K612
Abstract: underfill FR4 epoxy dielectric constant 3.2 Dielectric Constant Silicon Nitride K810 FR4 substrate height and thickness ltcc chip fine line bga thermal cycling reliability
Text: Bourns Microelectronic Modules Packaging Solutions Device Mounting Technology Surface Mount Technology Surface mounting is still the most common and economical approach for many applications. Bourns® Microelectronic Module products offer the latest in surface mount technology:
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2M/MM0405
K612
underfill
FR4 epoxy dielectric constant 3.2
Dielectric Constant Silicon Nitride
K810
FR4 substrate height and thickness
ltcc chip
fine line bga thermal cycling reliability
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Untitled
Abstract: No abstract text available
Text: RF Components 1 FSMS0210D1, Module Spec • Scope • This specification applies to the intermediate filter for CDMA systems. ■ Features • • • Low loss intermediate filter for mobile telephone CDMA systems. Ceramic base material HTCC for Surface Mount Technology (SMD).
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FSMS0210D1,
38MHz
2500E6
0500E6
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Untitled
Abstract: No abstract text available
Text: RF Components 1 FSMS0210D6, Module Spec • Scope • This specification applies to the intermediate filter for CDMA systems. ■ Features • • • Low loss intermediate filter for mobile telephone CDMA systems. Ceramic base material HTCC for Surface Mount Technology (SMD).
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FSMS0210D6,
38MHz
13MHz
63MHz
33MHz
43MHz
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Untitled
Abstract: No abstract text available
Text: RF Components 1 FSRS1575B2, Module Spec • Scope • This specification applies to the low loss GPS Rx filter. ■ Features • • • Low loss Rx filter for GPS systems. Ceramic base material HTCC for Surface Mount Technology (SMD). Reliable Performance.
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FSRS1575B2,
FSRS1575B2)
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8904C-F delta
Abstract: S0183C1 20/8904C-F delta max 1786 smd FSMS0183C1 smd marking m4
Text: RF Components 1 FSMS0183C1, Module Spec • Scope • This specification applies to the intermediate filter for CDMA systems. ■ Features • • • Low loss intermediate filter for mobile telephone CDMA systems. Ceramic base material HTCC for Surface Mount Technology (SMD).
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FSMS0183C1,
60MHz
0000E5
2500E6
0500E6
8904C-F delta
S0183C1
20/8904C-F delta
max 1786 smd
FSMS0183C1
smd marking m4
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FSMS0085G4
Abstract: smd marking m4 S0085G
Text: RF Components 1 FSMS0085G4, Module Spec • Scope • This specification applies to the intermediate filter for CDMA Cellular systems. ■ Features • • • Low loss intermediate filter for mobile telephone CDMA (Cellular) systems. Ceramic base material (HTCC) for Surface Mount Technology (SMD).
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FSMS0085G4,
38MHz
38MHz)
140E3
FSMS0085G4
smd marking m4
S0085G
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s0085g2
Abstract: FSMS0085G2 marking smd m7 S0085G 40938 CE5C J-54 MAX 8038 lg 8838
Text: RF Components 1 FSMS0085G2, Module Spec • Scope • This specification applies to the intermediate filter for CDMA Cellular systems. ■ Features • • • Low loss intermediate filter for mobile telephone CDMA (Cellular) systems. Ceramic base material (HTCC) for Surface Mount Technology (SMD).
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FSMS0085G2,
38MHz
38MHz)
s0085g2
FSMS0085G2
marking smd m7
S0085G
40938
CE5C
J-54
MAX 8038
lg 8838
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S0085F6
Abstract: No abstract text available
Text: RF Components 1 FSMS0085F6, Module Spec • Scope • This specification applies to the intermediate filter for CDMA Cellular systems. ■ Features • • • Low loss intermediate filter for mobile telephone CDMA (Cellular) systems. Ceramic base material (HTCC) for Surface Mount Technology (SMD).
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FSMS0085F6,
38MHz
38MHz)
S0085F6
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Untitled
Abstract: No abstract text available
Text: RF Components 1 FSRS0836H1, Module Spec • Scope • This specification applies to the low loss Tx filter for Cellular AMPS/CDMA systems. ■ Features • • • Low loss Tx filter for mobile telephone CDMA / AMPS systems. Ceramic base material (HTCC) for Surface Mount Technology (SMD).
