Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    SRAM 1987 Search Results

    SRAM 1987 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MD2114A-5 Rochester Electronics LLC SRAM Visit Rochester Electronics LLC Buy
    27S03ADM/B Rochester Electronics LLC 27S03A - SRAM Visit Rochester Electronics LLC Buy
    29705/BXA Rochester Electronics LLC 29705 - SRAM Visit Rochester Electronics LLC Buy
    29705APCB Rochester Electronics LLC 29705A - SRAM Visit Rochester Electronics LLC Buy
    27S03ALM/B Rochester Electronics LLC 27S03A - SRAM Visit Rochester Electronics LLC Buy

    SRAM 1987 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    28F6408J3

    Abstract: 28F6408J3A Intel SCSP
    Text: 3 Volt Intel StrataFlash Memory Stacked-CSP 28F6408J3 Preliminary Datasheet Product Features • ■ ■ ■ ■ ■ ■ Flash Memory plus SRAM — Reduces Memory Board Space Required, Simplifying PCB Design Complexity Stacked Chip Scale Package Technology


    Original
    PDF 28F6408J3 64-Mbit 64-Kword 128-bit AP-663 AP-660 AP-646 28F6408J3 28F6408J3A Intel SCSP

    AM29030

    Abstract: M68040
    Text: V292BMC Rev D HIGH PERFORMANCE BURST DRAM CONTROLLER FOR Am29030/40 AND M68040/60™ PROCESSORS BLOCK DIAGRAM • Direct interface to Am29030/40 processors • Designed to work with V292PBC/V360EPC PCI bridge • Near SRAM performance achieved with DRAM


    Original
    PDF V292BMC Am29030/40TM M68040/60TM Am29030/40 512Mbytes V292PBC/V360EPC 24-bit 132-pin V292BMC, AM29030 M68040

    Signal Path Designer

    Abstract: No abstract text available
    Text: V96BMC Rev D HIGH PERFORMANCE BURST DRAM CONTROLLER FOR i960 Cx/Hx/Jx and PowerPC 401Gx PROCESSORS BLOCK DIAGRAM • Direct interface to i960Cx/Hx/Jx processors • 2Kbyte burst transaction support • SRAM performance achieved with DRAM • Designed to work with V961PBC and


    Original
    PDF V96BMC PowerPCTM401Gx i960Cx/Hx/Jx 512Mbytes V961PBC V962PBC 24-bit 40MHz 132-pin V96BMC, Signal Path Designer

    E 13007-1

    Abstract: 13007 h3 detail of D 13007 K 13007 he 13007-1 SE 13007 SEC 13005 13005 2 E 13007 sec 13007
    Text: Ml L-H-38510/610 25 FEB R U A R Y 1987 MILITARY SPECIFICATION MICROCIRCUITS, DIGITAL, VHSIC, CMOS, 65,536-BIT SELECTABLE MODE, STATIC RANDOM ACCESS MEMORY SRAM , MONOLITHIC SILICON This specification Is approved for use by all Depart­ ments and Agencies of the Department of Defense.


    OCR Scan
    PDF MlL-H-38510/610 536-BIT 536-b1t E 13007-1 13007 h3 detail of D 13007 K 13007 he 13007-1 SE 13007 SEC 13005 13005 2 E 13007 sec 13007

    hm3-65764

    Abstract: 65764 65764 ram
    Text: T-46-23-12 HM 65764 8K x 8 HIGH SPEED CMOS SRAM OCTOBER 1987 Features • • • • • • • • FAST ACCESS TIME : 35/45/55 ns max STANDBY CURRENT : 20 mA OPERATING CURRENT : 150 mA ASYNCHRONOUS INPUTS TTL COMPATIBLE INPUTS AND OUTPUTS SINGLE 5 VOLT SUPPLY


