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    LAND PATTERN PQFP 100 Search Results

    LAND PATTERN PQFP 100 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MC68020EH33E Rochester Electronics LLC Rochester Manufactured MC68020, Microprocessor, 132 PQFP Package, Commercial Temp spec. Visit Rochester Electronics LLC Buy
    MC68020EH16E-G Rochester Electronics LLC Rochester Manufactured MC68020, Microprocessor, 132 PQFP Package, Commercial Temp spec. Visit Rochester Electronics LLC Buy
    HSDC-EXTMOD03B-DB Renesas Electronics Corporation Digital Pattern Generation board for High-speed JESD204B DACs Visit Renesas Electronics Corporation
    R7FS5D57A2A01CLK#AC1 Renesas Electronics Corporation 120 MHz Arm® Cortex®-M4 CPU, LGA, /Tray Visit Renesas Electronics Corporation
    R7FS5D57C2A01CLK#AC1 Renesas Electronics Corporation 120 MHz Arm® Cortex®-M4 CPU, LGA, /Tray Visit Renesas Electronics Corporation

    LAND PATTERN PQFP 100 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    land pattern for TSOP

    Abstract: TSOP 86 land pattern land pattern for SOP land pattern PQFP 208 land pattern for TSOP 2 86 MA05A land pattern for TSOP 2 land pattern for SSOP land pattern PQFP 100
    Text: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages,


    Original     		PDF OT-23 O-263 MA05A land pattern for TSOP TSOP 86 land pattern land pattern for SOP land pattern PQFP 208 land pattern for TSOP 2 86 land pattern for TSOP 2 land pattern for SSOP land pattern PQFP 100

    land pattern for SSOP

    Abstract: TSOP 86 land pattern land pattern for SOP land pattern for TSOP TSOP 48 Pattern land pattern PQFP 208 land pattern for TSOP 2 86 tip 3035 land pattern PQFP 132 land pattern PQFP 100
    Text: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages, refer to land patterns shown in the Physical Dimensions for


    Original     		PDF OT-23 O-263 MA05A MS011811-1 land pattern for SSOP TSOP 86 land pattern land pattern for SOP land pattern for TSOP TSOP 48 Pattern land pattern PQFP 208 land pattern for TSOP 2 86 tip 3035 land pattern PQFP 132 land pattern PQFP 100

    PCN0506

    Abstract: Date Code Formats intel altera Date Code Formats flash device MARKing intel INTEL Date Code Formats EPC16UI88AA Date Code Formats Altera intel flash date code marking EPC16 Q-100
    Text: PROCESS CHANGE NOTIFICATION PCN0506 ADDITION OF INTEL FLASH MEMORY AS SOURCE FOR EPC4, EPC8 & EPC16 ENHANCED CONFIGURATION DEVICES Change Description: Altera will be adding Intel’s flash memory as a source used in the EPC4, EPC8, and EPC16 enhanced configuration devices. The 88-pin ultra FineLine BGA and 100-pin plastic quad


    Original     		PDF PCN0506 EPC16 EPC16 88-pin 100-pin EPC4QC100 EPC8QC100 EPC16UC88 E/12/2005 PCN0506 Date Code Formats intel altera Date Code Formats flash device MARKing intel INTEL Date Code Formats EPC16UI88AA Date Code Formats Altera intel flash date code marking Q-100

    IEC 68-2-32

    Abstract: No abstract text available
    Text: Board Level Reliability of Components with Matte Tin Lead Finish L. Nguyen, R. Walberg, L. Zhou*, and T. Koh* National Semiconductor Corp. P.O. Box 58090 M/S 19-100 Santa Clara, CA 95052-8090 * National Semiconductor, Singapore Abstract Manufacturers, suppliers, and industry consortia have all


    Original     		PDF lead-f99, IEC 68-2-32

    solder voids to263

    Abstract: IEC 68-2-32 R/Detector/"detectors+ic"/"CD"/solder voids to263
    Text: Board Level Reliability of Components with Matte Tin Lead Finish L. Nguyen, R. Walberg, L. Zhou*, and T. Koh* National Semiconductor Corp. P.O. Box 58090 M/S 19-100 Santa Clara, CA 95052-8090 * National Semiconductor, Singapore Abstract Manufacturers, suppliers, and industry consortia have all


