LQFP-48 thermal pad
Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /
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TQFP 100 pin ic
Abstract: 208ld
Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features: ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /
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MS-026 lqfp 80
Abstract: DS170G MS-026 JEDEC Matrix Tray outlines LQFPPOWERQUAD2 CS-007
Text: LEADFRAME data sheet LQFP PowerQuad 2 Features: LQFP PowerQuad® 2 Packages: LQFP PowerQuad® 2 PQ2 is the same Amkor patented, advanced IC packaging technology used in plastic QFPs but applied to Low Profile 1.4 mm QFPs (LQFP). This breakthrough in IC packaging
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CX20493
Abstract: conexant cx20493 reference design msr 900 reader TRANSISTOR C940
Text: CX81801-7x/8x SmartV.XX V.92/V.34/V.32bis Modem in 128-Pin LQFP with CX20493 SmartDAA in 32-Pin LQFP and Optional CX20442 Voice Codec Data Sheet Doc. No. 102247B October 30, 2003 CX81801-7x/8x SmartV.XX Modem in 128-Pin LQFP with CX20493 in 32-Pin LQFP Data Sheet
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CX81801-7x/8x
32bis
128-Pin
CX20493
32-Pin
CX20442
102247B
conexant cx20493 reference design
msr 900 reader
TRANSISTOR C940
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LQFP 208
Abstract: ZL3806 LQFP208 LBGA-100
Text: Voice Echo Cancellation VOICE PROCESSING VOICE/DATA 8 4 64(128) 0.056 100 pin LQFP, 208 ball LBGA ZL50235 16(8) 64(128) 0.088 100 pin LQFP, 208 ball LBGA MT9300B 32(16) 64(128) 1 160 pin MQFP, 208 ball LBGA MT93L00 32(16) 64(128) 0.15 100 pin LQFP, 208 ball LBGA
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IEEE-1149
164/G165
MT9122
MT9123
ZL50233
ZL50234
ZL50235
MT9300B
MT93L00
ZL50232
LQFP 208
ZL3806
LQFP208
LBGA-100
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JEDEC MS-026
Abstract: MS-026 Amkor mold compound lqfp 7x7 tray jedec MS-026-A
Text: LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack LQFP Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers
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MS-026
JEDEC MS-026
MS-026
Amkor mold compound
lqfp 7x7 tray
jedec MS-026-A
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lqfp 7x7 tray
Abstract: MS-026 7X748LD amkor
Text: LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack LQFP Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers
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MS-026
lqfp 7x7 tray
MS-026
7X748LD
amkor
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Techpoint
Abstract: 100L JESD51-2 JESD51-7 lqfp 7x7 tray QFP 128 bonding
Text: LQFP Low Profile Quad Flat Pack • 7 x 7mm to 28 x 28mm body sizes • 32 to 208 lead counts • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 28 x 28mm STATS ChipPAC’s LQFP is a low profile 1.4mm version of the QFP. The LQFP is a leadframe based, plastic encapsulated
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NQPACK100SD-ND
Abstract: SS01-71039-1E NQPACK100SD-ND-SL
Text: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-71039-1E DSU-FR EMULATOR LQFP-100P HEADER TYPE 4 MB2198-126 OPERATION MANUAL PREFACE Thank you for purchasing the LQFP-100P header type 4 MB2198-126 for the DSU-FR emulator. The LQFP-100P header type 4 is used to connect the DSU-FR emulator (MB2198-01, referred to as
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SS01-71039-1E
LQFP-100P
MB2198-126
MB2198-126)
MB2198-01,
MB91260
LQFP-100P
NQPACK100SD-ND
SS01-71039-1E
NQPACK100SD-ND-SL
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NQPACK100SD-ND-SL
Abstract: NQPACK100 LQFP-100P MB91270 PGA-401P 134b25 66A46
Text: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-71048-1E DSU-FR EMULATOR LQFP-100P HEADER TYPE5 MB2198-129 OPERATION MANUAL PREFACE Thank you for purchasing the LQFP-100P header type5 MB2198-129 for the DSU-FR emulator. The LQFP-100P header type5 is used to connect the DSU-FR emulator (MB2198-01*3) and the
