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    LAND PATTERN FOR SOP Search Results

    LAND PATTERN FOR SOP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    LAND PATTERN FOR SOP Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    land pattern for SSOP

    Abstract: TSOP 86 land pattern land pattern for SOP land pattern for TSOP TSOP 48 Pattern land pattern PQFP 208 land pattern for TSOP 2 86 tip 3035 land pattern PQFP 132 land pattern PQFP 100
    Text: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages, refer to land patterns shown in the Physical Dimensions for


    Original     		PDF OT-23 O-263 MA05A MS011811-1 land pattern for SSOP TSOP 86 land pattern land pattern for SOP land pattern for TSOP TSOP 48 Pattern land pattern PQFP 208 land pattern for TSOP 2 86 tip 3035 land pattern PQFP 132 land pattern PQFP 100

    land pattern for TSOP

    Abstract: TSOP 86 land pattern land pattern for SOP land pattern PQFP 208 land pattern for TSOP 2 86 MA05A land pattern for TSOP 2 land pattern for SSOP land pattern PQFP 100
    Text: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages,


    Original     		PDF OT-23 O-263 MA05A land pattern for TSOP TSOP 86 land pattern land pattern for SOP land pattern PQFP 208 land pattern for TSOP 2 86 land pattern for TSOP 2 land pattern for SSOP land pattern PQFP 100

    TSSOP 8PIN MARK 21

    Abstract: land pattern for TSsOP 16 6pin land pattern for TSsOP 8 2952 8pin HA005-A-P
    Text: CMOS IC PACKAGES Package Type DIP/TO Gull-wing Flat-lead WLP *1 Pin Count 3 8 4 5 3 5 6 3 5 8 14 8 10 8 16 24 8 5 6 8 8 10 6 4 6 8 4 5 6 8 Package Name TO-92 8-Pin DIP SC-82AB SC-88A SOT-23-3 SOT-23-5 SOT-23-6 SOT-89-3 SOT-89-5 8-Pin SOP JEDEC 14-Pin SOP


    Original     		PDF SC-82AB SC-88A OT-23-3 OT-23-5 OT-23-6 OT-89-3 OT-89-5 14-Pin 10-Pin 16-Pin TSSOP 8PIN MARK 21 land pattern for TSsOP 16 6pin land pattern for TSsOP 8 2952 8pin HA005-A-P

    PA-DSO-1403

    Abstract: PA-DSO-4406 PA-SOF-D310-20/6 PA-SOF-D310-16/6 PA-SOF-D420-14/6 PA-SOF-D310-18/6 PA-SOF-D310-14/6 PA-SOF-D250-08/6 PA-SOF-D250-14/6 PA-SOF-D250-16/6
    Text: DIP to SO-Plug Prototyping Adapter Kits These adapters will convert a small outline land pattern to a DIP package. The adapter provides a solder down SOplug on the bottom and a detachable 300 or 600 mil wide open-frame DIP socket on the top. They are also available


    Original     		PDF PA-SOF-D420-14/6 PA-SOF-D420-16/6 PA-SOF-D420-18/6 PA-SOF-D420-20/6 PA-SOF-D420-24/6 PA-SOF-D420-28/6 PA-SOF-D470-14/6 PA-SOF-D470-16/6 PA-SOF-D470-18/6 PA-SOF-D470-20/6 PA-DSO-1403 PA-DSO-4406 PA-SOF-D310-20/6 PA-SOF-D310-16/6 PA-SOF-D420-14/6 PA-SOF-D310-18/6 PA-SOF-D310-14/6 PA-SOF-D250-08/6 PA-SOF-D250-14/6 PA-SOF-D250-16/6

    7402

    Abstract: ED-7402 land pattern for SOP DATA SHEET 7402 ED-7402-1 datasheet 7402 7402 data sheet
    Text: SOP LAND PATTERN DIMENSIONS e1 e1 I2 α L β1 β2 b b2 Dimension Parameter e 1.27 α β1 β2 γ 0.20 0.50 0.20 0.30 b2 e E I2 I2 L+ β 1 + β 2 b b2 e − γ Unit : mm Remark Washability of the printed-circuit board Soldering strength Pattern accuracy of the solder mask and visual inspection soldering.


