INTEL LIQUID COOLING Search Results

INTEL LIQUID COOLING Result Highlights (5)

Part	Manufacturer	Description
EN80C188XL-12	Rochester Electronics LLC	80C188XL - MPU Intel 186 CISC 16-Bit
EN80C188XL-20	Rochester Electronics LLC	80C188XL - MPU Intel 186 CISC 16-Bit
MD82C288-10/R	Rochester Electronics LLC	Replacement for Intel part number MD82C288-10. Buy from authorized manufacturer Rochester Electronics.
MD87C51/BQA	Rochester Electronics LLC	Replacement for Intel part number 5962-8768401QA. Buy from authorized manufacturer Rochester Electronics.
MG87C196KC/B	Rochester Electronics LLC	Replacement for Intel part number MG87C196KC. Buy from authorized manufacturer Rochester Electronics.

INTEL LIQUID COOLING Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
intel 965 motherboard circuit diagram Abstract: intel 775 motherboard diagram 775 MOTHERBOARD CIRCUIT diagram D975XBX2 intel lga775 MOTHERBOARD pcb CIRCUIT diagram LGA775 SOCKET PIN LAYOUT hand movement based fan speed control computer motherboard circuit diagram lga775 PC MOTHERBOARD intel 815 circuit diagram LGA775 socket design guidelines Text: Intel Core 2 Extreme QuadCore Processor QX6800Δ Thermal and Mechanical Design Guidelines — Adopting Intel® Advanced Liquid Cooling Technology Reference Design April 2007 Document Number: 316854-001 THIS DOCUMENT AND RELATED MATERIALS AND INFORMATION ARE PROVIDED "AS IS” WITH NO WARRANTIES, EXPRESS OR	Original	PDF	QX6800 intel 965 motherboard circuit diagram intel 775 motherboard diagram 775 MOTHERBOARD CIRCUIT diagram D975XBX2 intel lga775 MOTHERBOARD pcb CIRCUIT diagram LGA775 SOCKET PIN LAYOUT hand movement based fan speed control computer motherboard circuit diagram lga775 PC MOTHERBOARD intel 815 circuit diagram LGA775 socket design guidelines
a9007 Abstract: i386 pcmcia 82559ER 82801AA PC-100 273548 intel celeron Block Diagram LCD heat seal connectors intel810 PC133 registered reference design Text: Intel 810 Embedded Client Reference Design Scalable Platform with Integrated Flat Panel Display Application Note June 2001 Order Number: 273550-001 Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual	Original	PDF
gold metal detectors Abstract: soft solder die bonding schematic diagram intel atom INCOMING RAW MATERIAL INSPECTION lead side brazed hermetic X-RAY INSPECTION ausi die attach electrical three phase schematic riser DIAGRAM epoxy adhesive paste cte table intel 24008 Text: 2 3 Component Assembly Technology 1/22/97 9:49 AM CH03WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 3 COMPONENT ASSEMBLY TECHNOLOGY 3.1. INTRODUCTION The packaging technologies used to manufacture or assemble Intel’s three basic types of	Original	PDF	CH03WIP gold metal detectors soft solder die bonding schematic diagram intel atom INCOMING RAW MATERIAL INSPECTION lead side brazed hermetic X-RAY INSPECTION ausi die attach electrical three phase schematic riser DIAGRAM epoxy adhesive paste cte table intel 24008
Ultrasonic Cleaning Transducer Abstract: Ultrasonic welding circuit diagram gold metal detectors ultrasonic transducer cleaning bath Ultrasonic nozzle schematic ultrasonic motion detector gold detectors circuit INCOMING RAW MATERIAL INSPECTION soft solder wire dispensing soft solder die bonding Text: CHAPTER 3 IC ASSEMBLY TECHNOLOGY INTRODUCTION The material and process technology steps used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter The package families described in Chapter 1 provide the functional specialization and diversity required by our customers Material and construction attributes of individual family	Original	PDF