    OCR Scan
    PDF T-46-23-12 HM1-65764 HM3-65764 HMT-65764 HM4-65764 hm3-65764 65764 65764 ram

    winband

    Abstract: W25X40BV W25Q408W w25x40v W651GG2JB WSON* 8x6mm w25q128 W25X16AV 208-MIL w25X20BV
    Text: t/vinband We D eliver Product Selection Guide - o 2010 Mobile RAM Specialty DRAM Graphics DRAM Flash Memory Memory Product Foundry Service Product Selection Guide 2010 Contents 2 Mobile RAM Pseudo SRAM Low Power SDR SDRAM Low Power DDR / DDR2 SDRAM


    OCR Scan
    PDF 300mm winband W25X40BV W25Q408W w25x40v W651GG2JB WSON* 8x6mm w25q128 W25X16AV 208-MIL w25X20BV

    Untitled

    Abstract: No abstract text available
    Text: MOSEL 1K X 8 CMOS DUAL PORT SRAM MS6130/40 January 1987 FEATURES DESCRIPTION • • The MOSEL MS6130 and MS6140 are 8,192 bit dual port static random access memory organized as 1,024 words by 8 bits. The MS6130 is designed to be used as a stand-alone 8 bit dual-port RAM or as a “MASTER”


    OCR Scan
    PDF MS6130/40 MS6130 MS6140 MS6140 16-bit-or-more 48-pin MS6130L-55PDC

    MS6130L-90PDC

    Abstract: AC1237
    Text: r , MOSEL ' 1K X 8 CMOS DUAL PORT SRAM MS6130/40 i . \ January 1987 DESCRIPTION FEATURES • • High-speed— 55/70/90ns Max. Low Power dissipation 325mW (Typ.) Operating 5 |j,W(Typ.) Standby •^ S in g le 5V power supply • Fully static operation • All inputs and outputs directly TTL compatible


    OCR Scan
    PDF MS6130/40 55/70/90ns 325mW MS6130 MS6130; MS6140. 16-or-more MS6140 MS6130L-90PDC AC1237

    CL100 transistor

    Abstract: transistor E 13009 1024x4 bit ram transistor cl100 if6 hall 13009 TRANSISTOR equivalent gm f131 13005 TRANSISTOR HALL EFFECT TRANSISTOR 17S IAIO 3Y
    Text: MIL-M-38510/245A 28 January 1987 _ s u p e r s iin r MIL-H-38510/2455 USAF 5 April 1983 " m ilit a r y spec ific a t io n MICROCIRCUITS, DIGITAL. CMOS, 4096 BIT, STATIC RANDOM ACCESS MEHORY SRAM), BULK SILICON AND SILICON 0# SAPPHIRE This specification 1s approved f ° r use


    OCR Scan
    PDF mil-m-38510/245A mil-m-38510, NIL-M-3S510/24SA CL100 transistor transistor E 13009 1024x4 bit ram transistor cl100 if6 hall 13009 TRANSISTOR equivalent gm f131 13005 TRANSISTOR HALL EFFECT TRANSISTOR 17S IAIO 3Y

    a13914

    Abstract: DIL-22
    Text: ^ T-46-23-10 HM 65788 16K x 4 HIGH SPEED CMOS SRAM O C T O B E R 1987 Pinouts Features • • • • • • • • FAST ACCESS TIME : 25/35/45 ns STANDBY CURRENT : 15 mA OPERATING CURRENT : 100 mA ASYNCHRONOUS INPUTS TTL COMPATIBLE INPUTS AND OUTPUTS SINGLE 5 VOLT SUPPLY


    OCR Scan
    PDF A10A11 T-46-23-10 A0-A13 a13914 DIL-22

    Untitled

    Abstract: No abstract text available
    Text: SAMSUNG ELECTRONICS INC b?E T> 7 *îb4 m s 0P17S1S bSO • SMGK PRELIMINARY BiCMOS SRAM KM68B261A ABSOLUTE MAXIMUM RATINGS* Item Voltage on Any Pin Relative to Vss Voltage on Vcc Supply Relative to VSs Power Dissipation Storage Temperature Operating Temperature


