kester Sn62Pb36Ag02
Abstract: Sn63pB37 temp profile
Text: R500 Dispensable Water-soluble Solder Paste for Leaded Alloys Product Description Physical Properties Kester R500 is a water-soluble solder paste formula specifically designed as a consistent dot dispensing paste for automated dispense equipment. This solder paste exhibits excellent wetting
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Sn63Pb37
10rpm
21Sep09
kester Sn62Pb36Ag02
Sn63pB37 temp profile
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Kester 197
Abstract: No abstract text available
Text: R560 Water-Soluble Solder Paste Product Description Physical Properties Data given for Sn63Pb37, 90% metal, -325+500 mesh Kester R560 is an organic acid, water-soluble solder paste formula specifically designed to reduce voiding in Ball Grid Array (BGA) solder
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Sn63Pb37,
10Sep04
Kester 197
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Untitled
Abstract: No abstract text available
Text: Technical Data Sheet MP200 December-2011 PRODUCT DESCRIPTION MP200 provides the following product characteristics: Technology Application Solder paste Sn/Pb soldering MP200 solder pastes have been formulated as no-clean, Sn/Pb solder paste for high speed printing and reflow in both
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MP200
December-2011
MP200
200mms-1
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GR-78-CORE
Abstract: J-STD-005 multicore solder paste GR78-CORE GR-78-CORE PCB solder powder J-STD-004 paste J-STD-004 MSDS bellcore GR-78 MCF800
Text: Technical Data Sheet MP200 Solder Paste February 2005 HIGH-SPEED PRINTING, NO-CLEAN SOLDER PASTE PRODUCT DESCRIPTION Multicore MP200 solder pastes have been formulated as no-clean solder pastes for high speed printing and reflow in both air and nitrogen. The products were specifically formulated to have increased
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MP200
ANSI/J-STD-004
GR-78-CORE
J-STD-005
multicore solder paste
GR78-CORE
GR-78-CORE PCB
solder powder
J-STD-004 paste
J-STD-004 MSDS
bellcore GR-78
MCF800
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Untitled
Abstract: No abstract text available
Text: VT-RBT SOLDER PASTE INSPECTION SYSTEM Omron’s VT-Rabbit stops defective boards before they multiply Integrate the VT-Rabbit into your PCB production process for an accurate, high-speed solder paste inspection solution. This small 35 inch footprint device operates at production
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advanc64
9/00/10M
50/60Hz,
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GR-78-CORE
Abstract: No abstract text available
Text: Technical Data Sheet WS200 June-2009 WS200™ is a water washable solder paste for printing and reflow in air or nitrogen atmospheres where process yield is critical. WS200™ solder paste offers excellent open time and good soldering activity over a wide range of reflow profiles and
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WS200â
June-2009
GR-78-CORE
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all ic data
Abstract: land pattern for TSOP 2 pace craft 100 82425EX intel 80486 80486 DX4 80c196kb 1988 QFP PACKAGE thermal resistance 55A5 TSOP infrared
Text: CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS INTRODUCTION In reflowed board assemblies the solder joint quality is affected by several variables such as board design SMT Surface Mount Technology assembly equipment solder paste component and reflow profile
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AN-009
Abstract: 245C J-STD-020D sac 305 reflow profile 245 ESD conveyor belt
Text: Application Note AN:009 V•I Chip Soldering Recommendations By Paul Yeaman Manager, V•I Chip Applications Engineering Introduction Contents Page Introduction 1 Storage 1 Solder Paste Stencil 1 Design Pick & Place 1 Solder Reflow 1 225˚C Reflow Procedure
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SN100C
Abstract: Water soluble
Text: WS482 Water Soluble Cored Wire Solder Features: - Halide-Free - High Activity Level - Good Thermal Transfer - Good Wetting Properties - For Standard and High-Temperature Applications - Extended Cleaning Times, Safe Up to 2 to 3 Days Description: WS482 is a water soluble, halide-free flux cored wire that is highly active and compatible with water soluble solder paste
