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    QFN 9X9 Search Results

    QFN 9X9 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    NBSG53AMNG Rochester Electronics LLC 53 SERIES, LOW SKEW CLOCK DRIVER, 1 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), QCC16, 3 X 3 MM, LEAD FREE, QFN-16 Visit Rochester Electronics LLC Buy
    EL9112ILZ Renesas Electronics Corporation Triple Differential Receiver/Equalizer, QFN, /Tube Visit Renesas Electronics Corporation
    ISL59445IRZ Renesas Electronics Corporation 1GHz Triple Multiplexing Amplifiers, QFN, /Tube Visit Renesas Electronics Corporation
    ISL99125BDRZ-T Renesas Electronics Corporation DrMOS (Driver + FET), QFN, / Visit Renesas Electronics Corporation
    ISL99135BDRZ-T Renesas Electronics Corporation DrMOS (Driver + FET), QFN, / Visit Renesas Electronics Corporation

    QFN 9X9 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    AS102

    Abstract: diversity sdio Tuner AS-102 DVB-T Tuner Demodulator SDIO DVB Demodulator dvb-h DVB-T Demodulator Tuner demodulator datasheet
    Text: DVB-T RF Tuner + Demodulator SOC Integrated Mass Mobility Diversity Tuner Production Item Main Feature Application Package Interfaces AS101 DVB-H / T Cellular / Module 5x5mm CSP QFN SPI / SDIO / USB Yes Yes - - AS102 DVB-T PCTV / PND / MP4 / DVD 9x9mm QFN


    Original     		PDF AS101 AS102 AS103 AS102 diversity sdio Tuner AS-102 DVB-T Tuner Demodulator SDIO DVB Demodulator dvb-h DVB-T Demodulator Tuner demodulator datasheet

    AN315

    Abstract: an315 audio power an315 audio AN315 AUDIO AMPLIFIER QFN PACKAGE thermal resistance "thermal via" QFN 9X9 QFN PACKAGE Junction to PCB thermal resistance CS4525 Signal Path Designer
    Text: AN315 Thermal Considerations for QFN Packaged Integrated Circuits Over the past few years, Quad Flat No-Lead QFN packages have become very popular for audio amplifier applications needing efficient power dissipation in small footprints. These packages, shown in Figure 1, are


    Original     		PDF AN315 AN315REV1 AN315 an315 audio power an315 audio AN315 AUDIO AMPLIFIER QFN PACKAGE thermal resistance "thermal via" QFN 9X9 QFN PACKAGE Junction to PCB thermal resistance CS4525 Signal Path Designer

    QFN 64 8x8 dimension

    Abstract: No abstract text available
    Text: WINSLOW ADAPTICs Data Sheet QFN to DIP Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.


    Original     		PDF W13062 W13041 W13028 W13082 W13088 W13024 W13063 W13046 W13083 W13084 QFN 64 8x8 dimension

    QFN 64 8x8 dimension

    Abstract: WA13072DQAET QFN 64 9X9 dimension qfn 64 9x9 qfn 3x3 socket QFN 56 7x7
    Text: WINSLOW ADAPTICs Data Sheet QFN to PGA Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.


    Original     		PDF WA13062DQAET WA13041DQAET WA13028DQAET WA13082DQAET WA13088DQAET WA13024DQAET WA13063DQAET WA13046DQAET WA13083DQAET WA13084DQAET QFN 64 8x8 dimension WA13072DQAET QFN 64 9X9 dimension qfn 64 9x9 qfn 3x3 socket QFN 56 7x7

    QFN 76 9x9 footprint

    Abstract: QFN 64 8x8 footprint qfn 44 PACKAGE footprint 7x7 DIe Size QFN 56 7x7 footprint DUAL ROW QFN leadframe qfn 44 PACKAGE footprint 7x7 qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint QFN 48 7x7 footprint footprint mlf
    Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses


    Original     		PDF

    QFN 64 8x8 dimension

    Abstract: 56 qfn 7x7 2x2 dfn qfn 52 6x6
    Text: WINSLOW ADAPTICs Data Sheet QFN to PGA Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.


    Original     		PDF WA13062DQAET WA13041DQAET WA13028DQAET WA13082DQAET WA13088DQAET WA13024DQAET WA13063DQAET WA13046DQAET WA13083DQAET WA13084DQAET QFN 64 8x8 dimension 56 qfn 7x7 2x2 dfn qfn 52 6x6

    QFN 64 8x8 dimension

    Abstract: DFN 10 socket qfn 52 6x6 3x2 DFN 7x5 qfn venice venice 6
    Text: WINSLOW ADAPTICs Data Sheet QFN to DIP Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.


