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    QFP 128 BONDING Search Results

    QFP 128 BONDING Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    8501002YC Rochester Electronics LLC Microprocessor, 16-Bit, 6MHz, CMOS, CQFP68, CERAMIC, QFP-68 Visit Rochester Electronics LLC Buy
    8501001YA Rochester Electronics LLC Microprocessor, 16-Bit, 8MHz, CMOS, CQFP68, CERAMIC, QFP-68 Visit Rochester Electronics LLC Buy
    NG82370-16 Rochester Electronics LLC Multifunction Peripheral, CMOS, PQFP100, PLASTIC, QFP-100 Visit Rochester Electronics LLC Buy
    MQ80C196KB-12 Rochester Electronics LLC Microcontroller, 16-Bit, 6MHz, CMOS, CQFP68, CERAMIC, QFP-68 Visit Rochester Electronics LLC Buy
    TMC2081KBC Rochester Electronics LLC Consumer Circuit, PQFP128, METRIC, PLASTIC, QFP-128 Visit Rochester Electronics LLC Buy

    QFP 128 BONDING Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    100L

    Abstract: JESD51-2 JESD51-7 32 QFP PACKAGE thermal resistance tqfp 7x7 1.4 tray tqfp 7x7 tray tqfp 64 thermal resistance Techpoint
    Text: TQFP Thin Profile Quad Flat Pack • 7 x 7mm to 14 x 14mm • 32 to 128 lead count • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 14 x 14mm The Thin Profile Quad Flat Pack TQFP belongs to STATS ChipPAC’s QFP family. At 1.0mm body thickness, the TQFP


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    BR931

    Abstract: motorola mca MCA3200ETL MCA6200ETL MCA750ETL H4C018 Motorola Master Selection Guide H4C161 wirebond die flag lead frame an1512
    Text: Semicustom Application Specific Integrated Circuits In Brief . . . Motorola supports strategic programs and co–development partnerships to accelerate the availability of advanced processes CMOS, BiCMOS, Bipolar , packaging and CAD technology. Extensive research,


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    MARKING CODE N-CHANNEL MOS FIELD EFFECT TRANSISTOR

    Abstract: uPD65837 uPD65869 X17512 upd65839 RF Transistors Ceramic MARKING F25 marking code F302 535 D65841 uPD65851 X46358
    Text: Design Manual CMOS-8L Family CMOS Gate Array Ver. 5.0 Document No. A12158EJ5V0DM00 5th edition Date Published June 1999 N CP(K) 1997, 1998 Printed in Japan 1 [MEMO] 2 Design Manual A12158EJ5V0DM00 NOTES FOR CMOS DEVICES 1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS


    Original     		PDF A12158EJ5V0DM00 Semiconductor2/9044 MARKING CODE N-CHANNEL MOS FIELD EFFECT TRANSISTOR uPD65837 uPD65869 X17512 upd65839 RF Transistors Ceramic MARKING F25 marking code F302 535 D65841 uPD65851 X46358

    bi 240

    Abstract: SnAgCu NA200 NA200 flux QFP-208 NA-200 paste profile SMD Packages QFP 128 bonding QFP PACKAGE thermal resistance
    Text: Quality Evaluation Data for Lead-free SMD Peripheral Packages Sn-Bi plating August 30, 2002 Seiko Epson Corporation Contents 1. Observation of Surface Condition of Sn-Bi Type Lead Plating 2. Soldering Evaluation for Lead Plating 2-1 Solderability test results for stand-alone packages


    Original     		PDF NA200) bi 240 SnAgCu NA200 NA200 flux QFP-208 NA-200 paste profile SMD Packages QFP 128 bonding QFP PACKAGE thermal resistance

    68hc26

    Abstract: 68HC05C4 68hc705p9 68HC05B6 JPC3400 68hc805b6 68705r3 68HC05C12 68HC705B5 68HC68SE
    Text: CSIC Microcontroller Division Reliability and Quality Quarter 2, 1996 Report MOTOROLA INC., 1996 CSIC MICROCONTROLLER DIVISION RELIABILITY AND QUALITY REPORT TECHNICAL INFORMATION . 1-1 RELIABILITY DATA BY TECHNOLOGY. 2-1


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    NA200 flux

    Abstract: bi 240 QFP 208 MT90810AK3 NA200 QFP208-pin epson, whisker
    Text: Soldering Information for the MT90810AK3 Sn-Bi plating lead-free package 260 oC Peak Temperature from Seiko Epson Corporation For more information about Seiko Epson Lead-Free packages, Please consult their web site at :


    Original     		PDF MT90810AK3 NA200) NA200 flux bi 240 QFP 208 MT90810AK3 NA200 QFP208-pin epson, whisker

    68hc11pa8

    Abstract: 68hc11kg4 68B09E 68HC11PH8 HC711KG4 68HC11KA4 68HC57 68HC11L6 HC705B16 motorola 68hc11kg4
    Text: MCTG RELIABILITY AND QUALITY 1996 ANNUAL REPORT MRQSY96/D Microcontroller Technologies Group Reliability and Quality 1996 Annual Report To Our Valued Customers: Thank you for selecting Motorola as your preferred supplier of Microcontroller products. We in Motorola’s