    OCR Scan
    PDF 0P17S1S KM68B261A D2957, APRIL1993 bl723 0DT42H5

    Untitled

    Abstract: No abstract text available
    Text: Integrated Device Technolog y Inc 128K x 8 SRAM WITH REGISTERED ADDRESS LINES, LATCHED /BUFFERED DATA!N LINES AND REGISTERED DATA out LINES FEATURES: • Registered address lines • Latched and Buffered Input data lines • Registered output data lines • Separate I/O


    OCR Scan
    PDF 20MHz IDT7M827 -200mV

    W25X128

    Abstract: W25Q40 w25q64 W25Q16BW W25Q64bv W25X80BV W25Q32BV W25016BV winbond* W25Q W25X16AV
    Text: winband We D eliv er 2009 Product Selection Guide Mobile RAM Specialty DRAM Flash Memory Memory Product Foundry Service O W Product Selection Guide 2009 » Contents 2 Mobile RAM Pseudo SRAM Low Power SDR SDRAM Low Power DDR SDRAM 4 Specialty DRAM SDRAM DDR SDRAM


    OCR Scan
    PDF 300mm W25X128 W25Q40 w25q64 W25Q16BW W25Q64bv W25X80BV W25Q32BV W25016BV winbond* W25Q W25X16AV

    C3264

    Abstract: RAM-6A
    Text: 128K x 8 SRAM WITH LATCHED/ BUFFERED ADDRESS LINES, REGISTERED DATA|N LINES AND LATCHED/BUFFERED DATA0UT LINES IDT7M822 CS and WE data that meets the specified set-up time will be latched when LE goes low. DATA in is controlled by its own clock, CPDIN. When ENDIN


    OCR Scan
    PDF IDT7M822 20MHz IDT7M822 -200mV C3264 RAM-6A

    Untitled

    Abstract: No abstract text available
    Text: INT EG RAT ED DEVICE T7 dË J 482577 1 INTEGRATED DEVICE MÖHS771 ODOSÖDÜ 4 97D 0 2800 T -4 6 -2 3 -1 4 Integrated DeviceTechnology Inc. 128K x 8 SRAM WITH REGISTERED IDT7M826 ADDRESS LINES, REGISTERED DATA.m LINES AND LATCHED/BUFFERED DATA0UT LINES 53


    OCR Scan
    PDF HS771 IDT7M826 20MHz Vcc50 -200tnV MflHS771 128KX8)

    Untitled

    Abstract: No abstract text available
    Text: SAMSUNG ELECTRONICS INC b7E D • 7 ^ 4 1 4 5 0017STÌ 27b ■ SHGK PRELIMINARY K M 6 8 B 2 6 1 A _ BiCMOS SRAM TIMING WAVEFORM OF WRITE CYCLE C S C ontrolled - t w c (2) - jC - tWR -tew - 'tAW " ) ) ) ) ) ' A -t o w - -t w z (3,4,5)-


    OCR Scan
    PDF 0017STÌ 54ACT110 74ACT11002 SCAS003A- D2957.

    SC700

    Abstract: No abstract text available
    Text: INTEGRATE» DEVICE T7 D E I 4Ö25771 0002700 7 482577 1 INTEGRATED DEVICE 97D 02788 " 128K X 8 SRAM WITH LATCHED/ BUFFERED ADDRESS LINES AND REGISTERED DATA LINES D IDT7M821 Address, Write Enable W E and the three Chip Select (CS) lines are controlled by LE. When LE is'hlgh, the address latches


    OCR Scan
    PDF IDT7M821 20MHz IDT7M821 -200mV 000a7I T-46-23-14 SC700

    C3264

    Abstract: No abstract text available
    Text: INT EGR AT ED DEVICE T7 4 8 2 5 7 7 1 I NTEGRATED Integrated DeviceTechn0t03y. Inc. D E | 4ÖSS771 DDOaflDB 0 | DE V I C E 97D 02803 ^- T -4 6 -2 3 -1 4 IDT7M827 128K x 8 SRAM WITH REGISTERED ADDRESS LINES, LATCHED /BUFFERED DATA!N LINES AND REGISTERED DATA0Ut l,NES


