SOLDERING GUIDELINES PIN IN PASTE Search Results
SOLDERING GUIDELINES PIN IN PASTE Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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CN-AC3MMDZBAU |
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3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) | Datasheet | ||
CN-DSUB50PIN0-000 |
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Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals | Datasheet | ||
CN-DSUBHD62PN-000 |
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Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals | Datasheet | ||
CN-DSUB15PIN0-000 |
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Amphenol CN-DSUB15PIN0-000 D-Subminiature (DB15 Male D-Sub) Connector, 15-Position Pin Contacts, Solder-Cup Terminals | Datasheet | ||
CN-DSUBHD15PN-000 |
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Amphenol CN-DSUBHD15PN-000 High-Density D-Subminiature (HD15 Male D-Sub) Connector, 15-Position Pin Contacts, Solder-Cup Terminals | Datasheet |
SOLDERING GUIDELINES PIN IN PASTE Datasheets Context Search
Catalog Datasheet | MFG & Type | Document Tags | |
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Soldering guidelines pin in paste
Abstract: TA-893 connectors Shrouded Header, 8 Pin, 2mm fci minitek idc shrouded header pin in paste BUS-12-055 LR46923 right angle 14 pin pcb connector 2mm pitch
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2002/95/IEC E66906 LR46923 BUS-12-055 TA-893 TA-894 TA-842 Soldering guidelines pin in paste TA-893 connectors Shrouded Header, 8 Pin, 2mm fci minitek idc shrouded header pin in paste BUS-12-055 LR46923 right angle 14 pin pcb connector 2mm pitch | |
Soldering guidelines pin in paste
Abstract: TA-895 idc shrouded header minitek pin in paste LR46923 right angle 5 pin pcb connector
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CDC-MINIPIP-02/07-E Soldering guidelines pin in paste TA-895 idc shrouded header minitek pin in paste LR46923 right angle 5 pin pcb connector | |
Soldering guidelines pin in paste
Abstract: bergstik LR46923 connectors basics of electrical connector pin in paste FCI Bergcon reflow FCI BERG TA-894
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E66906 LR46923 BUS-12-019 Soldering guidelines pin in paste bergstik LR46923 connectors basics of electrical connector pin in paste FCI Bergcon reflow FCI BERG TA-894 | |
sofix connector
Abstract: FCI Connector Soldering guidelines pin in paste connectors GS-14-920 pin in paste Sofix HM1K51DFP000H6PLF packaging specification GS-12-307
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72860-103LF 72850-101LF GS-12-307 GS-14-920 ELXMETRAPIP1207EA4 sofix connector FCI Connector Soldering guidelines pin in paste connectors GS-14-920 pin in paste Sofix HM1K51DFP000H6PLF packaging specification GS-12-307 | |
IPC-SM-780
Abstract: No abstract text available
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ANSI/IPC-SM-786) IPC-TM-650) JESD22-A112) IPC-SM-780 | |
screen emulsion
Abstract: P8002355 P8002392 63Sn37Pb
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IPC-SM-786A
Abstract: BGA and QFP Altera Package mounting profile JESD22-A113 J-STD-020A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE IPC-SM-780 altera board
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Cymbet EnerChip User Guide
Abstract: Application Notes application-notes
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AN-72-1026 AN-72-1026 EVAL-05 Cymbet EnerChip User Guide Application Notes application-notes | |
IPC-7711
Abstract: JEDEC J-STD-033b IPC 7721 J-STD-033b.1 JEDEC J-STD-033b.1 paste profile IPC7711 IPC-7721 thermal pcb guidelines to48c
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BGA and QFP Altera Package mounting profile
Abstract: BGA PROFILING JEP113-B infrared heating gun guidelines JEP113 Reliability Data Plastic Packages QFP J-STD-020A J-STD-033 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE
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MMA7660
Abstract: SURFACE MOUNT CAPACITORS footprint land pattern AN3839 MMA7660FC accelerometer sensor land pattern for DFN
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AN3839 MMA7660FC MMA7660 SURFACE MOUNT CAPACITORS footprint land pattern AN3839 accelerometer sensor land pattern for DFN | |