    Original     		PDF MRQSY96/D 68hc11pa8 68hc11kg4 68B09E 68HC11PH8 HC711KG4 68HC11KA4 68HC57 68HC11L6 HC705B16 motorola 68hc11kg4

    116-Pin

    Abstract: PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow
    Text: small! What is a CSP Chip Size Package ? A “CSP” is an integrated circuit package with dimensions equal to or slightly larger than those of the silicon chip it contains. Specifically, a package with size (L x W) equal to the size of the chip is called a Real Chip Size


    Original     		PDF C13185EJ1V0PF00 116-Pin PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow

    synopsys Platform Architect

    Abstract: clock tree balancing DesignWare SPI vhdl code for watchdog timer of ATM 0.18-um CMOS technology characteristics vhdl coding for analog to digital converter CML Vterm 27x27
    Text: GS20 0.18-µm CMOS Standard Cell/Gate Array Version 1.1 May 19, 2000 Copyright  Texas Instruments Incorporated, 2000 The information and/or drawings set forth in this document and all rights in and to inventions disclosed herein and patents which might be granted thereon disclosing or employing the


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    S1D15719

    Abstract: S1D15722D01B S1D15719D22B S1D15714D01E s1d13517 S1D15722 Matrix CCD "line sensor" Epson epd driving S1D15712 S1D15721D01B
    Text: CMOS LSIs Product Catalog 2009 SEIKO EPSON CORPORATION CMOS LSIs Contents Configuration of product number . 2 1 ASICs Application Specific IC 1-1 Gate Arrays . 4


    Original     		PDF S1L70000 S1L60000 S1L50000 S1L30000 16-bit 32-bit S1D15719 S1D15722D01B S1D15719D22B S1D15714D01E s1d13517 S1D15722 Matrix CCD "line sensor" Epson epd driving S1D15712 S1D15721D01B

    68HC11L6

    Abstract: 68hc11ka4 68HC11PH8 68HC11a1 527 MOSFET TRANSISTOR motorola D65C 68HC05N4 nippon denso 68HC05B6 128 QFP 14x20
    Text: CMRQS/D REV 10 MOTOROLA MICROCONTROLLER TECHNOLOGIES GROUP RELIABILITY AND QUALITY MONITOR REPORT Quarter 1, 1997 Semiconductor Product Sector Test results contained herein are for information only. This report does not alter MotorolaÕs standard warranty or product speciÞcations.


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    144 QFP body size

    Abstract: 35x35 bga BGA and QFP Package vhdl code for usart DesignWare SPI 0.18-um CMOS technology characteristics ARM7 verilog code NEC-V850 PZT driver design vhdl coding for analog to digital converter
    Text: GS20 0.18-µm CMOS Standard Cell/Gate Array Version 1.0 April 6, 1999 Copyright  Texas Instruments Incorporated, 1999 The information and/or drawings set forth in this document and all rights in and to inventions disclosed herein and patents which might be granted thereon disclosing or employing the


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    k1377

    Abstract: MPA1064DH B1582 M20214 MPA1064KE MPA1016DD MPA1016FN MPA1000 MPA1036DH MPA1036FN
    Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA MPA1000 Product Description future design migration efforts. The combination of automatic tools and gate level architecture is ideal for traditional schematic driven or high level language based design methodologies. In fact, logic synthesis tools were originally


    Original     		PDF MPA1000 RS232 33MHz X11r5 DL201 k1377 MPA1064DH B1582 M20214 MPA1064KE MPA1016DD MPA1016FN MPA1036DH MPA1036FN

    NAND Flash Programmer with TSOP-48 adapter

    Abstract: INTEL Core i7 860 schematic diagram inverter lcd monitor fujitsu MB506 ULTRA HIGH FREQUENCY PRESCALER fujitsu LVDS vga MB89625R VHDL code simple calculator of lcd display JTag Emulator MB90F497 Millbrook BGA TBA 129-5
    Text: Master Product Selector Guide February 2001 Fujitsu Microelectronics, Inc. Contents Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Application Specific ICs ASICs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3


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    KGA0E000BA

    Abstract: kgc0g000dm KGB0F000BA fBGA package tray 12 x 19 FCMSP kga0a000am kgd0h000dm fBGA package tray 12 19 secucalm lsi SoC
    Text: Mobile SoC Code Information • Microcontroller • MSP • MOS August 2009 -1- Part Number Decoder Microcontroller Code Information 1/3 Last Updated : August 2009 S3XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 1. System LSI (S) 7. Rom Master 0 : 0K byte 2 : 2K byte 4 : 4K byte


    Original     		PDF 16-bit 32-bit ARM10 16-bit HT80Cer KGA0E000BA kgc0g000dm KGB0F000BA fBGA package tray 12 x 19 FCMSP kga0a000am kgd0h000dm fBGA package tray 12 19 secucalm lsi SoC