    Original     		PDF ED-7402-1 7402 ED-7402 land pattern for SOP DATA SHEET 7402 ED-7402-1 datasheet 7402 7402 data sheet

    IPC-7351A

    Abstract: MiniMELF land pattern land pattern for TSsOP 16 land pattern for TSSOP sot89 land pattern PowerDI3333-8 SOD-323 land pattern y1 SOT23 DFN2020 SOD523 land pattern
    Text: SUGGESTED PAD LAYOUT Based on IPC-7351A DFN1006-2 / DFN1006H4-2 / MiniMELF / MELF / SOD-323 / SOD-123 / SOD-523 / SMA / SMB / SMC C X G Y Z Dimensions Z G X Y C DFN1006-2 / MiniMELF DFN1006H4-2 1.1 4.7 0.3 2.1 0.7 1.7 0.4 1.3 0.7 3.5 MELF SOD-123 SOD-323 SOD-523


    Original     		PDF IPC-7351A DFN1006-2 DFN1006H4-2 OD-323 OD-123 OD-523 DFN1006H4-2 OD-123 OD-323 IPC-7351A MiniMELF land pattern land pattern for TSsOP 16 land pattern for TSSOP sot89 land pattern PowerDI3333-8 SOD-323 land pattern y1 SOT23 DFN2020 SOD523 land pattern

    SOT-563 SOT-666

    Abstract: SOD523 land pattern IPC-7351A IPC SOD 323F SOT-95 SOD-323 land pattern SOT-353 G5 Y3 SOT23 DFN1006-3 DFN1006H4-2
    Text: SUGGESTED PAD LAYOUT Based on IPC-7351A DFN1006-2 / DFN1006H4-2 / MiniMELF / MELF / SOD-323 / SOD-123 / SOD-523 / SMA / SMB / SMC C X G Y Z Dimensions Z G X Y C DFN1006-2 / MiniMELF DFN1006H4-2 1.1 4.7 0.3 2.1 0.7 1.7 0.4 1.3 0.7 3.5 MELF SOD-123 SOD-323 SOD-523


    Original     		PDF IPC-7351A DFN1006-2 DFN1006H4-2 OD-323 OD-123 OD-523 DFN1006H4-2 OD-123 OD-323 SOT-563 SOT-666 SOD523 land pattern IPC-7351A IPC SOD 323F SOT-95 SOD-323 land pattern SOT-353 G5 Y3 SOT23 DFN1006-3

    IPC-7351A

    Abstract: AP02001 DFN1616-8 DFN2018-6 ipc SMB SMC MELF pad layout MiniMELF land pattern MELF "Land Pattern" DFN1411-3 land pattern for SOP
    Text: Suggested Pad Layout Based on IPC-7351A Figure 1 Dimensions DFN1006-2 MiniMELF MELF SOD-323 SOD-123 SOD-523 SMA SMB SMC 9.3 Z 1.1 4.8 6.3 3.75 4.9 2.3 6.5 6.7 G 0.3 2.1 3.3 1.05 2.5 1.1 1.5 1.8 4.4 X 0.7 1.7 2.7 0.65 0.7 0.8 1.7 2.3 3.3 Y 0.4 1.3 1.5 1.35


    Original     		PDF IPC-7351A DFN1006-2 OD-323 OD-123 OD-523 DFN1006-3 DFN1310H4-6 DFN1612-6 IPC-7351A, AP02001 IPC-7351A DFN1616-8 DFN2018-6 ipc SMB SMC MELF pad layout MiniMELF land pattern MELF "Land Pattern" DFN1411-3 land pattern for SOP

    Y1 SOT-23

    Abstract: MELF pad layout DFN2020-3 ipc SMB SMC land pattern for TSsOP 16 IPC-7351A SOT-353 G5 SOD-323 land pattern SOD523 land pattern land pattern for msOP 8
    Text: SUGGESTED PAD LAYOUT Based on IPC-7351A DFN1006-2 / DFN1006H4-2 / MiniMELF / MELF / SOD-323 / SOD-123 / SOD-523 / SMA / SMB / SMC C X G Y Z Dimensions Z G X Y C DFN1006-2 / MiniMELF DFN1006H4-2 1.1 4.7 0.3 2.1 0.7 1.7 0.4 1.3 0.7 3.5 MELF SOD-123 SOD-323 SOD-523


    Original     		PDF IPC-7351A DFN1006-2 DFN1006H4-2 OD-323 OD-123 OD-523 DFN1006H4-2 OD-123 OD-323 Y1 SOT-23 MELF pad layout DFN2020-3 ipc SMB SMC land pattern for TSsOP 16 IPC-7351A SOT-353 G5 SOD-323 land pattern SOD523 land pattern land pattern for msOP 8