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SS01-71048-1E
LQFP-100P
MB2198-129
MB2198-129)
MB2198-01
PGA-401P
MB2198-130
MB91270
NQPACK100SD-ND-SL
NQPACK100
134b25
66A46
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MB2147-01
Abstract: F2MC-16 Socket IC 80 pin LQFP MB90820
Text: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-71037-1E F2MC-16 Family EMULATOR LQFP-80P PROBE HEADER TYPE2 MB2147-561 OPERATION MANUAL PREFACE Thank you for purchasing the LQFP-80P probe header type2 MB2147-561 for the F2MC-16 family emulator. The LQFP-80P probe header type2 is used to connect the F2MC-16L/16LX emulator (MB2147-01,
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SS01-71037-1E
F2MC-16
LQFP-80P
MB2147-561
MB2147-561)
F2MC-16L/16LX
MB2147-01,
MB2147-01
Socket IC 80 pin LQFP
MB90820
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NQPACK080SB-SL
Abstract: F2MC-16 MB2147-01 MB90820 LQFP-80
Text: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-71038-1E F2MC-16 Family EMULATOR LQFP-80P PROBE HEADER TYPE 3 MB2147-562 OPERATION MANUAL PREFACE Thank you for purchasing the LQFP-80P probe header type 3 MB2147-562 for the F2MC-16 family emulator. The LQFP-80P probe header type 3 is used to connect the F2MC-16L/16LX emulator (MB2147-01,
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SS01-71038-1E
F2MC-16
LQFP-80P
MB2147-562
MB2147-562)
F2MC-16L/16LX
MB2147-01,
NQPACK080SB-SL
MB2147-01
MB90820
LQFP-80
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a8293
Abstract: FPT-64P-M09 MB91265 NQPACK064SB PGA-401P
Text: FUJITSU MICROELECTRONICS SUPPORT SYSTEM SS01-71126-1E DSU-FR EMULATOR LQFP-64P HEADER MB2198-128-E OPERATION MANUAL PREFACE Thank you for purchasing the LQFP-64P*1 header MB2198-128-E for the DSU-FR*2 emulator. The LQFP-64P header is used in the adapter unit to connect the DSU-FR emulator (MB2198-01-E)*3
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SS01-71126-1E
LQFP-64P
MB2198-128-E
MB2198-128-E)
MB2198-01-E)
PGA-401P
MB2198-130-E)
MB91265
a8293
FPT-64P-M09
NQPACK064SB
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71051
Abstract: F2MC-16 F2MC-16LX MB2147-01 MB90F983 NQPACK064SD-ND NQPACK064SD-ND-SL
Text: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-71051-2E F2MC-16 Family EMULATOR LQFP-64P PROBE HEADER MB2147-541 OPERATION MANUAL PREFACE Thank you for purchasing the LQFP-64P *1 probe header MB2147-541 for the F2MC-16 family emulator. The LQFP-64P probe header is a header board *2 used to connect the F2MC-16L/16LX emulator
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SS01-71051-2E
F2MC-16
LQFP-64P
MB2147-541
LQFP-64P
MB2147-541)
F2MC-16L/16LX
MB2147-01)
71051
F2MC-16LX
MB2147-01
MB90F983
NQPACK064SD-ND
NQPACK064SD-ND-SL
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NQPACK144SD-ND
Abstract: NQPACK144SD-ND-SL FPT-144P-M08 MB91220 PGA-401P Socket IC 80 pin LQFP Package FPT-144P-M08
Text: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-71052-2E DSU-FR EMULATOR LQFP-144P HEADER TYPE8 MB2198-132 OPERATION MANUAL PREFACE Thank you for purchasing the LQFP-144P *1 header type 8 MB2198-132 for the DSU-FR *2 emulator. The LQFP-144P header type 8 (MB2198-132) is a header used to connect the DSU-FR emulator
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SS01-71052-2E
LQFP-144P
MB2198-132
LQFP-144P
MB2198-132)
MB2198-01)
PGA-401P
MB2198-130)
NQPACK144SD-ND
NQPACK144SD-ND-SL
FPT-144P-M08
MB91220
Socket IC 80 pin LQFP
Package FPT-144P-M08
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LQFP 128 pin Socket
Abstract: No abstract text available
Text: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-71040-1E DSU-FR EMULATOR LQFP-64P HEADER MB2198-128 OPERATION MANUAL PREFACE Thank you for purchasing the LQFP-64P header MB2198-128 for the DSU-FR emulator. The LQFP-64P header is used in the adapter unit to connect the DSU-FR emulator (MB2198-01, referred to as "emulator") and the DSU-FR emulator PGA-401P adapter type2 (MB2198-130, referred
