28F6408J3
Abstract: 28F6408J3A Intel SCSP
Text: 3 Volt Intel StrataFlash Memory Stacked-CSP 28F6408J3 Preliminary Datasheet Product Features • ■ ■ ■ ■ ■ ■ Flash Memory plus SRAM — Reduces Memory Board Space Required, Simplifying PCB Design Complexity Stacked Chip Scale Package Technology
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28F6408J3
64-Mbit
64-Kword
128-bit
AP-663
AP-660
AP-646
28F6408J3
28F6408J3A
Intel SCSP
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AM29030
Abstract: M68040
Text: V292BMC Rev D HIGH PERFORMANCE BURST DRAM CONTROLLER FOR Am29030/40 AND M68040/60™ PROCESSORS BLOCK DIAGRAM • Direct interface to Am29030/40 processors • Designed to work with V292PBC/V360EPC PCI bridge • Near SRAM performance achieved with DRAM
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V292BMC
Am29030/40TM
M68040/60TM
Am29030/40
512Mbytes
V292PBC/V360EPC
24-bit
132-pin
V292BMC,
AM29030
M68040
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Signal Path Designer
Abstract: No abstract text available
Text: V96BMC Rev D HIGH PERFORMANCE BURST DRAM CONTROLLER FOR i960 Cx/Hx/Jx and PowerPC 401Gx PROCESSORS BLOCK DIAGRAM • Direct interface to i960Cx/Hx/Jx processors • 2Kbyte burst transaction support • SRAM performance achieved with DRAM • Designed to work with V961PBC and
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V96BMC
PowerPCTM401Gx
i960Cx/Hx/Jx
512Mbytes
V961PBC
V962PBC
24-bit
40MHz
132-pin
V96BMC,
Signal Path Designer
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E 13007-1
Abstract: 13007 h3 detail of D 13007 K 13007 he 13007-1 SE 13007 SEC 13005 13005 2 E 13007 sec 13007
Text: Ml L-H-38510/610 25 FEB R U A R Y 1987 MILITARY SPECIFICATION MICROCIRCUITS, DIGITAL, VHSIC, CMOS, 65,536-BIT SELECTABLE MODE, STATIC RANDOM ACCESS MEMORY SRAM , MONOLITHIC SILICON This specification Is approved for use by all Depart ments and Agencies of the Department of Defense.
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MlL-H-38510/610
536-BIT
536-b1t
E 13007-1
13007 h3
detail of D 13007 K
13007 he
13007-1
SE 13007
SEC 13005
13005 2
E 13007
sec 13007
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hm3-65764
Abstract: 65764 65764 ram
Text: T-46-23-12 HM 65764 8K x 8 HIGH SPEED CMOS SRAM OCTOBER 1987 Features • • • • • • • • FAST ACCESS TIME : 35/45/55 ns max STANDBY CURRENT : 20 mA OPERATING CURRENT : 150 mA ASYNCHRONOUS INPUTS TTL COMPATIBLE INPUTS AND OUTPUTS SINGLE 5 VOLT SUPPLY
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T-46-23-12
HM1-65764
HM3-65764
HMT-65764
HM4-65764
hm3-65764
65764
65764 ram
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winband
Abstract: W25X40BV W25Q408W w25x40v W651GG2JB WSON* 8x6mm w25q128 W25X16AV 208-MIL w25X20BV
Text: t/vinband We D eliver Product Selection Guide - o 2010 Mobile RAM Specialty DRAM Graphics DRAM Flash Memory Memory Product Foundry Service Product Selection Guide 2010 Contents 2 Mobile RAM Pseudo SRAM Low Power SDR SDRAM Low Power DDR / DDR2 SDRAM
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300mm
winband
W25X40BV
W25Q408W
w25x40v
W651GG2JB
WSON* 8x6mm
w25q128
W25X16AV
208-MIL
w25X20BV
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Untitled
Abstract: No abstract text available
Text: MOSEL 1K X 8 CMOS DUAL PORT SRAM MS6130/40 January 1987 FEATURES DESCRIPTION • • The MOSEL MS6130 and MS6140 are 8,192 bit dual port static random access memory organized as 1,024 words by 8 bits. The MS6130 is designed to be used as a stand-alone 8 bit dual-port RAM or as a “MASTER”
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MS6130/40
MS6130
MS6140
MS6140
16-bit-or-more
48-pin
MS6130L-55PDC
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MS6130L-90PDC
Abstract: AC1237
Text: r , MOSEL ' 1K X 8 CMOS DUAL PORT SRAM MS6130/40 i . \ January 1987 DESCRIPTION FEATURES • • High-speed— 55/70/90ns Max. Low Power dissipation 325mW (Typ.) Operating 5 |j,W(Typ.) Standby •^ S in g le 5V power supply • Fully static operation • All inputs and outputs directly TTL compatible
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MS6130/40
55/70/90ns
325mW
MS6130
MS6130;
MS6140.