    IPC-7527

    Abstract: PCB design for 0.2mm pitch csp package IPC7527 tssop 16 exposed pad stencil metcal VPI-1000 qfn 44 PACKAGE footprint 7x7 DIe Size qfn 48 7x7 stencil QFN 16 CARSEM package outline QFN 8 CARSEM APR-5000
    Text: MLP Application Note APPLICATION NOTE Comprehensive User’s Guide April 2002 April 2002 Cover Page Page MLP Application Note CONTENTS 1.0 1.1 THE CARSEM MICRO LEADFRAME PACKAGE MLP Introduction 2.0 2.1 MANUFACTURING CONSIDERATIONS SMT Process 3.0 3.1 3.2


    Original     		PDF

    CPC1225N

    Abstract: cpc1002 CPC1004N LCA715 "pin compatible" CPC1017N CPC1025N cpc1008 CPC1018N CPC1030N CPC1035N
    Text: Single Pole Normally Open: 1-Form-A CPC1008N 100 150 8 1500 2 1 2/0.5 4 Pin SOP CPC1016N 100 100 16 1500 2 1 2/0.5 4 Pin SOP CPC1017N 1500 1 1 10/10 4 Pin SOP 60 100 16 CPC1018N 60 600 0.8 1500 1 1 3/2 4 Pin SOP CPC1025N 400 120 30 1500 2 1 2/1 4 Pin SOP CPC1030N


    Original     		PDF CPC1008N CPC1016N CPC1017N CPC1018N CPC1025N CPC1030N CPC1035N CPC1225N CPC1230N CPC1330 CPC1225N cpc1002 CPC1004N LCA715 "pin compatible" CPC1017N CPC1025N cpc1008 CPC1018N CPC1030N CPC1035N

    SOP20 Package

    Abstract: SOP20 20 pin Package PSOP-20
    Text: 20-Pin Small Outline Package SOP20 Package Outline Dimensions Outline Dimensions 1.27 0.43 +0.07 –0.04 0 ～10゜ 0.8 ±0.2 0.25 M 13.3 max 0.1 Land Pattern Example Enlarged view of A A 0.1 +0.1 –0.05 1.5 ±0.2 12.8 ±0.2 1.9 max 0.685 typ. 0.25 10 +0.075


    Original     		PDF 20-Pin SOP20 Package SOP20 20 pin Package PSOP-20

    SOP16 Package

    Abstract: sop16
    Text: 16-Pin Small Outline Package SOP16 Package Outline Dimensions Outline Dimensions Unit: mm 1.27 8 0.43 +0.07 –0.04 10.8 max 0.1 Land Pattern Example 0.25 +0.075 0 ～10゜ 0.8 ±0.2 0.25 M Enlarged view of A A 0.1 +0.1 –0.05 1.5 ±0.2 10.3 ±0.2 1.9 max


    Original     		PDF 16-Pin SOP16 Package sop16

    sop8 Package dimension

    Abstract: weight of SOP package land pattern for SOP land pattern SOP SOP8 Package TOSHIBA Package
    Text: 8-pin Small Outline Package SOP-8 Package Outline Dimensions Outline Dimensions Unit: mm 0.4 ±0.1 0.25 M 5.5 max 5.0 ±0.2 1.5 ±0.2 0.15 +0.1 –0.05 0.1 Land Pattern Example +0.1 0.595 typ. 4 1.27 1.27 1.27 0.1 –0.05 1 0.5 ±0.2 4.4 ±0.2 6.0 ±0.3 5


    Original     		PDF

    land pattern for SOP

    Abstract: No abstract text available
    Text: 8-pin Small Outline Advance Package SOP Advance Package Outline Dimensions Outline Dimensions 0.166 ±0.05 0.15 ±0.05 5.0 ±0.2 A 4 1 3.5 ±0.2 8 1.1 ±0.2 Bottom view 0.95 ±0.05 5.0 ±0.2 4 1.27 1.27 1.27 0.5 ±0.1 1 5 6.0 ±0.3 5 8 0.595 4.25 ±0.2 0.05 M A


    Original     		PDF

    apx339

    Abstract: APX393 TSSOP-14L
    Text: APX393/APX339 LOW VOLTAGE RAIL-TO-RAIL INPUT DUAL/QUAD COMPARATORS General Description Features • • • • • • • • The APX393/339 are low voltage 2.5V to 5.5V dual and quad comparators. The APX393 is the dual version available in the 8-pin SOP and MSOP packages. The APX339 is the quad