Alumina ceramic AI203 Abstract: ausi die attach gold metal detectors AI203 gold melting furnace pressure low die attach spot welding schematics ausi die attach thin silicon die Dissolve Oxygen ceramic pin grid array package wire bond Text: Alumina & Leaded Molded Technology 3 3.1 Introduction The packaging technologies used to manufacture or assemble three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity	Original	PDF
gold metal detectors Abstract: epoxy adhesive paste cte table 28 pin ic base socket round pin type lead spot welding schematics soft solder die bonding electrical three phase schematic riser DIAGRAM CERAMIC PIN GRID ARRAY wire lead frame ausi die attach thin silicon die soft solder wire dispensing 10 k ntc thermistor Text: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity	Original	PDF
solid solubility Abstract: chemical control process block diagram Text: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity	Original	PDF
X23-7762 Abstract: X-23-7762 shinetsu TC014-06001 SOCKET K8 heat sink LGA775 AM2 socket shin-etsu shinetsu X-23-7762 Text: SUNON Waturbo Specifications Model Application Cooling Method Thermal Grease Fan Connector Heat Sink Materials Heat Sink Dimensions Fan Dimensions Bearing System Fan Speed Fan Airflow Cooling Module Noise Fan Rated Current with Heat Sink Fan Rated Voltage	Original	PDF	tc01406001 htm24/09/2008 TC014-06001 LGA775 X-23-7762 95x95x50 92x92x25 56CFM 2000RPM, 39dBA X23-7762 X-23-7762 shinetsu TC014-06001 SOCKET K8 heat sink AM2 socket shin-etsu shinetsu X-23-7762
EP80579 Abstract: loop heat pipes heat pipes 32-1055 Sicc intel liquid cooling MULTIPLE EFFECT EVAPORATOR heat exchanger process TRANSFORM fanless motherboard Text: White Paper Chris Gonzales and Hwan Ming Wang Thermal/Mechanical Engineers Intel Corporation Thermal Design Considerations for Embedded Applications December 2008 321055 Thermal Design Considerations for Embedded Applications Executive Summary Embedded Applications differ from the typical desktop, server and mobile	Original	PDF	EP805799 L5408, EP80579 loop heat pipes heat pipes 32-1055 Sicc intel liquid cooling MULTIPLE EFFECT EVAPORATOR heat exchanger process TRANSFORM fanless motherboard
Intel reflow soldering profile BGA Abstract: socket s1 REFLOW PROFILE intel topside mark outline of the heat slug for JEDEC heat pipes intel pbga package weight BGA OUTLINE DRAWING intel mother board circuit land pattern BGA 0,50 324 bga thermal Text: 2 14 An Introduction to Plastic Ball Grid Array PBGA Packaging 1/17/97 9:57 AM CH14WIP.DOC INTEL CONFIDENTIAL (until publication date) 2 CHAPTER 14 AN INTRODUCTION TO PLASTIC BALL GRID ARRAY (PBGA) PACKAGING 14.1. INTRODUCTION The plastic ball grid array (PBGA) is today on its way to becoming one of the most popular	Original	PDF	CH14WIP Intel reflow soldering profile BGA socket s1 REFLOW PROFILE intel topside mark outline of the heat slug for JEDEC heat pipes intel pbga package weight BGA OUTLINE DRAWING intel mother board circuit land pattern BGA 0,50 324 bga thermal