    Original     		PDF W13062 W13041 W13028 W13082 W13088 W13024 W13063 W13046 W13083 W13084 QFN 64 8x8 dimension DFN 10 socket qfn 52 6x6 3x2 DFN 7x5 qfn venice venice 6

    QFN 64 8x8 dimension

    Abstract: W13028 QFN 7x5 2x2 dfn Winslow qfn 3x3 socket
    Text: WINSLOW ADAPTICs Data Sheet – QFN to DIP Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.


    Original     		PDF W13062 W13041 W13028 W13082 W13088 W13024 W13063 W13046 W13083 W13084 QFN 64 8x8 dimension W13028 QFN 7x5 2x2 dfn Winslow qfn 3x3 socket

    jedec footprint MO-220 VHHD-2

    Abstract: qfn 44 PACKAGE footprint QFN 64 9x9 footprint 32 pins qfn 5x5 footprint jedec package MO-220 64 9x9 WAN0118 WAN_0118 QFN footprint IPC-A-610D QFN 56 7x7 footprint
    Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the


    Original     		PDF

    DUAL ROW QFN leadframe

    Abstract: QFN tray qfn 4x4 JEDEC qfn tray tray qfn 8x8 tray qfn 6x6 QFN tray 8x8 tray qfn 9x9 QFN 64 8x8 PACKAGE TRAY AN 7823 JEDEC qfn tray 5x5
    Text: QFN Quad Flat No-Lead Package • Punch or Saw singulated formats • Body sizes from 2 x 2mm to 12 x 12mm • Pin counts from 4L to 156L • Square or rectangular body sizes • Leads on four sides of the body QFN • Leads on two opposing sides of the


    Original     		PDF

    QFN leadframe

    Abstract: No abstract text available
    Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN, MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface


    Original     		PDF 8MM-56 AK64D900-LGA 9MM-64 CSP08) AK64D900-QFN/MLP AK72D900-QFN/MLP 10X10 10MM-72 CSP09) QFN leadframe

    AK08D300-CLCC

    Abstract: AK08D300-LFCSP2X3 .5mm AK08D300-LFCSP3x3 .5mm AK08D300-MLP.65mm AK10D300-8SON .65mm MLP 3X3 MLP 4X4 AK22D300-DFN AK24D300-LLP MLP 5X5
    Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface


    Original     		PDF 8MM-56 AK64D900-LGA 9MM-64 CSP08) AK64D900-QFN/MLP AK72D900-QFN/MLP 10X10 10MM-72 CSP09) AK08D300-CLCC AK08D300-LFCSP2X3 .5mm AK08D300-LFCSP3x3 .5mm AK08D300-MLP.65mm AK10D300-8SON .65mm MLP 3X3 MLP 4X4 AK22D300-DFN AK24D300-LLP MLP 5X5

    Untitled

    Abstract: No abstract text available
    Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface


    Original     		PDF 8MM-56 AK64D900-LGA 9MM-64 CSP08) AK64D900-QFN/MLP AK72D900-QFN/MLP 10X10 10MM-72 CSP09)

    Untitled

    Abstract: No abstract text available
    Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN, MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface


    Original     		PDF 8MM-56 AK64D900-LGA 9MM-64 CSP08) AK64D900-QFN/MLP AK72D900-QFN/MLP 10X10 10MM-72 CSP09)

    48-PIN

    Abstract: FR30 GIO10 W86L488 W86L488AY W86L488Y ase qfn 48
    Text: W86L488 Winbond Host Interface SD/SDIO/MMC Memory Card Bridge Preliminary W86L488 W86L488 Data Sheet Revision History Pages Version on Web Dates Version 1 08/2002 0.50 First published. 2 12/2002 0.60 Add QFN package. Main Contents 1.Modify pin function of CLK, ACLK,


    Original     		PDF W86L488 W86L488 48-QFN 48-PIN FR30 GIO10 W86L488AY W86L488Y ase qfn 48

    FOOTPRINT MO-229 2X3 SOLDERING

    Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level


    Original     		PDF AN1902 FOOTPRINT MO-229 2X3 SOLDERING Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220

    NP364

    Abstract: QFN11T032-003 QFN11T048-008 QFN11T040-006 QFN 56 7x7 0.5 NP445-048-001 NP445-064-002 NP364-01649 QFN11T032-004 NP445-032-003
    Text: QFN Quad Flat Non-leaded Packages TH Sockets - Open Top and Clamshell Types SMT Devices Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temp.Range: Contact Force: 10,000MΩ min. at 100V DC 500V AC for 1 minute 30mΩ max. at 10mA/20mV max.


