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    MATERIAL DECLARATION SEMICONDUCTOR PACKAGE Search Results

    MATERIAL DECLARATION SEMICONDUCTOR PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPHR7404PU Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 0.00074 Ω@10V, SOP Advance, U-MOS-H Visit Toshiba Electronic Devices & Storage Corporation
    XPH13016MC Toshiba Electronic Devices & Storage Corporation P-ch MOSFET, -60 V, -60 A, 0.0099 Ω@-10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH8R316MC Toshiba Electronic Devices & Storage Corporation P-ch MOSFET, -60 V, -90 A, 0.0064 Ω@-10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH3R10AQM Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 100 V, 120 A, 0.0031 Ω@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation

    MATERIAL DECLARATION SEMICONDUCTOR PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    antimony trioxide epoxy molding

    Abstract: material declaration semiconductor package Material declaration organic materials oxygen material declaration amd 104 c1k
    Text: ‹ Chapter 4 Package Materials Material Declaration Data Sheets. AMD has created material data sheets for some of its more popular package designs. These data sheets are organized as follows: • Suface-Mount Array Packages Š PBGA, page 6-19 • Surface-Mount Leaded Packages


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    PDF

    PGA68

    Abstract: clcc44 SO53 material declaration semiconductor package FDIP28 schottky diode sb 5400 CLCC68 CLCC52 smd transistor marking 7622 DIP40 weight
    Text: CHEMICAL CONTENT OF SEMICONDUCTOR PACKAGING SEPTEMBER 1998 Corp. Environment Strategies Corp. Package Development USE IN LIFE SUPPORT DEVICES OR SYSTEMS MUST BE EXPRESSLY AUTHORIZED STMicroelectronics PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE


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    PDF GS-150T 102x51x19 GS-100T GS-R1005 PGA68 clcc44 SO53 material declaration semiconductor package FDIP28 schottky diode sb 5400 CLCC68 CLCC52 smd transistor marking 7622 DIP40 weight

    VSC8664XIC-03

    Abstract: VSC8664 VSC8664XIC VSC8664IC VSC8664IC-03 transformerless ethernet design VSC8664 PCB design guide VSC8634 VSC8634XIC VSC8634IC
    Text: Printer Friendly Page Page 1 of 3 Home » Products » 1GE PHYs » VSC8634 Quad 10/100/1000BASE-T Transceiver The VSC8634 is a low-power quad Gigabit Ethernet transceiver ideal for high-density switch and router applications. The device's compact package is optimal for multiport switch applications. Vitesse's mixed signal and


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    PDF VSC8634 10/100/1000BASE-T VSC8634 10BASE-T, 100BASE-TX, 1000BASE-T 1000BASE-T) VSC8664XIC-03 VSC8664 VSC8664XIC VSC8664IC VSC8664IC-03 transformerless ethernet design VSC8664 PCB design guide VSC8634XIC VSC8634IC

    J-STD-020 MSL Rating

    Abstract: "IPC 1752" gold material declaration semiconductor package G8211
    Text: This document is a declaration of the substances within the manufacturer listed item s . Note: if the item(s) is an assembly with lower level parts, the declaration encompasses all lower level materials for which the manufacturer has Copyright 2005. IPC, Bannockburn, Illinois. All rights reserved under engineering responsibility.


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    PDF IPC-1752 J-STD-020 MSL Rating "IPC 1752" gold material declaration semiconductor package G8211

    material declaration vishay

    Abstract: asbestos safety TbA 8220 m CAS No. 28064-14-4 DO-214 diode 84084 material declaration semiconductor package sot-363 Package material 28064-14-4 40039
    Text: VISHAY Vishay Semiconductors The Constituents of Semiconductor Components Responsible electronic component and equipment manufacturers are already preparing for the time when the lifespan of their products comes to an end by scrutinizing the materials incorporated and their


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    PDF LLP-75 29-Apr-04 material declaration vishay asbestos safety TbA 8220 m CAS No. 28064-14-4 DO-214 diode 84084 material declaration semiconductor package sot-363 Package material 28064-14-4 40039

    material declaration semiconductor package

    Abstract: asbestos safety material declaration vishay 89901 DO-219AB 58018
    Text: Vishay Semiconductors The Constituents of Semiconductor Components Responsible electronic component and equipment manufacturers are already preparing for the time when the lifespan of their products comes to an end by scrutinizing the materials incorporated and their


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    PDF LLP-75 06-May-04 material declaration semiconductor package asbestos safety material declaration vishay 89901 DO-219AB 58018

    40039

    Abstract: SOD-523 DO-219AB Germanium DO-35 DIODE 89901 cd 4553 material declaration vishay asbestos DO-219AB germanium diode SOD323
    Text: VISHAY Vishay Semiconductors The Constituents of Semiconductor Components Responsible electronic component and equipment manufacturers are already preparing for the time when the lifespan of their products comes to an end by scrutinizing the materials incorporated and their


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    PDF LLP-75 06-May-04 40039 SOD-523 DO-219AB Germanium DO-35 DIODE 89901 cd 4553 material declaration vishay asbestos DO-219AB germanium diode SOD323

    Untitled

    Abstract: No abstract text available
    Text: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: desktop motherboard (cpu board) Model designation: D955XCS Date: 27 June 2005 Lead-free product: Yes, containing (2) SLI chipsets