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WS482
WS482
ISO9001
45-micron
SN100C
Water soluble
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Zarlink Semiconductor
Abstract: No abstract text available
Text: ZLAN-77 Reflow Guidelines for the ZL30461 Application Note Operating Temperature • December 2003 0°C to 70°C Storage Temperature • Preheat - 1°C to 2°C/sec rise with a peak temperature of 100°C to 140°C • Preflow - Dryout and solder paste activation
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ZLAN-77
ZL30461
Zarlink Semiconductor
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Sn63Pb37
Abstract: No abstract text available
Text: R276 Dispensable No-Clean Solderpaste for Leaded Alloys Product Description Physical Properties Data given for Sn63Pb37 87% metal, -325+500 mesh Kester R276 is a no-clean solder paste specifically designed for optimal characteristics in all types of dispensing applications. R276 is packaged
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Sn63Pb37
21Sep09
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SMSP10S
Abstract: SMSP10SL 32082 RG10 650-015-00-7 solder powder
Text: PAGE: SAFETY DATA SHEET 1 of 3 PRINT DATE: REF: 06/08/1997 SMSP 1. IDENTIFICATION OF THE SUBSTANCE/PREPARATION AND THE COMPANY/UNDERTAKING Product name: SURFACE MOUNT SOLDER PASTE Product code: SMSP Supplier: ELECTROLUBE H.K. Wentworth Ltd., Wentworth House, Blakes Road,
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SMSP10SL
SMSP10S
SMSP10SL
32082
RG10
650-015-00-7
solder powder
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Untitled
Abstract: No abstract text available
Text: Easy Profile 256 No-Clean Solderpaste Product Description Physical Properties Data given for Sn63Pb37 90% metal, -325+500 mesh Easy Profile® 256 is a no-clean, air or nitrogen reflowable, solder paste specifically designed for maximum robustness in reflow profiling and stencil
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Sn63Pb37
EP256
21Sep09
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Untitled
Abstract: No abstract text available
Text: Magnecraft 191 Waukegan Rd, Ste 206 Northfield, IL 60093-2743 Phone: 847 441-2526 Fax: (847)441-2522 Email: [email protected] Item # W172DIP-4, Miniature Reed PCB Relay / SPDT, 0.25 Amp Rated QUOTE Miniature Reed PCB Relay / SPDT, 0.25 Amp Rated Ò Magnecraft SIPS and DIPS can withstand a lead-free solder re-flow process, making pin-thru-paste applications possible.
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W172DIP-4,
172DIP
172DIP-4
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4532M
Abstract: crystal washing machine service manual power 4532M transistor 4532m yageo mlcc yageo Phycomp 0603 res 1808 FOOTPRINT mlcc soldering ceramic capacitor footprint 0201 dimension 4278A
Text: Innovative Service Around the Globe www.yageo.com MLCC Application Manual 1. Introduction Contents 1. Introduction 1.1 Construction and dimensions 1.2 Influences of the MLCC terminations over the solder connections 2. Storage Conditions 3. Soldering Information
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all mosfet equivalent book
Abstract: AN1035 design of mosfet based power supply st mosfet AN-1035 power mosfet IR IRF mosfet data sheet 8086 international rectifier data book INTERNATIONAL RECTIFIER GUIDE
Text: The International Rectifier DirectFET MOSFET 4Ps CHECKLIST PbF: All DirectFET MOSFET are leadfree and RoHS compliant. Storage and Moisture Sensitivity The plating configuration on DirectFET components is mildly photosensitive and can also be tarnished by the high levels of atmospheric pollution that occur in
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AN1035
6mil/150
AN1035.
all mosfet equivalent book
design of mosfet based power supply
st mosfet
AN-1035
power mosfet IR
IRF mosfet
data sheet 8086
international rectifier data book
INTERNATIONAL RECTIFIER GUIDE
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senju m705 solder paste
Abstract: senju M705-221BM5-42-11 M705-221BM5-42-11 RMA9086 senju solder paste M705 SENJU m705 NCP18 90-4-M20 NCP03 NCP15
Text: catalog to prevent smoking and/or burning, Pleaseread readrating ratingand and!CAUTION !CAUTION for (forstorage, storage,operating, operating,rating, rating,soldering, soldering,mounting mountingand andhandling handling)ininthis thisPDF catalog to prevent
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R44E8
40kHz.