    Original     		PDF

    44-pin plcc pcb mount footprint

    Abstract: PIC16C71SO pic16c57 PCB Circuit 27C64SO PIC16C74P adaptor 32 pin dil to 32 pin plcc pic16c57 codes data programmers DIP PLCC Enplas PIC17C76X
    Text: 7 Logic Analyzers and Accessories 7 Logic Analyzers and Accessories Logic Analyzers and Accessories Logic Analyzers and Accessories DS00104F-page 7-1  2001 Microchip Technology Inc. Logic Analyzers and Accessories Section 7 Logic Analyzers and Accessories


    Original     		PDF DS00104F-page PIC12CXXX, PIC14C000, PIC16CXXX PIC17CXXX 28C64ASO 28C64AK PIC16C55SW W9711 44-pin plcc pcb mount footprint PIC16C71SO pic16c57 PCB Circuit 27C64SO PIC16C74P adaptor 32 pin dil to 32 pin plcc pic16c57 codes data programmers DIP PLCC Enplas PIC17C76X

    mp3 usb fm circuit with remote

    Abstract: lqfp pcb LAYOUT sanyo DA11 sanyo DA11 circuit diagram mmc cARD PCB FOOTPRINT usb mp3 lcd fm land pattern PQFP 208 ES4810SAA samsung lcd panel circuit diagram free servo control PCB diagram
    Text: ES4810SAA Digital Audio Processor Product Brief PRELIMINARY ESS Technology, Inc. DESCRIPTION FEATURES The ES4810SAA Digital Audio Processor DAP 3 is an SOC chip designed for automotive audio applications. It integrates a servo controller, RF amplifier, servo DSP,


    Original     		PDF ES4810SAA ES4810SAA ES4810 ISO9660, FAT32. SAM0660-080406 mp3 usb fm circuit with remote lqfp pcb LAYOUT sanyo DA11 sanyo DA11 circuit diagram mmc cARD PCB FOOTPRINT usb mp3 lcd fm land pattern PQFP 208 samsung lcd panel circuit diagram free servo control PCB diagram

    footprint jedec MS-026 TQFP

    Abstract: footprint jedec MS-026 LQFP JEDEC TRAY ssop footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP 44 MS-026 BED BGA package tray 40 x 40 AMD Package moisture MO-069 footprint jedec MS-026 TQFP 144
    Text: u Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Surface-Mount Array Packages Column Grid Array Packages Surface-Mount Leaded Packages Thru-Hole Packages Packages and Packing Publication Revision A 3/1/03 2-1 u Chapter 2 Package Design SURFACE-MOUNT ARRAY PACKAGES


    Original     		PDF

    Ablebond 8380

    Abstract: X3304 ablestik ablebond Ablestik 8380 A5700 shoulder angle foot length lead solder joint reliability smema control IPC-SM-780 tms 3615 A5716
    Text: Advanced Package Applications: Tape Carrier Package 12.1 12 Introduction To The Package Technology As semiconductor devices become more complex they are being introduced into products that cover the spectrum of the marketplace. Portability of computing and information management is


    Original     		PDF ANSI/J-STD-001, Ablebond 8380 X3304 ablestik ablebond Ablestik 8380 A5700 shoulder angle foot length lead solder joint reliability smema control IPC-SM-780 tms 3615 A5716

    Ablebond 8380

    Abstract: A5700 Ablestik 8380 smema nozzle heater shoulder angle foot length lead solder joint reliability tms 3615 A5716 A5707-01 alpha Resistors slide
    Text: 12 Tape Carrier Package 12.1 Introduction To The Package Technology As semiconductor devices become more complex they are being introduced into products that cover the spectrum of the marketplace. Portability of computing and information management is driving the reduction in size from desktop to laptop to notebook to palm top sized products. These


    Original     		PDF

    Ablebond 8380

    Abstract: smema DA6523 nozzle heater X3304 Theta-JC 5th mechnical engineering date sheet alpha Resistors slide cut template DRAWING Die Attach epoxy stamping
    Text: 2 12 Advanced Package Applications: Tape Carrier Package 1/17/97 9:18 AM CH12WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 12 ADVANCED PACKAGE APPLICATIONS: TAPE CARRIER PACKAGE 12.1. INTRODUCTION TO THE PACKAGE TECHNOLOGY As semiconductor devices become more complex, they are being introduced into products that


