PACKAGE TRAY PGA Search Results

PACKAGE TRAY PGA Result Highlights (5)

Part	Manufacturer	Description
TPH9R00CQH	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N)
TPH2R408QM	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance
XPH2R106NC	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF)
XPH3R206NC	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF)
TPH4R008QM	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N)

PACKAGE TRAY PGA Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: Unit : mm 276±1.0 32±1.0 212±1.0 159±1.0 223±1.0 53±0.5 40.5 32±1.0 53±0.5 40.5 15 Applied Package 175-pin Ceramic PGA Quantity PCS MAX. 20 Tray Material Heat Proof Temp. Surface resistance LA-099 Carbon PVC 70°C less than 1x106Ω /	Original	PDF	175-pin LA-099
JEDEC to 243 Abstract: PGA JEDEC tray Text: 53.1 62.0 37.0 A A' 60.8 243.2 315.0 322.6 35.9 3M 21001-301 53.1 PGA 20x20 SECTION A – A' 53.1 12.2 8.6 10.2 135.9 UNIT : mm Applied Package Quantity (pcs) 447-pin ceramic PGA MAX. 10 Tray Material Heat Proof Temp. Surface resistance PGA 20×20 Carbon fiber PC	Original	PDF	447-pin JEDEC to 243 PGA JEDEC tray
DSP56001AFC33 Abstract: DSP56001A DSP56001AFE33 hack br mark Text: Pin-out and Package PQFP Top View Package and Tray Descriptions 1 18 Orientation Mark chamfered edge DSP56001AFC33 (Top View) 51 84 nc D20 D19 D18 GNDD GNDD nc D17 D16 nc D15 D14 D13 nc D12 VCCD VCCD D11 nc D10 D9 nc D8 D7 D6 GNDD GNDD nc D5 D4 D3 D2 nc	Original	PDF	DSP56001AFC33 88-pin DSP56001A DSP56001AFC33 DSP56001AFE33 hack br mark
Package tray PGA Abstract: LA-061 Text: Unit : mm 276±1.0 37.5±1.0 201±1.0 223±1.0 148.5±1.0 74.25±0.5 49 37.25±1.0 67±0.5 LA-061 15 49 Applied Package Quantity pcs 179-pin Ceramic PGA 223-pin Ceramic PGA 280-pin Ceramic PGA Tray Material MAX. 12 Heat Proof Temp. LA-061 Carbon PVC 70°C	Original	PDF	LA-061 179-pin 223-pin 280-pin Package tray PGA LA-061
micro SD socket Abstract: PGA socket 479 socket 479 mobile pentium 4 Text: This document was generated on 01/06/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0512484792 Planned for Obsolescence 1.27mm .050" Pitch Micro PGA Socket for Mobile Pentium* 4, Ball Grid Array (BGA) Mount, ZIF, 479 Circuits, with Pick and Place Cover, Tray Package, 0.25µm (10µ")	Original	PDF	PS-51248-005 51248Series SD-51248-003 micro SD socket PGA socket 479 socket 479 mobile pentium 4
LA-061 Abstract: 223PIN Text: Unit : mm 276±1.0 37.5±1.0 201±1.0 223±1.0 148.5±1.0 74.25±0.5 49 37.25±1.0 67±0.5 LA-061 15 49 Applied Package Quantity pcs Material 179-pin Ceramic PGA 223-pin Ceramic PGA 280-pin Ceramic PGA 280-pin Plastic PGA with Heat Sink Tray MAX. 12 Heat Proof Temp.	Original	PDF	LA-061 179-pin 223-pin 280-pin LA-061 223PIN
Untitled Abstract: No abstract text available Text: UNIT : mm 276±1.0 42±1.0 192±1.0 52.2 135±1.0 LA-A76 52.2 15 223±1.0 67.5±0.5 44±1.0 64±0.5 Tray LA-A76 Carbon PVC Material Heat Proof Temp. 50°C Surface resistance less than 1x10 Ω/ Applied Package 6 Quantity pcs 447-pin ceramic PGA with METALSLUG	Original	PDF	LA-A76 447-pin