SOD80 footprint
Abstract: SOD87 footprint Soldering guidelines and SMD footprint design SMD footprint design SOD106 land pattern land pattern sot346 SOD110 footprint SOD87 footprint pcb MLC745 smd footprint
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MGK391 MSC422 OT457 SC-74) MSC423 SOD80 footprint SOD87 footprint Soldering guidelines and SMD footprint design SMD footprint design SOD106 land pattern land pattern sot346 SOD110 footprint SOD87 footprint pcb MLC745 smd footprint | |
TN0019
Abstract: thermal pcb guidelines 7x7x1 JESD97 QFPN-28 QFPN 28 footprint
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TN0019 TN0019 thermal pcb guidelines 7x7x1 JESD97 QFPN-28 QFPN 28 footprint | |
SOD87 footprint
Abstract: Soldering guidelines and SMD footprint design sot3391h SOT-34 MSA460 MSA439 SOT343R footprint
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MSD060 OT428. MSC422 OT457 SC-74) MSC423 SOD87 footprint Soldering guidelines and SMD footprint design sot3391h SOT-34 MSA460 MSA439 SOT343R footprint | |
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QFPN-28
Abstract: qfn 44 PACKAGE footprint QFPN 28 footprint 4x4x1 QFPN-24 TN0019 7x7x1 MEMS ic 7551-1 qfn 28 land pattern
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TN0019 QFPN-28 qfn 44 PACKAGE footprint QFPN 28 footprint 4x4x1 QFPN-24 TN0019 7x7x1 MEMS ic 7551-1 qfn 28 land pattern | |
KR-19SHrma
Abstract: ST25E-PS90 TN82 DIL32 DIL-32 J-STD-033 Soldering guidelines pin in paste mems ultrasonic sensors Sn60Pb40 solder
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32-lead DIL-32) DIL-32 J-STD-020C) J-STD-033) KR-19SHrma ST25E-PS90 TN82 DIL32 J-STD-033 Soldering guidelines pin in paste mems ultrasonic sensors Sn60Pb40 solder | |
KR-19SHrma
Abstract: ST25E-PS90 almit DIL 330 J-STD-033 TN71 mems ultrasonic sensors leadframe dil Soldering guidelines pin in paste J-STD-033 PCB
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SCA10x0 DIL-12 J-STD-020C) J-STD-033) KR-19SHrma ST25E-PS90 almit DIL 330 J-STD-033 TN71 mems ultrasonic sensors leadframe dil Soldering guidelines pin in paste J-STD-033 PCB | |
Soldering guidelines and SMD footprint design
Abstract: SOD87 footprint SMD footprint design Soldering guidelines SOD106 land pattern sod110 land sot89 stencil SC59 SOD110 footprint "msb900"
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OD106, OT223. MSB958 Soldering guidelines and SMD footprint design SOD87 footprint SMD footprint design Soldering guidelines SOD106 land pattern sod110 land sot89 stencil SC59 SOD110 footprint "msb900" | |
CMA3000
Abstract: CMA3000-D0X vti cma3000 J-STD-020D accelerometer SENSORS
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CMA3000 CMA3000-D0X vti cma3000 J-STD-020D accelerometer SENSORS | |
CMA3000
Abstract: CMA3000-D0X rev 0.4 pin in paste CMA3000-D0X J-STD-020D vti cma3000 asic chips
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CMA3000 CMA3000-D0X rev 0.4 pin in paste CMA3000-D0X J-STD-020D vti cma3000 asic chips | |
qfn 32 land pattern
Abstract: hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782
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IPC-SM-782. OD-323 qfn 32 land pattern hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782 | |
SOD-323 land pattern
Abstract: SOIC 8 pcb pattern land pattern for SSOP tssop 16 exposed pad stencil land pattern for TSsOP 16 LPCC-16 16 soic pcb footprint land pattern for TSSOP qfn 32 land pattern qfn 28 land pattern
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IPC-SM-782. SoD-323 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP tssop 16 exposed pad stencil land pattern for TSsOP 16 LPCC-16 16 soic pcb footprint land pattern for TSSOP qfn 32 land pattern qfn 28 land pattern | |
sot89 stencil
Abstract: sot89 land pattern Loctite 218 RG200 substrate 5989-0810EN LOCTITE-96sc Getek LOCTITE 384 RG200 laser gun
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5989-0810EN sot89 stencil sot89 land pattern Loctite 218 RG200 substrate LOCTITE-96sc Getek LOCTITE 384 RG200 laser gun | |
IPC-CH-65A
Abstract: Vacuum HW004A0A1 213B HW004A0A1-S IPC7711 telcordia GR-63-CORE
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AP02-002EPS IPC-CH-65A Vacuum HW004A0A1 213B HW004A0A1-S IPC7711 telcordia GR-63-CORE |