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FSRS0836H1,
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baw 62 ph
Abstract: saw 881.5mhz
Text: RF Components 1 FSRS0881H1, Module Spec • Scope • This specification applies to the low loss Rx filter for Cellular AMPS/CDMA systems. ■ Features • • • Low loss Rx filter for mobile telephone CDMA / AMPS systems. Ceramic base material (HTCC) for Surface Mount Technology (SMD).
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FSRS0881H1,
FSRS0881H1)
baw 62 ph
saw 881.5mhz
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smd transistor marking 12W
Abstract: 15j 3kv Carbon Layer resistor 0.5W 2410 smd fuse 1.5A SMD resistors 1K ohm - 0.25W 1 1206 AEC Make Ceramic disc Capacitor datasheet glass transponder chip bussed resistors 100 ohm - 0.25W per element MARKING WF smd sot23 AEC-Q200 BEADS FILTER
Text: Leaded Resistors Surface Mount Resistors The industryʼs broadest line of leaded resistors and networks includes designs with various material composition and structure for use in general purpose, precision, anti-surge, high voltage, high resistance applications.
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100x100x100mm
smd transistor marking 12W
15j 3kv
Carbon Layer resistor 0.5W
2410 smd fuse 1.5A
SMD resistors 1K ohm - 0.25W 1 1206
AEC Make Ceramic disc Capacitor datasheet
glass transponder chip
bussed resistors 100 ohm - 0.25W per element
MARKING WF smd sot23
AEC-Q200 BEADS FILTER
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5BA DIODE
Abstract: No abstract text available
Text: SiC SCHOTTKY DIODE SML01SC06D3A/SML01SC06D3B • • • • • • • Low Leakage Fast Switching Low Forward Voltage Hermetic Ceramic Surface Mount Package Suitable for general purpose, switching applications. Space Level and High-Reliability Screening Options Available
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SML01SC06D3A/SML01SC06D3B
SML01SC06D3A-JQRS
5BA DIODE
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Untitled
Abstract: No abstract text available
Text: SiC SCHOTTKY DIODE SML02SC06D3A/SML02SC06D3B • • • • • • • Low Leakage Fast Switching Low Forward Voltage Hermetic Ceramic Surface Mount Package Suitable for general purpose, switching applications. Space Level and High-Reliability Screening Options Available
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SML02SC06D3A/SML02SC06D3B
DL02SC06D3A-JQRS
SML02SC06D3A-JQRS
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Untitled
Abstract: No abstract text available
Text: ULTRA FAST RECOVERY POWER RECTIFIER 1N5809D3A / 1N5809D3B • DLCC3 - Light Weight Hermetic Ceramic Surface Mount Package is designed as a drop In replacement for “D-5B” / “EMELF” package† • Ultra Fast Reverse Recovery • Switching Power Supply Applications
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1N5809D3A
1N5809D3B
25mA/Â
1N5809D3B-JQRS
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LE17
Abstract: MIL-PRF19500 QR217
Text: ULTRA FAST RECOVERY POWER RECTIFIER 1N5809D3A / 1N5809D3B • DLCC3 - Light Weight Hermetic Ceramic Surface Mount Package is designed as a drop In replacement for “D-5B” / “EMELF” package† • Ultra Fast Reverse Recovery • Switching Power Supply Applications
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1N5809D3A
1N5809D3B
1N5809D3B-JQRS
LE17
MIL-PRF19500
QR217
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D-5B layout
Abstract: MELF pad layout D5B type diode QR217 1N4954US 1N5811US LE17 MIL-PRF19500 melf diode marking 1N5811D3B-JQRS
Text: DIODE LEADLESS CHIP CARRIER DLCC3 • Light Weight Hermetic Ceramic Surface Mount Package is designed as a drop In replacement for “MELF-5.7 D-5B ” / “E-MELF” packages† • Designed For High Reliability Military, Aerospace and Space Applications
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150mg
63Sn/37Pb
160mg
1N5811US
539mg
1N4954US
540mg
1N5811D3B-JQRS
D-5B layout
MELF pad layout
D5B type diode
QR217
1N4954US
1N5811US
LE17
MIL-PRF19500
melf diode marking
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LE17
Abstract: MIL-PRF19500 QR217 e-MELF