LA-0509 Abstract: No abstract text available Text: Unit : mm 276±1.0 158±1.0 59±1.0 88.5±0.5 LA–0509 65 25 223±1.0 65 67.25±1.0 79±0.5 Applied Package Quantity pcs 179pin Ceramic PGA Seam Weld MAX. 6 Tray Material Heat Proof Temp. LA-0509 Carbon PVC 70°C 6 Surface resistance less than 1 x 10 Ω /	Original	PDF	179pin LA-0509 LA-0509
la029a Abstract: No abstract text available Text: unit : mm 276 ±1.0 212 ±1.0 32 ± 1.0 223±1.0 159 ±1.0 53±0.5 39 32 ±1.0 53 ±0.5 LA-029-A 15 39 Tray LA-029-A Carbon PVC Material 70 ° C Heat Proof Temp. Surface resistance 6 less than 1 x 10 Ω / Applied package Quantity pcs 120pin plastic PGA	Original	PDF	LA-029-A 120pin 132pin 176pin 288pin 24pin la029a
PGA JEDEC tray Abstract: 3M 21001 528pin Text: 37 55.7 62 135.9 UNIT : mm A A' 55.7 73.5 47.3 220.5 315.0 322.6 3M21001-302 PGA 21x21–155 SECTION A-A' 8.6 12.2 10.2 55.7 Applied Package Quantity (pcs) 528-pin •ceramic PGA MAX. 8 Tray Material Heat Proof Temp. PGA 21×21 Carbon fiber PC 105°C Surface resistance less than 1×1012 Ω /	Original	PDF	3M21001-302 528-pin PGA JEDEC tray 3M 21001 528pin
MD300-10A Abstract: QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA Text: CHAPTER 4 CHAPTER 4 4.1 PACKING STYLES AND NOTES 4.1.1 Packing Styles 4.1.2 Notes on Handling 4.2 PACKING OF IC PACKAGES 4.2.1 List of Packing 1 DIP (2) SIP, V-DIP, ZIP (3) QUIP, Piggyback (4) PGA (5) SOP, SSOP (6) TSOP (I) (II) (7) QFP, QFP (FP) (8) SVP	Original	PDF	S64F1-CA1 S108S1-YHC P116S1-YJC S144S1-YKC S176S1-2C S224S1-3C-1 S304S1-6C S256N7-B6 S352N7-F6-1 S420N7-F6 MD300-10A QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA
CMOS PRESSURE SENSOR BLOOD Abstract: i2c sensor SSOP14 ZMD31020 ZMD31020AB ZMD31020AC ZMD31020AD ZMD31020AF ZMD31020DK ZMD AG Text: ZMD31020 Differential Sensor Signal Conditioner Feature Sheet Features Description • Digital compensation of sensor offset, sensitivity, temperature drift and non-linearity • Adjustable to a broad range of resistive bridge sensor types by PGA and programmable ADC	Original	PDF	ZMD31020 52mV/V 100Hz SSOP14 ZMD31020 CMOS PRESSURE SENSOR BLOOD i2c sensor ZMD31020AB ZMD31020AC ZMD31020AD ZMD31020AF ZMD31020DK ZMD AG
MD300-10A Abstract: P32C-100-600A p20d100 C-PGA176-S15U-2 CDIP28 LA-0543A tray bga P-TQFP100-14X20-0 0x20010 P14DH-100-300A2-1 Text: Find tool 1. Click button in the Toolbar. 2. Search dialog box is displayed. 3. Enter a NEC code to be searched and click Find . Caution Don't use the wild card *) when entering a NEC code. Ex.) Find Find What P22C-100-300A-1 Match Whole Word Only Match Case	Original	PDF	P22C-100-300A-1 P8C-100-300B P-DIP8-0300-2 MD300-2A P8CT-100-300B2-1 MD300-1A P8C-100-300A-1 X13769XJ2V0CD00 MD300-10A P32C-100-600A p20d100 C-PGA176-S15U-2 CDIP28 LA-0543A tray bga P-TQFP100-14X20-0 0x20010 P14DH-100-300A2-1
21x21 Abstract: MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1 Text: 検索ツール 1. ツールバーのアイコンをクリックしてください。 2. ［検索］のダイアログ・ボックスが表示されます。 3. 検索したいパッケージのNECコードを入力して，検索 F をクリックしてください。	Original	PDF	P22C100300A1 P8C-100-300B P8CT-100-300B2-1 P8C-100-300A-1 P-DIP8-0300-2 MD300-2A MD300-1A MD300-09A 21x21 MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1

