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    LAND PATTERN PQFP 132 Search Results

    LAND PATTERN PQFP 132 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MC68020EH33E Rochester Electronics LLC Rochester Manufactured MC68020, Microprocessor, 132 PQFP Package, Commercial Temp spec. Visit Rochester Electronics LLC Buy
    MC68020EH16E-G Rochester Electronics LLC Rochester Manufactured MC68020, Microprocessor, 132 PQFP Package, Commercial Temp spec. Visit Rochester Electronics LLC Buy
    HSDC-EXTMOD03B-DB Renesas Electronics Corporation Digital Pattern Generation board for High-speed JESD204B DACs Visit Renesas Electronics Corporation
    R7FS5D57A2A01CLK#AC1 Renesas Electronics Corporation 120 MHz Arm® Cortex®-M4 CPU, LGA, /Tray Visit Renesas Electronics Corporation
    R7FS5D57C2A01CLK#AC1 Renesas Electronics Corporation 120 MHz Arm® Cortex®-M4 CPU, LGA, /Tray Visit Renesas Electronics Corporation

    LAND PATTERN PQFP 132 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    land pattern for TSOP

    Abstract: TSOP 86 land pattern land pattern for SOP land pattern PQFP 208 land pattern for TSOP 2 86 MA05A land pattern for TSOP 2 land pattern for SSOP land pattern PQFP 100
    Text: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages,


    Original     		PDF OT-23 O-263 MA05A land pattern for TSOP TSOP 86 land pattern land pattern for SOP land pattern PQFP 208 land pattern for TSOP 2 86 land pattern for TSOP 2 land pattern for SSOP land pattern PQFP 100

    land pattern for SSOP

    Abstract: TSOP 86 land pattern land pattern for SOP land pattern for TSOP TSOP 48 Pattern land pattern PQFP 208 land pattern for TSOP 2 86 tip 3035 land pattern PQFP 132 land pattern PQFP 100
    Text: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages, refer to land patterns shown in the Physical Dimensions for


    Original     		PDF OT-23 O-263 MA05A MS011811-1 land pattern for SSOP TSOP 86 land pattern land pattern for SOP land pattern for TSOP TSOP 48 Pattern land pattern PQFP 208 land pattern for TSOP 2 86 tip 3035 land pattern PQFP 132 land pattern PQFP 100

    PA44QF14C-44QF

    Abstract: PA44QF16-44QF PA44QF03-44QF 44QXQF QFP 128 pin Socket Enplas Enplas fpq FPQ-44-0.8-16 qfp 0.8mm Enplas OTQ
    Text: PA44QFxxx-44QF Data Sheet 44 pin QFP socket/44 pin QFP plug Supported Device/Footprints These adapters accept 44 pin QFP devices and have a removable 44 pin QFP solder-down plug. This allows QFP device to be inserted into and removed from a prototype easily.


    Original     		PDF PA44QFxxx-44QF socket/44 44QF-03 44QF-14C 44QF-16 PA44QF16-44QF OTQ-44-0 PA44QF14C-44QF PA44QF16-44QF PA44QF03-44QF 44QXQF QFP 128 pin Socket Enplas Enplas fpq FPQ-44-0.8-16 qfp 0.8mm Enplas OTQ

    44-pin plcc pcb mount footprint

    Abstract: PIC16C71SO pic16c57 PCB Circuit 27C64SO PIC16C74P adaptor 32 pin dil to 32 pin plcc pic16c57 codes data programmers DIP PLCC Enplas PIC17C76X
    Text: 7 Logic Analyzers and Accessories 7 Logic Analyzers and Accessories Logic Analyzers and Accessories Logic Analyzers and Accessories DS00104F-page 7-1  2001 Microchip Technology Inc. Logic Analyzers and Accessories Section 7 Logic Analyzers and Accessories


    Original     		PDF DS00104F-page PIC12CXXX, PIC14C000, PIC16CXXX PIC17CXXX 28C64ASO 28C64AK PIC16C55SW W9711 44-pin plcc pcb mount footprint PIC16C71SO pic16c57 PCB Circuit 27C64SO PIC16C74P adaptor 32 pin dil to 32 pin plcc pic16c57 codes data programmers DIP PLCC Enplas PIC17C76X

    footprint jedec MS-026 TQFP

    Abstract: footprint jedec MS-026 LQFP JEDEC TRAY ssop footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP 44 MS-026 BED BGA package tray 40 x 40 AMD Package moisture MO-069 footprint jedec MS-026 TQFP 144
    Text: u Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Surface-Mount Array Packages Column Grid Array Packages Surface-Mount Leaded Packages Thru-Hole Packages Packages and Packing Publication Revision A 3/1/03 2-1 u Chapter 2 Package Design SURFACE-MOUNT ARRAY PACKAGES