NCP03
NCP15
NCP18/NCP21
senju m705 solder paste
senju M705-221BM5-42-11
M705-221BM5-42-11
RMA9086
senju solder paste M705
SENJU m705
NCP18
90-4-M20
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M02142
Abstract: CSOP-48 BGA672 CS36 J-STD-020A ultrasonic full bridge cleaning S02-1 FD-FBGA-60 FBGA-304 tsop-48 flash
Text: Package Mounting Methods Mounting Methods/Reliability/Storage 1. Mounting Methods 2. Surface Mounted Plastic Package Reliability 3. Storage DB81-10004-2E 1 Package Mounting Methods (Mounting Methods/Reliability/Storage) 1. Mounting Methods PACKAGE 1. Mounting Methods
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DB81-10004-2E
M02142
CSOP-48
BGA672
CS36
J-STD-020A
ultrasonic full bridge cleaning
S02-1
FD-FBGA-60
FBGA-304
tsop-48 flash
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mq2 sensor
Abstract: mq2 sensor pins sensor matsushita MQ Futaba toray murata msh "vacuum sensor" poz3 futaba VACUUM JB-2225
Text: This is the PDF file of catalog No.R82E-2. APPLICATION MANUAL R82E2.pdf 97.09.29 This is the PDF file of catalog No.R82E-2. Contents 1. Features of Murata Chip Trimmer Potentiometers 2. Specifications 1. Precautions in Storage 1. Considerations in Design 2. Standard Land Patterns
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R82E-2.
R82E2
mq2 sensor
mq2 sensor pins
sensor matsushita MQ
Futaba
toray
murata msh
"vacuum sensor"
poz3
futaba VACUUM
JB-2225
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ET-7403
Abstract: JIS C 5102
Text: R90E6.pdf 04.3.1 catalog to prevent smoking and/or burning, Pleaseread readrating ratingand and!CAUTION !CAUTION for (forstorage, storage,operating, operating,rating, rating,soldering, soldering,mounting mountingand andhandling handling)ininthis thisPDF catalog
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R90E6
ET-7403
JIS C 5102
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Untitled
Abstract: No abstract text available
Text: VISHAY SFER NICE Resistive and Inductive Products Application Note Guidelines for Vishay Sfernice Resistive and Inductive Components Caution: Information included in product datasheets are leading to the general information given in this Application Note 1. STORAGE RECOMMENDATION
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27-Aug-10
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wacker P12
Abstract: Wacker SEMITOP 2 Package SEMITOP 3 Package SEMITOP Dicke Semikron Semitop 3 Tabelle wack SEMITOP 1 Package
Text: SEMITOP Mounting instructions SEMITOP® Montagehinweise General IGBT and MOS circuits in SEMITOP are sensitive to electrostatic charges. All SEMITOPs are protected by the package during transport and storage. An ESD protected work bench is required during
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/5/FO/000/013/Rev
wacker P12
Wacker
SEMITOP 2 Package
SEMITOP 3 Package
SEMITOP
Dicke
Semikron Semitop 3
Tabelle
wack
SEMITOP 1 Package
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Untitled
Abstract: No abstract text available
Text: Philips Semiconductors Video Transistors and Modules for Monitors General MOUNTING AND SOLDERING Stencilling Mounting methods In this method a stencil with etched holes to pass the paste is used. The thickness of the stencil determines the amount of amount of solder paste that is deposited on the
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Abstract: No abstract text available
Text: Philips Semiconductors General Small-signal Field-effect Transistors MOUNTING AND SOLDERING Screen printing Mounting methods This is the best high-volume production method of solder paste application. An emulsion-coated, fine mesh screen with apertures etched in the emulsion to coincide with the
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