    Original     		PDF CH12WIP Ablebond 8380 smema DA6523 nozzle heater X3304 Theta-JC 5th mechnical engineering date sheet alpha Resistors slide cut template DRAWING Die Attach epoxy stamping

    ablebond 8380

    Abstract: land pattern PQFP 132 smema Ablestik 8380 ablestik ablebond shoulder angle foot length lead solder joint reliability nozzle heater gold embrittlement Ablebond cut template DRAWING
    Text: CHAPTER 12 ADVANCED PACKAGE APPLICATIONS TAPE CARRIER PACKAGE INTRODUCTION TO THE PACKAGE TECHNOLOGY As semiconductor devices become more complex they are being introduced into products that cover the spectrum of the marketplace Portability of computing and information management is driving the reduction in size from desktop to laptop to notebook to palm top sized


    Original     		PDF IPC-SM-782A J-STD-001 ablebond 8380 land pattern PQFP 132 smema Ablestik 8380 ablestik ablebond shoulder angle foot length lead solder joint reliability nozzle heater gold embrittlement Ablebond cut template DRAWING

    land pattern PQFP 132

    Abstract: PQFP 132 PACKAGE DIMENSION MO-112 N2979 land pattern PQFP 208
    Text: PACKAGE DIAGRAM OUTLINES PQFP Continued PACKAGE DIAGRAM OUTLINES PQFP (Continued) R E V ISIO N S DWG § s Y M B □ REV DESCRIPTION DATE 27649 04 REDRAW TO JEDEC FORMAT 01/24/92 APPROVED P Q 80- JEDEC VARIATION N □ B E -2 LAND PATTERN DIMENSIONS T E L


    OCR Scan     		PDF PQ80- 5U-1982 M0-112, PS0-4035 P5C-4049 land pattern PQFP 132 PQFP 132 PACKAGE DIMENSION MO-112 N2979 land pattern PQFP 208

    m0-112

    Abstract: land pattern PQFP 132 MO-069 tc 4049 MO-112
    Text: PACKAGE DIAGRAM OUTLINES PQFP Continued PACKAGE DIAGRAM OUTLINES PQFP (Continued) R E V ISIO N S DWG § s Y M B □ REV DESCRIPTION DATE 27649 04 REDRAW TO JEDEC FORMAT 01/24/92 APPROVED P Q 80- JEDEC VARIATION N □ B E -2 LAND PATTERN DIMENSIONS T E L


    OCR Scan     		PDF PQ80- 5U-1982 M0-112, PS0-4035 P5C-4049 m0-112 land pattern PQFP 132 MO-069 tc 4049 MO-112

    ADA17

    Abstract: No abstract text available
    Text: Advance information •■ I l AS7C3256K36Z AS7C3256K32Z A 3.3V 2 5 6 K x 32/36 synchronous burst SRAM with ZBT1 Features Multiple packaging options - Economical 100-pin TQFP package - Chip-scale fBGA package for smallest footprint Byte write enables Qock enable for operation hold


    OCR Scan     		PDF AS7C3256K36Z AS7C3256K32Z 100-pin 00000DID1DDDD 5M-1982. IPC-SM-782 ADA17

    land pattern for TSOP 2 44 PIN

    Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin psop 44 land pattern PQFP 208
    Text: High perform ance 512KX32 CMOS SGRAM 16 Megabit CMOS synchronous graphic RAM Advance information • Organization - 131,072 words x 32 bits x 4 banks • Fully synchronous - All signals referenced to positive edge of dock • Four internal banks controlled by BA0/BA1 bank select


    OCR Scan     		PDF 512KX32 AS4LC512K32SG0 100-pin land pattern for TSOP 2 44 PIN land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin psop 44 land pattern PQFP 208

    land pattern for TSOP 2 54 pin

    Abstract: land pattern for TSOP 56 pin TSOP 54 land pattern 40013A land pattern for TSOP
    Text: n H igh p e rfo rm a n c e 1 M X 8 /5 1 2 K X 1 6 2.2V CMOS Flash EEPROM AS29LL8ÜÖ II 1 M X 8 / 5 1 2 K X 1 6 CMOS Flash EPROM Advance information Features •O rganization: 1M x 8/512K x 16 • Sector architecture - • Low power consumption - 8 mA typical read current


    OCR Scan     		PDF AS29LL8Ü 8/512K 48-pin land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin TSOP 54 land pattern 40013A land pattern for TSOP