    Original     		PDF

    ablebond 8380

    Abstract: land pattern PQFP 132 smema Ablestik 8380 ablestik ablebond shoulder angle foot length lead solder joint reliability nozzle heater gold embrittlement Ablebond cut template DRAWING
    Text: CHAPTER 12 ADVANCED PACKAGE APPLICATIONS TAPE CARRIER PACKAGE INTRODUCTION TO THE PACKAGE TECHNOLOGY As semiconductor devices become more complex they are being introduced into products that cover the spectrum of the marketplace Portability of computing and information management is driving the reduction in size from desktop to laptop to notebook to palm top sized


    Original     		PDF IPC-SM-782A J-STD-001 ablebond 8380 land pattern PQFP 132 smema Ablestik 8380 ablestik ablebond shoulder angle foot length lead solder joint reliability nozzle heater gold embrittlement Ablebond cut template DRAWING

    240817

    Abstract: SURFACE MOUNT TECHNOLOGY
    Text: 7 Surface Mount Technology SMT 7.1 Introduction Traditional through-hole methods of assembling conventional electronic assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately 68L. SMT allows production of more reliable assemblies at increased board density, reduced weight,


    Original     		PDF

    programming smt machine

    Abstract: pick and place robot tank water level control A5668-01 SURFACE MOUNT RESISTOR SMT Process application 741 heat exchanger wired pick and place robot water pumping machine control schematic
    Text: Leaded Surface Mount Technology SMT 7.1 7 Introduction Traditional through-hole Dual In-Line Package assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately 68L. SMT allows production of more reliable assemblies at increased board density, reduced weight, volume, and


    Original     		PDF

    Intel reflow soldering profile BGA

    Abstract: all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment
    Text: Board Solder Reflow Process Recommendations 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables such as the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile and board design.


    Original     		PDF conductivi49-58. Intel reflow soldering profile BGA all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment

    pick and place robot

    Abstract: application of pick place robot qfp 0.4mm land pattern QFP 208 pick and place robot used for circuit assembling Surface mount SMA connector land pattern QFP 132 qfp 32 land pattern wired pick and place robot 300C
    Text: CHAPTER 7 SURFACE MOUNT TECHNOLOGY INTRODUCTION Traditional through-hole methods of assembling conventional electronic assemblies reached their limits in terms of improvements in cost weight volume and reliability at approximately 68L SMT allows production of more reliable assemblies at increased board density reduced


    Original     		PDF IPC-SM-782 pick and place robot application of pick place robot qfp 0.4mm land pattern QFP 208 pick and place robot used for circuit assembling Surface mount SMA connector land pattern QFP 132 qfp 32 land pattern wired pick and place robot 300C

    pick and place robot

    Abstract: land pattern QFP 208 programming smt machine pick and place robot used for circuit assembling Surface mount SMA connector 300C IPC-SM-782 OMEGA P-M edge mount sma footprint SURFACE MOUNT TECHNOLOGY
    Text: 2 7 Surface Mount Technology 1/16/97 5:04 PM CH07WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 7 SURFACE MOUNT TECHNOLOGY 7.1. INTRODUCTION Traditional through-hole methods of assembling conventional electronic assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately


    Original     		PDF CH07WIP pick and place robot land pattern QFP 208 programming smt machine pick and place robot used for circuit assembling Surface mount SMA connector 300C IPC-SM-782 OMEGA P-M edge mount sma footprint SURFACE MOUNT TECHNOLOGY

    all ic data

    Abstract: EIAJ SO 8 solder heating profile intel 80486 DX4 INTEL DX4 paste profile SMT Process dx4 208 SQFP 80c196kb 1988 diode databook intel 80486
    Text: Board Solder Reflow Process Recommendations - Leaded SMT 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables including the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile


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    plx 9030

    Abstract: plx 9030 data sheet mini pci pcb layout plx 9030 176-pin pqfp PCI9030
    Text: PCI 9030 Data Book Version 1.0 April 2000 Website: http://www.plxtech.com Email: [email protected] Phone: 408 774-9060 800 759-3735 408 774-2169 Fax:  2000 PLX Technology, Inc. All rights reserved. PLX Technology, Inc. retains the right to make changes to this product at any time, without notice. Products may