daewon tray Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA	Original	PDF	AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
tray datasheet bga Abstract: fujitsu ic trays sol Text: Packing for Shipment • Packing form The packaging used to deliver products consits of tubes, trays, tapes, inner boxes, and an outer box. See Figures 1 to 7. The tubes, trays, and tapes are designed to protect the products from damage. After unpacking	Original	PDF	DB81-10008-2E DB81-10005-1E tray datasheet bga fujitsu ic trays sol
NEC A39A Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B Text: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES	Original	PDF	C10943XJ6V0IF00 IEI-635, IEI-1213) ED-7411 NEC A39A NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
LGA 1155 Socket PIN diagram Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08 Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and	Original	PDF
footprint jedec MS-026 TQFP Abstract: footprint jedec MS-026 LQFP JEDEC TRAY ssop footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP 44 MS-026 BED BGA package tray 40 x 40 AMD Package moisture MO-069 footprint jedec MS-026 TQFP 144 Text: u Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Surface-Mount Array Packages Column Grid Array Packages Surface-Mount Leaded Packages Thru-Hole Packages Packages and Packing Publication Revision A 3/1/03 2-1 u Chapter 2 Package Design SURFACE-MOUNT ARRAY PACKAGES	Original	PDF
composite to rgb Abstract: PGA-120 CCIR 601 matrix Video Filters 24 RGB polar modulator ML6417CHX RGB mixer composite input to rgb output CCIR601 Text: Analog and Mixed Signal Channels HDTV Input Package Packing Video ICs — Analog Filters and Buffers ML6415CS ML6415CSX S-Video Filter with Summed Composite Output, YC/Composite Sound Trap and Group Delay Compensation YC/Composite 7.1 2 No Yes SO-8 Tube TnR	Original	PDF	ML6415CS ML6415CSX ML6416CS ML6416CSX ML6417CHX* LQFP32 ML6426CS1 ML6426CS1X ML6415DEMO ML6415 composite to rgb PGA-120 CCIR 601 matrix Video Filters 24 RGB polar modulator ML6417CHX RGB mixer composite input to rgb output CCIR601
LA-072 Abstract: No abstract text available Text: Unit : mm 276±1.0 37.5±1.0 201±1.0 148.5±1.0 LA-072 58.0 15.0 223±1.0 74.25±0.5 58.0 37.25±1.0 67±0.5 Applied Package Quantity pcs 447-pin Ceramic PGA with Heat Sink 528-pin Ceramic PGA with Heat Sink (I-Lead Type) 528-pin Ceramic PGA with Seam Weld	Original	PDF	LA-072 447-pin 528-pin LA-072
strapack s-669 Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga Text: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,	Original	PDF
10C2 Abstract: 144PFB-A 48P4B 16P2S-A 240mil hssop Package tray dimension 12P9 16P2Z-A 18P4G Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.1 INDIVIDUAL PACKS Each type of package is used to carry individually packed products as listed below: PACKAGE AND INDIVIDUAL PACK LIST Package Type SIP HSIP ZIP DIP SDIP Package Name Standard Dimension	Original	PDF	12P9B 14P5A 16P5A 20P5A 24P5A 18P4G 20P4G 22P4H 24P4D 24P4Y 10C2 144PFB-A 48P4B 16P2S-A 240mil hssop Package tray dimension 12P9 16P2Z-A 18P4G
processor Abstract: l3bc FV80524RX433128 MPM21PDA400B MMC-2 80524KX400256 MPM22PDA400A MPM22PDA400B MPPM1PDA400A MPPM1PDA400B Text: Product Change Notification Please respond to your distributor if you have any issues with the timeline or content of this change. No response from customers will be deemed as acceptance of the change and the change will be implemented pursuant to the key milestones set forth in this attached PCN.	Original	PDF	FV80524RX433128 433MHz processor l3bc FV80524RX433128 MPM21PDA400B MMC-2 80524KX400256 MPM22PDA400A MPM22PDA400B MPPM1PDA400A MPPM1PDA400B

PACKAGE TRAY PGA Search Results

PACKAGE TRAY PGA Result Highlights (5)

PACKAGE TRAY PGA Datasheets Context Search

Untitled

JEDEC to 243

DSP56001AFC33

Package tray PGA

micro SD socket

LA-061

Untitled

LA-0509

la029a

PGA JEDEC tray

MD300-10A

CMOS PRESSURE SENSOR BLOOD

MD300-10A

21x21

daewon tray

tray datasheet bga

NEC A39A

LGA 1155 Socket PIN diagram

footprint jedec MS-026 TQFP

composite to rgb

LA-072

strapack s-669

10C2

processor