    Date Code Formats Altera EPF10K

    Abstract: ep22v10 5962-9061102XA 5962-8854901xa 8686401LA 5962-8686401LA lift controller in vhdl ALTERA PART MARKING EPM7160 EPX780 transistor b2020
    Text: Introduction Contents March 1995 Introduction The PLD Advantages of Altera


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    exposed QFP 144

    Abstract: exposed QFP 128 TQFP-EP AN 7823 EP 603 QFP-EP 100L 144L JESD51-2 JESD51-7
    Text: QFP-ep Exposed Pad Quad Flat Pack • 7 x 7mm to 24 x 24mm body sizes • 32 to 216 lead count • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 24 x 24mm STATS ChipPAC’s Exposed Pad Quad Flat Pack QFP-ep is a thermally enhanced version of the QFP package. Thermal


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    "Single-Port RAM"

    Abstract: CE71 CE71J1 CE71J2 CE71J3 tb 304
    Text: CE71 Series Embedded Array t 0.25µm CMOS Technology Features 0.18µm Leff 0.24µm drawn Propagation delay of 61 ps Separate core and I/O supply voltages Mixed-signal macros–A/D and D/A converters I/Os: 2.5V, 3.3V, 5V tolerant Core power supply voltage: 2.5V, 1.8V, 1.5V


    Original     		PDF ASIC-FS-20655-11/99 "Single-Port RAM" CE71 CE71J1 CE71J2 CE71J3 tb 304

    MSS30

    Abstract: CE71 CE71J1 CE71J2 CE71J3 dual lvds vhdl fujitsu lvds standard
    Text: CE71 Series Embedded Array t 0.25µm CMOS Technology Features 0.18µm Leff 0.24µm drawn Propagation delay of 61 ps Separate core and I/O supply voltages Mixed-signal macros–A/D and D/A converters I/Os: 2.5V, 3.3V, 5V tolerant Core power supply voltage: 2.5V, 1.8V, 1.5V


    Original     		PDF ASIC-FS-20655-11/99 MSS30 CE71 CE71J1 CE71J2 CE71J3 dual lvds vhdl fujitsu lvds standard

    Arm processor vlsi technology

    Abstract: PC302 QFP 128 bonding
    Text: VLSI T e ch n o lo g y o.5-m ic r o n in c. _ PRELIMINARY ASIC PRODUCT FAMILY GENERAL SPECIFICATIONS FEATURES BENEFITS • 0.5-micron 0.45-micron effective two- and three-layer metal CMOS technology. Typical 2-input NAND (FO=2) spec


    OCR Scan     		PDF 45-micron Arm processor vlsi technology PC302 QFP 128 bonding

    PC5004

    Abstract: VGC650 VGC6P52 VGC600 IN01D1 NR02D1 QFP 128 bonding
    Text: V L S I T ech n o lo gy, inc. O.6-MICRON _ ASIC PRODUCT FAMILY GENERAL SPECIFICATIONS FEATURES BENEFITS • 0.6-micron 0.55-micron effective two- and three-layer metal CMOS technology. Typical 2-input NAND (FO=2) spec - 5 V (4.5 to 5.5 V): 190 ps, 2.6 nW/MHz


    OCR Scan     		PDF 55-micron PC5004 VGC650 VGC6P52 VGC600 IN01D1 NR02D1 QFP 128 bonding

    SSC3020

    Abstract: SSC3030 F1841 SSC3110 F605 SSC3010 SSC3120 SSC3150
    Text: S S C 3 0 0 0 s e r ie s HIGH SPEED CMOS STANDARD CELL • DESCRIPTION The SSC3000 Series is comprised of the SSC3000 and SSC3500 family of standard cells. Each family is offered in 20 preset gate to I/O combinations. Both the SSC3000 and SSC3500 offer high speed and high drive capability


    OCR Scan     		PDF SSC3000 SSC3500 SSC3000Serles SSC3020 SSC3030 F1841 SSC3110 F605 SSC3010 SSC3120 SSC3150

    m60013

    Abstract: M60016 m60011 M60014 z46n M60030 M60024 Z24N M60012 m60043
    Text: A m its u b is h i CMOS GATE ARRAYS ELECTRONIC DEVICE GROUP Mitsubishi CMOS Gate Arrays INTRODUCTION Mitsubishi offers three fami­ lies of CMOS gate arrays: 1.0 /im, 1.3 /j.m, and 2.0 ji.m, with usable gates ranging from 200 to 35,000. The 1.0 and 1.3 p.m devices are


    OCR Scan     		PDF MDS-GA-11-90-RK m60013 M60016 m60011 M60014 z46n M60030 M60024 Z24N M60012 m60043

    Multi-Chip Modules motorola

    Abstract: No abstract text available
    Text: MOTOROLA SC •CNEI'IORY/ASI L^E D b3t.7ESl □Df iTbtn 053 M N0T3 MOTOROLA SEMICONDUCTOR Order by MCMLiD • TECHNICAL DATA Advance Information APPLICATION SPECIFIC MULTICHIP MODULES MCML SERIES MULTICHIP MODULES CMOS/BICMOS SEMICONDUCTORS This specification defines the product characteristics for the MCML Series of


    OCR Scan     		PDF sma098 110T3 Multi-Chip Modules motorola