wafer Level RF Tests James Oerth, Stephen Cousineau, and Sushila Singh Skyworks Solutions, Inc 20 Sylvan Road, Woburn, MA, 01801, USA Tel: 781 376-3076, Email: [email protected] Keywords: RF test, pHEMT, process improvement, harmonics, IMD


    Original     		PDF

    PCF75652W

    Abstract: RFD14N05LSM9A FAIRCHILD SMD MARKING Fairchild wafer fab pcf7 100C AECQ101 HUF75652G3 JESD22-A102 HUF766
    Text: Date Created: 12/8/2003 Date Issued: 1/26/2004 PCN # 20034903 FORECAST CHANGE NOTIFICATION This is to inform you that a design and/or process change will be made to the following product s . This notification is for your information and concurrence. This is a preliminary notification. A final PCN will


    Original     		PDF HUF75545P3 HUF75545S3ST HUF75631SK8T HUF75639S3 HUF75645P3 HUF75652G3 HUF76419D3ST HUF76419S3ST HUF76429S3ST HUFA76429D3 PCF75652W RFD14N05LSM9A FAIRCHILD SMD MARKING Fairchild wafer fab pcf7 100C AECQ101 HUF75652G3 JESD22-A102 HUF766

    CY7B991-LMB

    Abstract: CY7B9910 CY7B9920 EME-6300H CY7C9910
    Text: Qualification Report May, 1995 QTP# 95021 Version 1.0 PROGRAMMABLE SKEWCLOCK BUFFER CY7B9910-SC CY7B9920-SC Programable Skew Clock Buffer Driver TTL Programable Skew Clock Buffer Driver (CMOS) PRODUCT DESCRIPTION (for qualification) Information provided in this document is intended for generic qualification and technically describes the Cypress part supplied:


    Original     		PDF CY7B9910-SC CY7B9920-SC CY7B9910 CY7B9920 7B991A0/46 CY7B991/CY7B992/CY7B9910/CY7B9920 24-pins CY7B9910/9920 -4400V CY7B991-LMB CY7B9920 EME-6300H CY7C9910

    7C322

    Abstract: HARRIS DIP 24PIN mos die PALC22V10D 7C322D EME-6300H 7C3221
    Text: Qualification Report June 1995, Version 1.0 MATRA HARRIS FAB FOR PALC22V10D PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part supplied: Marketing Part #:


    Original     		PDF PALC22V10D 7C3221E 7C322D 24-pin 300-mil -2200V 7C322 HARRIS DIP 24PIN mos die PALC22V10D 7C322D EME-6300H 7C3221

    INCOMING RAW MATERIAL INSPECTION procedure

    Abstract: INCOMING RAW MATERIAL INSPECTION plate INCOMING RAW MATERIAL INSPECTION procedure ionograph raw material control log sheet INCOMING RAW MATERIAL INSPECTION chart INCOMING RAW MATERIAL INSPECTION method RAW MATERIAL INSPECTION procedure INCOMING RAW MATERIAL INSPECTIONs visual inspection of raw materials
    Text: QUALITY ASSURANCE ASSURANCE PROGRAM PROGRAM QUALITY At Linear Technology Corporation LTC our overriding commitment is to achieve excellence in Quality, Reliability and Service (QRS) and total customer satisfaction. We interpret the word “excellence” to mean delivering products that consistently exceed all the requirements and


    Original     		PDF

    INCOMING RAW MATERIAL INSPECTION

    Abstract: INCOMING RAW MATERIAL INSPECTION procedure plate INCOMING RAW MATERIAL INSPECTION procedure INCOMING RAW MATERIAL flowchart raw material control log sheet INCOMING RAW MATERIAL program curve tracer INCOMING RAW MATERIAL specification ESD test plan plasma tv circuit diagram
    Text: QUALITY ASSURANCE PROGRAM QUALITY ASSURANCE PROGRAM At Linear Technology Corporation LTC our overriding commitment is to achieve excellence in Quality, Reliability and Service (QRS) and total customer satisfaction. We interpret the word “excellence” to mean delivering products that consistently exceed all the requirements and


    Original     		PDF

    INCOMING RAW MATERIAL INSPECTION checklist

    Abstract: INCOMING RAW MATERIAL INSPECTION procedure STORES RECEIVED RAW MATERIAL CHECK LIST INCOMING RAW MATERIAL INSPECTION INCOMING RAW MATERIAL INSPECTION method raw material control log sheet INCOMING RAW MATERIAL flowchart INCOMING RAW MATERIAL INSPECTION chart plate INCOMING RAW MATERIAL INSPECTION procedure INCOMING RAW MATERIAL INSPECTIONs
    Text: QUALITY ASSURANCE PROGRAM QUALITY ASSURANCE PROGRAM At Linear Technology Corporation LTC our overriding commitment is to achieve excellence in Quality, Reliability and Service (QRS) and total customer satisfaction. We interpret the word “excellence” to mean delivering products that consistently exceed all the requirements and


    Original     		PDF

    508 531 02 48

    Abstract: SN74ABT2245
    Text: TEXAS INSTRUMENTS Final Notification for the 200mm Diameter Wafer Qualification of the Freising, Germany Wafer Fab June 27, 1997 Abstract As previously notified in May by PCN 5300, the Texas Instruments Wafer Fabrication Facility in Freising, Germany FFAB has qualified the convertion of the wafer diameter from 150mm to 200mm


    Original     		PDF 200mm 150mm 200mm 150mm, 508 531 02 48 SN74ABT2245

    7C322d

    Abstract: D243B EME-6300H PALC22V10D
    Text: QUALIFICATION REPORT April 1995, QTP#93352/94071, Version 1.0 FLASH ERASABLE CMOS PLD 6" CONVERSION PALC22V10D PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part supplied:


    Original     		PDF PALC22V10D 7C322D -4400V 200mA 22V10D 7C322d D243B EME-6300H PALC22V10D

    44CR80S

    Abstract: Smart 700 SIEMENS ford siemens 1120 siemens relays Siemens SLE "electronic purse"
    Text: SPECTRUM North Tyneside wafer fab forges ahead: From ships to chips The new £1.1 billion $1.8 billion microchip plant being built by Siemens Microelectronics Ltd at North Tyneside in northeast England reached a new milestone on February 15 with the first integrated run on


    Original     		PDF 16M-bit 44CR80S Smart 700 SIEMENS ford siemens 1120 siemens relays Siemens SLE "electronic purse"

    up board exam date sheet 2012

    Abstract: 2012 exam date sheet up board block diagram automated welding machine transistor mark code 3015 case board 2012 exam dates INCOMING RAW MATERIAL INSPECTION INCOMING RAW MATERIAL INSPECTION data sheet INCOMING RAW MATERIAL INSPECTION procedure up board exam 2012 date sheet of 12 class dc welding machine circuit diagram
    Text: RELIABILITY ASSURANCE PROGRAM INTRODUCTION In 1981 Linear Technology Corporation was founded with the intention of becoming a world leader in high performance analog semiconductors. To achieve this goal Linear Technology Corporation committed itself to consistently meet its customers’ needs in four areas:


    Original     		PDF MIL-STD-883 5000ppm up board exam date sheet 2012 2012 exam date sheet up board block diagram automated welding machine transistor mark code 3015 case board 2012 exam dates INCOMING RAW MATERIAL INSPECTION INCOMING RAW MATERIAL INSPECTION data sheet INCOMING RAW MATERIAL INSPECTION procedure up board exam 2012 date sheet of 12 class dc welding machine circuit diagram