    Original     		PDF APX393/APX339 APX393/339 APX393 APX339 14-pin APX393/339 APX393/APX339 FEBRUARY2008 TSSOP-14L

    D560 transistor

    Abstract: 40 pin zif socket 20 pin zif socket 2003Z d560 D420 ZIF socket 16 pin dip zif socket PA-SOF-D420-28 zif 40 pin socket
    Text: DIP to SO-Plug Prototyping Adapters DIP to SO-Plug Prototyping Adapters Simplify prototyping and testing Use actual size prototype boards Great for microcontrollers and EE/Flash memory testing Simple design is easy to use These plugs and socket boards are simple and easy to use following


    Original     		PDF

    240817

    Abstract: SURFACE MOUNT TECHNOLOGY
    Text: 7 Surface Mount Technology SMT 7.1 Introduction Traditional through-hole methods of assembling conventional electronic assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately 68L. SMT allows production of more reliable assemblies at increased board density, reduced weight,


    Original     		PDF

    pick and place robot

    Abstract: programming smt machine .65mm bga land pattern land pattern for SOP A5666-02 2000 Packaging SURFACE MOUNT TECHNOLOGY
    Text: Leaded Surface Mount Technology SMT 7.1 7 Introduction Traditional through-hole Dual In-Line Package assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately 68L. SMT allows production of more reliable assemblies with higher I/O, increased board density, and reduced


    Original     		PDF

    1.27mm pitch zif socket 3M 21X21

    Abstract: 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432
    Text: Ironwood Electronics SK.1 Sockets and Receptacles Ironwood offers the industry's widest array of high quality sockets and receptacles for BGA, MGA, PGA, QIP, and QFP packages. We also offer parts that provide sockets for in-circuit emulators. • • • •


    Original     		PDF SK-MGAxx/xxxx-03 SK-MGAxx/xxxx-01 SK-MGAxx/xxxx-02 MGA10/100A- 1.27mm pitch zif socket 3M 21X21 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432

    programming smt machine

    Abstract: pick and place robot tank water level control A5668-01 SURFACE MOUNT RESISTOR SMT Process application 741 heat exchanger wired pick and place robot water pumping machine control schematic
    Text: Leaded Surface Mount Technology SMT 7.1 7 Introduction Traditional through-hole Dual In-Line Package assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately 68L. SMT allows production of more reliable assemblies at increased board density, reduced weight, volume, and


    Original     		PDF

    pick and place robot

    Abstract: application of pick place robot qfp 0.4mm land pattern QFP 208 pick and place robot used for circuit assembling Surface mount SMA connector land pattern QFP 132 qfp 32 land pattern wired pick and place robot 300C
    Text: CHAPTER 7 SURFACE MOUNT TECHNOLOGY INTRODUCTION Traditional through-hole methods of assembling conventional electronic assemblies reached their limits in terms of improvements in cost weight volume and reliability at approximately 68L SMT allows production of more reliable assemblies at increased board density reduced


    Original     		PDF IPC-SM-782 pick and place robot application of pick place robot qfp 0.4mm land pattern QFP 208 pick and place robot used for circuit assembling Surface mount SMA connector land pattern QFP 132 qfp 32 land pattern wired pick and place robot 300C

    land pattern for sot109-1

    Abstract: TSSOP-8 footprint and soldering sot-23 SOD87 footprint
    Text: Packages Package cross reference 88 Packing methods 90 Minimized outline drawings and reflow soldering footprint 96 Package overview 86 107 87 Package cross reference Package cross reference 88 types in bold represent new products types in bold represent new products


    Original     		PDF DO-35 DO-41 DO-34 OD80C OD123F HXSON12) OT983 land pattern for sot109-1 TSSOP-8 footprint and soldering sot-23 SOD87 footprint

    pick and place robot

    Abstract: land pattern QFP 208 programming smt machine pick and place robot used for circuit assembling Surface mount SMA connector 300C IPC-SM-782 OMEGA P-M edge mount sma footprint SURFACE MOUNT TECHNOLOGY
    Text: 2 7 Surface Mount Technology 1/16/97 5:04 PM CH07WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 7 SURFACE MOUNT TECHNOLOGY 7.1. INTRODUCTION Traditional through-hole methods of assembling conventional electronic assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately


    Original     		PDF CH07WIP pick and place robot land pattern QFP 208 programming smt machine pick and place robot used for circuit assembling Surface mount SMA connector 300C IPC-SM-782 OMEGA P-M edge mount sma footprint SURFACE MOUNT TECHNOLOGY