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    PDF D955XCS

    SE7230NH1

    Abstract: No abstract text available
    Text: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: desktop board Model designation: SE7230NH1 Date: 12 June 2006 Product weight: 726.2 grams Lead-free product: Lead-free Second Level Interconnects (SLI) only


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    PDF SE7230NH1 SE7230NH1

    d945gtp

    Abstract: intel d945gtp
    Text: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: desktop motherboard Model designation: D945GTP Date: 07 June 2005 Product weight: 475.9 grams Lead-free product: Lead-free Second Level Interconnect (2LI)


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    PDF D945GTP D85051-001 d945gtp intel d945gtp

    DG965WH

    Abstract: No abstract text available
    Text: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: desktop motherboard Model designation: DG965WH Date: 27 July 2006 Product weight: 731 grams Lead-free product: Lead-free Second Level Interconnect (SLI)


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    PDF DG965WH D85051-001 DG965WH

    DQ33HS

    Abstract: Desktop motherboard
    Text: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: desktop motherboard Model designation: DQ33HS Date: 01 November 2007 Product weight: 589.5 grams Lead-free product: Lead-free Second Level Interconnect (SLI)


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    PDF DQ33HS D85051-001 DQ33HS Desktop motherboard

    DX38BT

    Abstract: No abstract text available
    Text: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: desktop motherboard Model designation: DX38BT Date: 15 October 2007 Product weight: 908.1 grams Lead-free product: Lead-free Second Level Interconnect (SLI)


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    PDF DX38BT D85051-001 DX38BT

    intel material declaration

    Abstract: DQ963FX
    Text: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: desktop motherboard Model designation: DQ963FX Date: August 04 2006 Product weight: 720 grams Lead-free product: Lead-free Second Level Interconnect (SLI)


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    PDF DQ963FX D85051-001 intel material declaration DQ963FX

    BLKDB43LD

    Abstract: No abstract text available
    Text: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Date: 23 April 2009 Equipment type: Desktop CPU Board Lead-free product: Lead-free Second Level Interconnect (SLI) Product Codes: BOXDQ43AP, BLKDQ43AP, BLKDB43LD


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    PDF BOXDQ43AP, BLKDQ43AP, BLKDB43LD D85051-001 BLKDB43LD

    Untitled

    Abstract: No abstract text available
    Text: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Date: 20 April 2009 Lead-free product: Lead-free Second Level Interconnect (SLI) Equipment type: Server CPU Board Product Code: WX58BP (BOXWX58BP, BLKWX58BP)


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    PDF WX58BP BOXWX58BP, BLKWX58BP) D85051-001

    DP55WB

    Abstract: No abstract text available
    Text: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: Desktop CPU Board Product Code: DP55WB Date: 07 August 2009 Lead-free product: Lead-free Second Level Interconnect (SLI) RoHS Definitions :


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    PDF DP55WB D85051-001 DP55WB

    DG33TL

    Abstract: No abstract text available
    Text: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: desktop motherboard Model designation: DG33TL Date: 25 May 2007 Product weight: 639.6 grams Lead-free product: Lead-free Second Level Interconnect (SLI)


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    PDF DG33TL D85051-001 DG33TL

    D945GCNL

    Abstract: intel d945gcnl d945gcnl intel motherboard D945GC types of motherboard motherboard chip level
    Text: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: Desktop Motherboard Model designation: D945GCNL Date: 05 June 2007 Product weight: 619.3 grams Lead-free product: Lead-free Second Level Interconnect (SLI)


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    PDF D945GCNL D85051-001 D945GCNL intel d945gcnl d945gcnl intel motherboard D945GC types of motherboard motherboard chip level

    DQ965

    Abstract: DQ965WC
    Text: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: desktop motherboard Model designation: DQ965WC Date: 18 Aug 2006 Product weight: 581 grams Lead-free product: Lead-free Second Level Interconnect (SLI)


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    PDF DQ965WC D85051-001 DQ965 DQ965WC

    DX48BT

    Abstract: No abstract text available
    Text: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: desktop motherboard Model designation: DX48BT Date: 05 December 2007 Product weight: 908.1 grams Lead-free product: Lead-free Second Level Interconnect (SLI)


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    PDF DX48BT D85051-001 DX48BT

    DP965LT

    Abstract: No abstract text available
    Text: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: desktop motherboard Model designation: DP965LT Date: 31 May 2006 Product weight: 710.3 grams Lead-free product: Lead-free Second Level Interconnect (SLI)


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    PDF DP965LT D85051-001 DP965LT

    D945GCPE

    Abstract: intel d945gcpe Desktop motherboard
    Text: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: Desktop Motherboard Model designation: D945GCPE Date: 30 June 2007 Product weight: 619.3 grams Lead-free product: Lead-free Second Level Interconnect (SLI)


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    PDF D945GCPE D85051-001 D945GCPE intel d945gcpe Desktop motherboard

    asbestos

    Abstract: DQ965CO
    Text: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: desktop motherboard Model designation: DQ965CO Date: 28 July 2006 Product weight: 684.4 grams Lead-free product: Lead-free Second Level Interconnect (SLI)


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    PDF DQ965CO D85051-001 asbestos DQ965CO