    Original     		PDF 10mA/20mV NP445 NP364 QFN11T040-005 QFN11T040-006 QFN11T048-005 QFN11T048-008 QFN11T048-008 A101121-001 NP364 QFN11T032-003 QFN11T040-006 QFN 56 7x7 0.5 NP445-048-001 NP445-064-002 NP364-01649 QFN11T032-004 NP445-032-003

    QFN 64 9x9 footprint

    Abstract: QFN 64 footprint
    Text: 3MTM TEXTOOLTM OPEN-TOP SOCKETS FOR QFN APPLICATIONS NOTES: 1. MATERIALS: SPRINGS CONTACTS IC GUIDES PRESSURE PAD COVER BASE 30 SS Be Cu PES PES PPS or equiv. PES PLATING : Au COLOR : BLACK COLOR : BLACK COLOR : BLACK COLOR : BLACK 2. SEE THE REGULATORY INFORMATION APPENDIX RIA


    Original     		PDF th2475-1 QFN 64 9x9 footprint QFN 64 footprint

    Untitled

    Abstract: No abstract text available
    Text: W86L488 Winbond Host Interface SD/SDIO/MMC Memory Card Bridge W86L488 REVISION HISTORY VERSION DATE 0.50 08/2002 First published. 0.60 12/2002 Add QFN package. 0.70 03/2003 PAGE P6, P11, P26, P43, P46 P8, P24, P41, P44, DESCRIPTION P10, P25, P42, P45, 1. Modify pin function of CLK, ACLK, BCLK,


    Original     		PDF W86L488 W86L488 P4-11, 48-QFN

    PXA27

    Abstract: W86L488AY W86L488Y
    Text: W86L488 Winbond Host Interface SD/SDIO/MMC Memory Card Bridge W86L488 REVISION HISTORY VERSION DATE 0.50 08/2002 First published. 0.60 12/2002 Add QFN package. 0.70 03/2003 PAGE P6, P11, P26, P43, P46 P8, P24, P41, P44, DESCRIPTION P10, P25, P42, P45, 1. Modify pin function of CLK, ACLK, BCLK,


    Original     		PDF W86L488 W86L488 P4-11, 48-QFN 04/200ntended PXA27 W86L488AY W86L488Y

    BD 4914

    Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
    Text: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.


    Original     		PDF AN1902/D BD 4914 QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8

    W86L488

    Abstract: No abstract text available
    Text: W86L488 Winbond Host Interface SD/SDIO/MMC Memory Card Bridge W86L488 REVISION HISTORY VERSION DATE 0.50 08/2002 First published. 0.60 12/2002 Add QFN package. 0.70 03/2003 PAGE P6, P11, P26, P43, P46 P8, P24, P41, P44, DESCRIPTION P10, P25, P42, P45, 1. Modify pin function of CLK, ACLK, BCLK,


    Original     		PDF W86L488 W86L488 P4-11, 48-QFN 04/200ai,

    Untitled

    Abstract: No abstract text available
    Text: W86L488 Winbond Host Interface SD/SDIO/MMC Memory Card Bridge W86L488 REVISION HISTORY VERSION DATE 0.50 08/2002 First published. 0.60 12/2002 Add QFN package. 0.70 03/2003 PAGE P6, P11, P26, P43, P46 P8, P24, P41, P44, DESCRIPTION P10, P25, P42, P45, 1. Modify pin function of CLK, ACLK, BCLK,


    Original     		PDF W86L488 W86L488 P4-12, 48-QFN

    PIC18F45K22

    Abstract: PIC18F46K22 pic18f25k22 PIC18F26k22 PIC18F23K22 PIC18F67K22 40 pin PIC18F46K22 Pic18f24k22 DS41398 PIC18LF46K22
    Text: PIC18F “K22” Family of Microcontrollers Broadest Line of Low Power, 5V 8-bit MCUs Summary The nanoWatt XLP PIC18F “K22” Flash Family of microcontrollers offer all of the advantages of the well recognized PIC18F High Performance MCUs; C compiler optimized architecture and an industry leading peripheral


    Original     		PDF PIC18F PIC18F 12-bit com/PIC18K22 DS41438A DS41438A* PIC18F45K22 PIC18F46K22 pic18f25k22 PIC18F26k22 PIC18F23K22 PIC18F67K22 40 pin PIC18F46K22 Pic18f24k22 DS41398 PIC18LF46K22