SOT-93 Search Results

SOT-93 Result Highlights (5)

Part	ECAD Model	Manufacturer	Description	Download	Buy
7UL2T125FK		Toshiba Electronic Devices & Storage Corporation	One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC
TC75S102F		Toshiba Electronic Devices & Storage Corporation	Operational Amplifier, 1.5V to 5.5V, I/O Rail to Rail, IDD=0.27μA, SOT-25
7UL2T126FK		Toshiba Electronic Devices & Storage Corporation	One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC
TCR2EF18		Toshiba Electronic Devices & Storage Corporation	LDO Regulator, Fixed Output, 1.8 V, 200 mA, SOT-25 (SMV)
TCR2LF18		Toshiba Electronic Devices & Storage Corporation	LDO Regulator, Fixed Output, 1.8 V, 200 mA, SOT-25 (SMV)

SOT-93 Price and Stock

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Ninigi SMICA SOT93 Heat transfer pad: silicone; SOT93,TOP3; 0.4K/W; L: 24mm; W: 20mm
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TME	SMICA SOT93		14,527		10	1 - 10 $0.19 100 $0.12 1000 $0.079 10000 $0.0392	Buy Now
Ninigi MICA SOT93 Heat transfer pad: mica; SOT93,TOP3; 0.8K/W; L: 25mm; W: 20mm
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TME	MICA SOT93		6,624		10	1 - 10 $0.105 100 $0.0828 1000 $0.0454 10000 $0.0383	Buy Now
Ninigi SMICA SOT93-2 Heat transfer pad: silicone; SOT93,TOP3; 0.4K/W; L: 24mm; W: 20mm
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TME	SMICA SOT93-2		682		10	1 - 10 $0.42 100 $0.276 1000 $0.249 10000 $0.249	Buy Now

SOT-93 Datasheets (12)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
SOT93		STMicroelectronics	SOT93 - ASD & DISCRETES - TOURS		Original	PDF
SOT930-1		NXP Semiconductors	Plastic thin fine-pitch ball grid array package; 208 balls; body 12 x 12 x 0.7 mm		Original	PDF
SOT931-1		NXP Semiconductors	Plastic thermal enhanced low profile small outline package; no leads; 10 terminals; resin based; body 4 x 4 x 1.1 mm		Original	PDF
SOT932-1		NXP Semiconductors	Plastic thin fine-pitch ball grid array package; 176 balls; body 6 x 15 x 0.7 mm		Original	PDF
SOT933-1		NXP Semiconductors	Plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1 mm		Original	PDF
SOT934-1		NXP Semiconductors	Plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1 mm		Original	PDF
SOT935-1		NXP Semiconductors	Plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1 mm		Original	PDF
SOT935-2		NXP Semiconductors	Plastic thermal enhanced low profile quad flat package; no leads; 56 terminals; resin based		Original	PDF
SOT936-1		NXP Semiconductors	Plastic thermal enhanced low profile quad flat package; no leads; 56 terminals; resin based		Original	PDF
SOT936-2		NXP Semiconductors	Plastic thermal enhanced low profile quad flat package; no leads; 56 terminals; resin based		Original	PDF
SOT938-1		NXP Semiconductors	Plastic, heatsink small outline package; 36 leads; low stand-off height		Original	PDF
SOT939-1		NXP Semiconductors	Plastic, heatsink small outline package; 36 leads; low stand-off height		Original	PDF