    OCR Scan
    PDF SS771 DeviceTechn0t03y. IDT7M827 20MHz IDT7M827 200mV ES771 C3264

    hmt design

    Abstract: 5HM1 HM1-65788 HM65789
    Text: T -4 6 -2 3 -1 0 HM 65789 16K x 4 HIGH SPEED CMOS SRAM OCTOBER 1987 Pinouts Features • • • • • • • • • A5 A6 A7 Aß A9 AIO A lt Ai2 A13 CS C1 C2 L3 C4 C5 ÔË C 6 7 B 9 10 tl GND C 12 C C n C C LCC 28 PINS 24 3 VCC 23 3 A4 22 3 A3 21 3 A2


    OCR Scan
    PDF HM1-65788 -2/HM1-65789 -8/HM1-65789 HMT-65788 -5/HMT-65789 HM3-65788 HM4-65788 hmt design 5HM1 HM1-65788 HM65789

    Untitled

    Abstract: No abstract text available
    Text: INTEGRATE» DEVICE T7 dËJ 4ÖSS771 DDD a7û 5 1 |~~ 97D 027 85 482577 1 INTEGRATED DEVICE D T -4 6 -2 3 -1 4 128K x 8 SRAM WITH LATCHED/ BUFFERED ADDRESS LINES AND LATCHED/BUFFERED DATA LINES IDT7M820 Integrated Devicelechnotogy. Inc DATAin Is controlled by Its own enable, LEDIN. With this line In


    OCR Scan
    PDF SS771 IDT7M820 20MHz IDT7M820 -200mV E5771 T-46-23-14

    Untitled

    Abstract: No abstract text available
    Text: i 128K x 8 SRAM WITH REGISTERED ADDRESS LINES AND LATCHED/ BUFFERED DATA LINES IDT7M828 integrated Device Technology. Inc Address, Write Enable W E an_d the three C hip Select (CS) lines are controlled by CP. W hen C E (clock enable) is asserted, all address, C S a n d W E datathatm eetsthesp eclfled set-up tim ew ill


    OCR Scan
    PDF IDT7M828 IDT7M828 MIL-STD-883, 7M820-828

    IDT7198

    Abstract: No abstract text available
    Text: INTEGRATE» DEVICE T7 4825771 I NTEGRATED D Ë J ^1055771 00027^1 97D DE V I C E 02791 D T-46-23-14 Integrateci DeviceTêchnok^y. Inc. 128K x 8 SRAM WITH LATCHED/ BUFFERED ADDRESS LINES, REGISTERED DATAm LINES AND LATCHED/BUFFERED DATA0Ut LINES CS and WE data that meets the specified set-up time will be


    OCR Scan
    PDF T-46-23-14 20MHz IDT7M822 -200m 5S771 IDT7198

    Untitled

    Abstract: No abstract text available
    Text: I Integrated Dev ice le ch n o lo g y. Inc 128K x 8 SRAM WITH LATCHED/ BUFFERED ADDRESS LINES, LATCHED/BUFFERED DATAm LINES AND REGISTERED DATA0U TLlNES IDT7M823 D A T A i n is controlled by its own enable, LEDIN. With this line in the high state, the latch is in the transparent or buffer mode. All


    OCR Scan
    PDF IDT7M823 20MHz IDT7M823 -200mV 128KX

    Untitled

    Abstract: No abstract text available
    Text: 128K x 8 SRAM WITH REGISTERED ADDRESS LINES, REGISTERED DATA!N LINES AND LATCHED/BUFFERED DATA o u t LINES Address, Write Enable W E and the three Chip Select (CS) lines are controlled by CP. W hen CE (clock enable) is asserted, all address, C S a n d W E data that m eetsthe specified set-up time will


    OCR Scan
    PDF -200mV IDT7M826