    Untitled

    Abstract: No abstract text available
    Text: R EV I S I ON S REV A D E SC R IP T IO N RELEASE E.C .N . DATE 886 03/14/2003 TO DOCUMENT C ONTROL Br/ A PP 'D M S/ RW 14+0.2 NOTE 2 100X 51 75 76 0.3 —I ( 100X 1.8) 50 (14.2) TYP 14+0.2 NOTE 2 (17.8) TYP 17.2 ±0.25 TYP 100 26 ( 9 6 X P I N #1 0 . 5 )


    OCR Scan     		PDF 14x14x2

    72741

    Abstract: 2E15 MO-112
    Text: PACKAGE DIAGRAM OUTLINES PQFP Continued REVISIO N S DCN 27640 REV OS DESCRIPTION DATE 03/15/95 REDRAW TO JEDEC FORMAT APPROVED ! • » I -20 (B> I C IA-B<S)I[K5H ! ■ » I -20 <H>I H IA—BCPIIXSM EVEN LEAD SIDES ODD LEAD SIDES to i jm —A . B OR D—I


    OCR Scan     		PDF 010-338-2OUTLINE MO-112, 12/15/BB PSC-4028 72741 2E15 MO-112

    Untitled

    Abstract: No abstract text available
    Text: A P ,i k a g f rlia i> ra m s Fíkk ü jje diagrams P lastic dual in -iin e package (P D IP -D- ► 20-pin 28-pin 3 2 -pin 3 2 -pin 3 0 0 mil 3 0 0 mil 3 0 0 mil 4 0 0 mil - - I t _ Min Max Min Max Min Max Min Max A -


    OCR Scan     		PDF 20-pin 28-pin

    TQFP 14X20 land

    Abstract: land pattern for TSOP 2 54 pin 64KX32 SOJ 44 PCB land TSOP 1826 land pattern tsop 66
    Text: High performance 6 4 K x 52 CMOS SRAM » AS7CÌ643 2 II A 6 4 K x 3 2 Synchronous burst S R A M Features • F low -th rou gh o p tio n • Fast clock in g speed: 1 0 0 / 8 3 / 6 6 MHz • Fast clock to data access: 5 / 6 / 7 ns • S elf-tim ed w rite cycle


    OCR Scan     		PDF 64Kx5 64Kx32 1-10007-A. T00344C] TQFP 14X20 land land pattern for TSOP 2 54 pin SOJ 44 PCB land TSOP 1826 land pattern tsop 66

    Untitled

    Abstract: No abstract text available
    Text: A Advance information •■ Il AS7C3256K36P AS7C3256K32P 3.3V 256Kx32/36 pipeline burst synchronous SRAM Features • Organization: 262,144 words x 32 or 36 bits • Fast clock speeds to 166 MHz in LVTTL/LVCMOS • Fast clock to data access: 3 .5 /3 .8 /4 /5 ns


    OCR Scan     		PDF AS7C3256K36P AS7C3256K32P 256Kx32/36 100-pin 5M-1982. IPC-SM-782

    AS7C36432-7QC

    Abstract: 2227S
    Text: Features 1 A sy n c h ro n o u s o u tp u t e n a b le c o n tro l • O rg a n iz a tio n : 6 5 ,5 3 6 w o r d s x 32 b its ADSP, ADSC, ADV, M O DE b u rst c o n tro l p in s • Fully s y n c h ro n o u s p ip e lin e d o p e ra tio n • F lo w -th ro u g h o p tio n


    OCR Scan     		PDF AS7C36432 512KB W57C36432-6QC \S7C36432-6TQ AS7C36432-7QC AS7C36432-7TQC 1-20001-A. 2227S

    3232F-7

    Abstract: PQFP dimension intel MI-003 pqfp 14x20 100pin
    Text: H igh Perform ance 32KX32 CM O S SRAM AS7C33232F 3 2 K X 3 2 Synchronous burst SRA M Preliminary information Features • • • • • • • • Organization: 32,768 words x 32 bits Fully synchronous pipelined operation Flow-through or pipelined Fast clocking speed: 1 0 0 /7 5 /6 6 MHz


    OCR Scan     		PDF 32KX32 AS7C33232F AS7C3323 256KB 512KB AS7C33232F 2321-6QC 3232F-7QC 3232F-7 PQFP dimension intel MI-003 pqfp 14x20 100pin