16-or-more
MS6140
MS6130L-90PDC
AC1237
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CL100 transistor
Abstract: transistor E 13009 1024x4 bit ram transistor cl100 if6 hall 13009 TRANSISTOR equivalent gm f131 13005 TRANSISTOR HALL EFFECT TRANSISTOR 17S IAIO 3Y
Text: MIL-M-38510/245A 28 January 1987 _ s u p e r s iin r MIL-H-38510/2455 USAF 5 April 1983 " m ilit a r y spec ific a t io n MICROCIRCUITS, DIGITAL. CMOS, 4096 BIT, STATIC RANDOM ACCESS MEHORY SRAM), BULK SILICON AND SILICON 0# SAPPHIRE This specification 1s approved f ° r use
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mil-m-38510/245A
mil-m-38510,
NIL-M-3S510/24SA
CL100 transistor
transistor E 13009
1024x4 bit ram
transistor cl100
if6 hall
13009 TRANSISTOR equivalent
gm f131
13005 TRANSISTOR
HALL EFFECT TRANSISTOR 17S
IAIO 3Y
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a13914
Abstract: DIL-22
Text: ^ T-46-23-10 HM 65788 16K x 4 HIGH SPEED CMOS SRAM O C T O B E R 1987 Pinouts Features • • • • • • • • FAST ACCESS TIME : 25/35/45 ns STANDBY CURRENT : 15 mA OPERATING CURRENT : 100 mA ASYNCHRONOUS INPUTS TTL COMPATIBLE INPUTS AND OUTPUTS SINGLE 5 VOLT SUPPLY
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A10A11
T-46-23-10
A0-A13
a13914
DIL-22
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Untitled
Abstract: No abstract text available
Text: SAMSUNG ELECTRONICS INC b?E T> 7 *îb4 m s 0P17S1S bSO • SMGK PRELIMINARY BiCMOS SRAM KM68B261A ABSOLUTE MAXIMUM RATINGS* Item Voltage on Any Pin Relative to Vss Voltage on Vcc Supply Relative to VSs Power Dissipation Storage Temperature Operating Temperature
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0P17S1S
KM68B261A
D2957,
APRIL1993
bl723
0DT42H5
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Untitled
Abstract: No abstract text available
Text: Integrated Device Technolog y Inc 128K x 8 SRAM WITH REGISTERED ADDRESS LINES, LATCHED /BUFFERED DATA!N LINES AND REGISTERED DATA out LINES FEATURES: • Registered address lines • Latched and Buffered Input data lines • Registered output data lines • Separate I/O
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20MHz
IDT7M827
-200mV
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W25X128
Abstract: W25Q40 w25q64 W25Q16BW W25Q64bv W25X80BV W25Q32BV W25016BV winbond* W25Q W25X16AV
Text: winband We D eliv er 2009 Product Selection Guide Mobile RAM Specialty DRAM Flash Memory Memory Product Foundry Service O W Product Selection Guide 2009 » Contents 2 Mobile RAM Pseudo SRAM Low Power SDR SDRAM Low Power DDR SDRAM 4 Specialty DRAM SDRAM DDR SDRAM
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300mm
W25X128
W25Q40
w25q64
W25Q16BW
W25Q64bv
W25X80BV
W25Q32BV
W25016BV
winbond* W25Q
W25X16AV
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C3264
Abstract: RAM-6A
Text: 128K x 8 SRAM WITH LATCHED/ BUFFERED ADDRESS LINES, REGISTERED DATA|N LINES AND LATCHED/BUFFERED DATA0UT LINES IDT7M822 CS and WE data that meets the specified set-up time will be latched when LE goes low. DATA in is controlled by its own clock, CPDIN. When ENDIN
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IDT7M822
20MHz
IDT7M822
-200mV
C3264
RAM-6A
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Untitled
Abstract: No abstract text available
Text: INT EG RAT ED DEVICE T7 dË J 482577 1 INTEGRATED DEVICE MÖHS771 ODOSÖDÜ 4 97D 0 2800 T -4 6 -2 3 -1 4 Integrated DeviceTechnology Inc. 128K x 8 SRAM WITH REGISTERED IDT7M826 ADDRESS LINES, REGISTERED DATA.m LINES AND LATCHED/BUFFERED DATA0UT LINES 53
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HS771
IDT7M826
20MHz
Vcc50
-200tnV
MflHS771
128KX8)
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Untitled
Abstract: No abstract text available
Text: SAMSUNG ELECTRONICS INC b7E D • 7 ^ 4 1 4 5 0017STÌ 27b ■ SHGK PRELIMINARY K M 6 8 B 2 6 1 A _ BiCMOS SRAM TIMING WAVEFORM OF WRITE CYCLE C S C ontrolled - t w c (2) - jC - tWR -tew - 'tAW " ) ) ) ) ) ' A -t o w - -t w z (3,4,5)-
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0017STÌ
54ACT110
74ACT11002
SCAS003A-
D2957.