Text: ULTRA FAST RECOVERY POWER RECTIFIER 1N5811D3A / 1N5811D3B • DLCC3 - Light Weight Hermetic Ceramic Surface Mount Package is designed as a drop In replacement for “D-5B” / “EMELF” package† • Ultra Fast Reverse Recovery • Switching Power Supply Applications
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1N5811D3A
1N5811D3B
1N5811D3B-JQRS
LE17
MIL-PRF19500
QR217
e-MELF
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D-5B layout
Abstract: LE17 MIL-PRF19500 QR217 marking D3B e-MELF
Text: ULTRA FAST RECOVERY POWER RECTIFIER 1N5811D3A / 1N5811D3B • DLCC3 - Light Weight Hermetic Ceramic Surface Mount Package is designed as a drop In replacement for “D-5B” / “EMELF” package† • Ultra Fast Reverse Recovery • Switching Power Supply Applications
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1N5811D3A
1N5811D3B
1N5811D3B-JQRS
D-5B layout
LE17
MIL-PRF19500
QR217
marking D3B
e-MELF
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DIODE marking 5ba
Abstract: No abstract text available
Text: POWER RECTIFIER DIODE 1N5550D3A / 1N5550D3B • VBR = 220V, IF = 5A, Standard Reverse Recovery Rectifier Diode • Light Weight Hermetic Ceramic Surface Mount Package Designed as a Drop In Replacement for “D-5B” / “E-MELF” Package† • Switching Power Supply Applications
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1N5550D3A
1N5550D3B
1N5550D3B-JQRS
DIODE marking 5ba
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D-5B layout
Abstract: LE17 MIL-PRF19500 QR217 8814 "Power rectifier Diode"
Text: POWER RECTIFIER DIODE 1N5550D3A / 1N5550D3B • VBR = 220V, IF = 5A, Standard Reverse Recovery Rectifier Diode • Light Weight Hermetic Ceramic Surface Mount Package Designed as a Drop In Replacement for “D-5B” / “E-MELF” Package† • Switching Power Supply Applications
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1N5550D3A
1N5550D3B
1N5550D3B-JQRS
D-5B layout
LE17
MIL-PRF19500
QR217
8814
"Power rectifier Diode"
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"Power rectifier Diode"
Abstract: power rectifier diode D-5B layout LE17 MIL-PRF19500 QR217 1N5551D3A 1n5551d3
Text: POWER RECTIFIER DIODE 1N5551D3A / 1N5551D3B • VBR = 440V, IF = 5A, Standard Reverse Recovery Rectifier Diode • Light Weight Hermetic Ceramic Surface Mount Package Designed as a Drop In Replacement for “D-5B” / “E-MELF” Package† • Switching Power Supply Applications
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1N5551D3A
1N5551D3B
1N5551D3B-JQRS
"Power rectifier Diode"
power rectifier diode
D-5B layout
LE17
MIL-PRF19500
QR217
1n5551d3
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Untitled
Abstract: No abstract text available
Text: ULTRA FAST RECOVERY POWER RECTIFIER 1N6627D3A / 1N6627D3B • DLCC3 - Light Weight Hermetic Ceramic Surface Mount Package is designed as a drop In replacement for “D-5B” / “EMELF” package. • High forward current surge current capability. • Switching power supplies or other applications requiring
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1N6627D3A
1N6627D3B
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LE17
Abstract: MIL-PRF19500 QR217 1N6627 D5B type diode D-5B layout
Text: ULTRA FAST RECOVERY POWER RECTIFIER 1N6627D3A / 1N6627D3B • DLCC3 - Light Weight Hermetic Ceramic Surface Mount Package is designed as a drop In replacement for “D-5B” / “EMELF” package. • High forward current surge current capability. • Switching power supplies or other applications requiring
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1N6627D3A
1N6627D3B
LE17
MIL-PRF19500
QR217
1N6627
D5B type diode
D-5B layout
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Untitled
Abstract: No abstract text available
Text: SiC SCHOTTKY DIODE SML05SC06D3A / SML05SC06D3B • VR max = 600V • IF(avg) = 5A • VF(typ) = 1.5V • DLCC3 Hermetic Ceramic Surface Mount Package Designed as a Drop In Replacement for “D-5B”/ “E-MELF” Package † No Reverse Recovery No Forward Recovery
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SML05SC06D3A
SML05SC06D3B
SML05SC06D3B
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