    Original     		PDF 9030-SIL-DB-P1-1 plx 9030 plx 9030 data sheet mini pci pcb layout plx 9030 176-pin pqfp PCI9030

    PCB footprint cqfp 132

    Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 PCB footprint cqfp 132 schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318

    all ic data

    Abstract: Intel reflow soldering profile BGA infrared heating gun 82425EX intel 80486 DX4 hot air bga land pattern for TSOP TSOP infrared 80c196kb 1988 land pattern QFP 208
    Text: 2 9 Board Solder Reflow Process Recommendations 1/16/97 5:29 PM CH09WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS 9.1. INTRODUCTION In reflowed board assemblies, the solder joint quality is affected by several variables such as


    Original     		PDF CH09WIP all ic data Intel reflow soldering profile BGA infrared heating gun 82425EX intel 80486 DX4 hot air bga land pattern for TSOP TSOP infrared 80c196kb 1988 land pattern QFP 208

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208
    Text: Packages and Thermal Characteristics  June 1, 1996 Version 1.1 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208

    MO-83-AF

    Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 MO-83-AF PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128

    A5620

    Abstract: 3g call flow Sensor Cement Capacitor CQ DIODE DATABOOK tsop Ir sensor SLOTTED OPTICAL SWITCH inductive displacement sensors Side Brazed Ceramic Dual-In-Line Packages schematic inductive proximity sensor schematic AC inductive proximity sensor
    Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


    Original     		PDF

    A5625-01

    Abstract: A5620 land pattern for TSOP 2-86 a5609 28F001BX 28F010 28F020 outline of the heat sink for Theta JC A5644-01 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE
    Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


    Original     		PDF

    land pattern PQFP 132

    Abstract: PQFP 132 PACKAGE DIMENSION MO-112 N2979 land pattern PQFP 208
    Text: PACKAGE DIAGRAM OUTLINES PQFP Continued PACKAGE DIAGRAM OUTLINES PQFP (Continued) R E V ISIO N S DWG § s Y M B □ REV DESCRIPTION DATE 27649 04 REDRAW TO JEDEC FORMAT 01/24/92 APPROVED P Q 80- JEDEC VARIATION N □ B E -2 LAND PATTERN DIMENSIONS T E L


    OCR Scan     		PDF PQ80- 5U-1982 M0-112, PS0-4035 P5C-4049 land pattern PQFP 132 PQFP 132 PACKAGE DIMENSION MO-112 N2979 land pattern PQFP 208

    m0-112

    Abstract: land pattern PQFP 132 MO-069 tc 4049 MO-112
    Text: PACKAGE DIAGRAM OUTLINES PQFP Continued PACKAGE DIAGRAM OUTLINES PQFP (Continued) R E V ISIO N S DWG § s Y M B □ REV DESCRIPTION DATE 27649 04 REDRAW TO JEDEC FORMAT 01/24/92 APPROVED P Q 80- JEDEC VARIATION N □ B E -2 LAND PATTERN DIMENSIONS T E L


    OCR Scan     		PDF PQ80- 5U-1982 M0-112, PS0-4035 P5C-4049 m0-112 land pattern PQFP 132 MO-069 tc 4049 MO-112

    Untitled

    Abstract: No abstract text available
    Text: A P ,i k a g f rlia i> ra m s Fíkk ü jje diagrams P lastic dual in -iin e package (P D IP -D- ► 20-pin 28-pin 3 2 -pin 3 2 -pin 3 0 0 mil 3 0 0 mil 3 0 0 mil 4 0 0 mil - - I t _ Min Max Min Max Min Max Min Max A -


    OCR Scan     		PDF 20-pin 28-pin

    Untitled

    Abstract: No abstract text available
    Text: R4761 ORION FAMILY SYSTEM CONTROLLER FEATURES • • • • • • • Direct interface to IDT o r io n R4640/R4650/R4700/R5000 RISC microprocessors - 64-bit interface support for R4650/R4700/R5000 - 32-bit interface support for R4640/4650 Available at 5V and 3.3V


    OCR Scan     		PDF R4761 IDT79R4761TM R4640/R4650/R4700/R5000 64-bit R4650/R4700/R5000 32-bit R4640/4650 RS-232 79R4761TM IDT79

    Untitled

    Abstract: No abstract text available
    Text: LSI LOGIC L64015 VMI Bridge Advance Datasheet The L64015 VMI Bridge chip is a companion chip of LSI Logic’s L64020 Digital Video Decoder DVD . The L64015 serves as an interface between a notebook computer with a VMI (Video Module Interface) ready graphics device and the decompressed video and audio bitstream output


    OCR Scan     		PDF L64015 L64020