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SC700
Abstract: No abstract text available
Text: INTEGRATE» DEVICE T7 D E I 4Ö25771 0002700 7 482577 1 INTEGRATED DEVICE 97D 02788 " 128K X 8 SRAM WITH LATCHED/ BUFFERED ADDRESS LINES AND REGISTERED DATA LINES D IDT7M821 Address, Write Enable W E and the three Chip Select (CS) lines are controlled by LE. When LE is'hlgh, the address latches
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IDT7M821
20MHz
IDT7M821
-200mV
000a7I
T-46-23-14
SC700
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C3264
Abstract: No abstract text available
Text: INT EGR AT ED DEVICE T7 4 8 2 5 7 7 1 I NTEGRATED Integrated DeviceTechn0t03y. Inc. D E | 4ÖSS771 DDOaflDB 0 | DE V I C E 97D 02803 ^- T -4 6 -2 3 -1 4 IDT7M827 128K x 8 SRAM WITH REGISTERED ADDRESS LINES, LATCHED /BUFFERED DATA!N LINES AND REGISTERED DATA0Ut l,NES
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SS771
DeviceTechn0t03y.
IDT7M827
20MHz
IDT7M827
200mV
ES771
C3264
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hmt design
Abstract: 5HM1 HM1-65788 HM65789
Text: T -4 6 -2 3 -1 0 HM 65789 16K x 4 HIGH SPEED CMOS SRAM OCTOBER 1987 Pinouts Features • • • • • • • • • A5 A6 A7 Aß A9 AIO A lt Ai2 A13 CS C1 C2 L3 C4 C5 ÔË C 6 7 B 9 10 tl GND C 12 C C n C C LCC 28 PINS 24 3 VCC 23 3 A4 22 3 A3 21 3 A2
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HM1-65788
-2/HM1-65789
-8/HM1-65789
HMT-65788
-5/HMT-65789
HM3-65788
HM4-65788
hmt design
5HM1
HM1-65788
HM65789
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Untitled
Abstract: No abstract text available
Text: INTEGRATE» DEVICE T7 dËJ 4ÖSS771 DDD a7û 5 1 |~~ 97D 027 85 482577 1 INTEGRATED DEVICE D T -4 6 -2 3 -1 4 128K x 8 SRAM WITH LATCHED/ BUFFERED ADDRESS LINES AND LATCHED/BUFFERED DATA LINES IDT7M820 Integrated Devicelechnotogy. Inc DATAin Is controlled by Its own enable, LEDIN. With this line In
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SS771
IDT7M820
20MHz
IDT7M820
-200mV
E5771
T-46-23-14
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Untitled
Abstract: No abstract text available
Text: i 128K x 8 SRAM WITH REGISTERED ADDRESS LINES AND LATCHED/ BUFFERED DATA LINES IDT7M828 integrated Device Technology. Inc Address, Write Enable W E an_d the three C hip Select (CS) lines are controlled by CP. W hen C E (clock enable) is asserted, all address, C S a n d W E datathatm eetsthesp eclfled set-up tim ew ill
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IDT7M828
IDT7M828
MIL-STD-883,
7M820-828
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IDT7198
Abstract: No abstract text available
Text: INTEGRATE» DEVICE T7 4825771 I NTEGRATED D Ë J ^1055771 00027^1 97D DE V I C E 02791 D T-46-23-14 Integrateci DeviceTêchnok^y. Inc. 128K x 8 SRAM WITH LATCHED/ BUFFERED ADDRESS LINES, REGISTERED DATAm LINES AND LATCHED/BUFFERED DATA0Ut LINES CS and WE data that meets the specified set-up time will be
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T-46-23-14
20MHz
IDT7M822
-200m
5S771
IDT7198
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Untitled
Abstract: No abstract text available
Text: I Integrated Dev ice le ch n o lo g y. Inc 128K x 8 SRAM WITH LATCHED/ BUFFERED ADDRESS LINES, LATCHED/BUFFERED DATAm LINES AND REGISTERED DATA0U TLlNES IDT7M823 D A T A i n is controlled by its own enable, LEDIN. With this line in the high state, the latch is in the transparent or buffer mode. All
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IDT7M823
20MHz
IDT7M823
-200mV
128KX
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Untitled
Abstract: No abstract text available
Text: 128K x 8 SRAM WITH REGISTERED ADDRESS LINES, REGISTERED DATA!N LINES AND LATCHED/BUFFERED DATA o u t LINES Address, Write Enable W E and the three Chip Select (CS) lines are controlled by CP. W hen CE (clock enable) is asserted, all address, C S a n d W E data that m eetsthe specified set-up time will
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-200mV
IDT7M826
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