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SS01-71040-1E
LQFP-64P
MB2198-128
MB2198-128)
MB2198-01,
PGA-401P
MB2198-130,
MB91265
LQFP 128 pin Socket
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MARK A48
Abstract: LQFP-100P MB91260 PGA401P
Text: FUJITSU MICROELECTRONICS SUPPORT SYSTEM SS01-71124-1E DSU-FR EMULATOR LQFP-100P HEADER TYPE 4 MB2198-126-E OPERATION MANUAL PREFACE Thank you for purchasing the LQFP-100P*1 header type 4 MB2198-126-E for the DSU-FR*2 emulator. The LQFP-100P header type 4 is used to connect the DSU-FR emulator (MB2198-01-E)*3 to a user
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SS01-71124-1E
LQFP-100P
MB2198-126-E
MB2198-126-E)
MB2198-01-E)
MB91260
LQFP-100P)
MARK A48
PGA401P
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5604BC Rev. 10, 11/2012 MPC5604B/C MAPBGA–225 QFN12 144 LQFP ##_mm_x_##mm 208 MAPBGA 15 mm x 15 mm 17 x 17 x 1.7 mm MPC5604B/C SOT-343R ##_mm_x_##mm 100 LQFP (14 x 14 x 1.4 mm)
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MPC5604BC
MPC5604B/C
QFN12
OT-343R
32-bit
e200z0)
16-bit
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FPT-208P-M06
Abstract: lqfp 52
Text: LOW PROFILE QUAD FLAT PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC FPT-208P-M06 208-pin plastic LQFP FPT-208P-M06 208-pin plastic LQFP (FPT-208P-M06) Lead pitch 0.50 mm Package width x package length 28.0 × 28.0 mm Lead shape Gullwing Sealing method
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FPT-208P-M06
208-pin
FPT-208P-M06)
P-LFQFP208-28
F208027S-c-3-3
FPT-208P-M06
lqfp 52
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MPC5604B
Abstract: mpc5604 MPC5603 MPC5602B MPC5607 trace MPC56 MPC560 ic lm 4704 MPC5603B ordering MPC56
Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5604BC Rev. 8, 11/2010 MPC5604B/C MAPBGA–225 QFN12 144 LQFP ##_mm_x_##mm 208 15 MAPBGA mm x 15 mm 17 x 17 x 1.7 mm MPC5604B/C Microcontroller Data Sheet SOT-343R ##_mm_x_##mm 100 LQFP
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MPC5604BC
MPC5604B/C
QFN12
OT-343R
32-bit
e200z0)
MPC5604B
mpc5604
MPC5603
MPC5602B
MPC5607
trace MPC56
MPC560
ic lm 4704
MPC5603B ordering
MPC56
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LQFP 208
Abstract: FPT-208P-M06
Text: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC FPT-208P-M06 208-pin plastic LQFP Lead pitch 0.50 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold FPT-208P-M06 208-pin plastic LQFP
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FPT-208P-M06
208-pin
FPT-208P-M06)
F208027S-1C-1
LQFP 208
FPT-208P-M06
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5604BC Rev. 12, 04/2014 MPC5604B/C MAPBGA–225 QFN12 144 LQFP ##_mm_x_##mm 208 MAPBGA 15 mm x 15 mm 17 x 17 x 1.7 mm MPC5604B/C SOT-343R ##_mm_x_##mm 100 LQFP (14 x 14 x 1.4 mm)
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MPC5604BC
MPC5604B/C
QFN12
OT-343R
32-bit
e200z0)
16-bit
32-bit
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Untitled
Abstract: No abstract text available
Text: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-71044-1E DSU-FR EMULATOR LQFP-144P HEADER TYPE7 MB2198-131 OPERATION MANUAL PREFACE Thank you for purchasing the LQFP-144P header type7 MB2198-131 for the DSU-FR emulator. The LQFP-144P header type7 is used in the adapter unit to connect the DSU-FR emulator (MB219801, re-ferred to as "emulator") and the DSU-FR emulator PGA-401P adapter type2 (MB2198-130,
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SS01-71044-1E
LQFP-144P
MB2198-131
MB2198-131)
MB219801,
PGA-401P
MB2198-130,
MB91280
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8012-X
Abstract: dd136
Text: AMI A M I SE M IC O N D U C TO R s Packaging Capabilities LQFP Description Surface Mount The Low Profile Quad Flatpack LQFP plastic package family is a reduced thickness plastic surface mount package. The LQFP package is constructed using the latest wire bonding and molding technology to provide
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