kic 125 Abstract: ic KA 2645 C 6090 Side Brazed Ceramic Dual-In-Line Packages thermal analysis on pcb Coffin-Manson Equation AL Cu tungsten slug glass diode Braze Dual-In-Line 16 Packages cte table for epoxy adhesive and substrate PERFORMANCE CHARACTERISTICS OF IC PACKAGES Text: 2 4 Performance Characteristics of IC Packages 1/22/97 10:05 AM CH04WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 4 PERFORMANCE CHARACTERISTICS OF IC PACKAGES 4.1. IC PACKAGE ELECTRICAL CHARACTERISTICS The following parameters are provided for Intel packages:	Original	PDF	CH04WIP kic 125 ic KA 2645 C 6090 Side Brazed Ceramic Dual-In-Line Packages thermal analysis on pcb Coffin-Manson Equation AL Cu tungsten slug glass diode Braze Dual-In-Line 16 Packages cte table for epoxy adhesive and substrate PERFORMANCE CHARACTERISTICS OF IC PACKAGES
arstech Abstract: No abstract text available Text: Proceedings of IPACK2007 ASME InterPACK '07 July 8-12, 2007, Vancouver, British Columbia, CANADA IPACK2007-33870 CLOSED LOOP LIQUID COOLING FOR HIGH PERFORMANCE COMPUTER SYSTEMS Sukhvinder Kang [email protected] David Miller John Cennamo Aavid Thermalloy LLC,	Original	PDF	IPACK2007 IPACK2007-33870 D2570-96 arstech
pick and place robot Abstract: land pattern QFP 208 programming smt machine pick and place robot used for circuit assembling Surface mount SMA connector 300C IPC-SM-782 OMEGA P-M edge mount sma footprint SURFACE MOUNT TECHNOLOGY Text: 2 7 Surface Mount Technology 1/16/97 5:04 PM CH07WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 7 SURFACE MOUNT TECHNOLOGY 7.1. INTRODUCTION Traditional through-hole methods of assembling conventional electronic assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately	Original	PDF	CH07WIP pick and place robot land pattern QFP 208 programming smt machine pick and place robot used for circuit assembling Surface mount SMA connector 300C IPC-SM-782 OMEGA P-M edge mount sma footprint SURFACE MOUNT TECHNOLOGY
CPU COOLER Abstract: UL1430 FC-PGA flammability AWG26 Text: CPU Cooler SAN ACE MC Intel Pentium® Ⅲ Processor 1.4GHz（FC-PGA2 ）CPU Cooler For 1U server • General Speciﬁcations ・Material ……… Frame: Plastics Flammability: UL94V-0 , Impeller: Plastics (Flammability: UL94V-1) Aluminum base+copper ﬁn	Original	PDF	UL94V-0) UL94V-1 2695-03RP 5159PBT 109X7412S4016 AWG26 CPU COOLER UL1430 FC-PGA flammability

CPU COOLER Abstract: 478 cpu connector MOLEX CONNECTOR UL1430 Text: CPU Cooler SAN ACE MC Intel Pentium® 4 Processor （Socket 478） CPU Cooler • General Speciﬁcations ・Material ……… Frame: Plastics Flammability: UL94V-0 , Impeller: Plastics (Flammability: UL94V-1) Heatsink: Aluminum ・Lead Wire …… yellow (Connector No.2 side)	Original	PDF	UL94V-0) UL94V-1 2695-03RP 5159PBT 109X9812T0H016 109X9812H0016 AWG26 CPU COOLER 478 cpu connector MOLEX CONNECTOR UL1430
all type of motherboard 775 socket Abstract: LGA775 socket design guidelines LGA771 TMDG QX6800 lga 775 socket details LGA-771 intel motherboard lga775 LGA775 316854 Text: Intel Core 2 Extreme Processor QX9775Δ Thermal and Mechanical Design Guidelines Addendum February 2008 Document Number: 319130-001 THIS DOCUMENT AND RELATED MATERIALS AND INFORMATION ARE PROVIDED "AS IS” WITH NO WARRANTIES, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE,	Original	PDF	QX9775 all type of motherboard 775 socket LGA775 socket design guidelines LGA771 TMDG QX6800 lga 775 socket details LGA-771 intel motherboard lga775 LGA775 316854
CPU COOLER Abstract: WIESON 2510c888-001 2510c888-001 109X9112PT0H016 775 cpu connector wieson intel 775 775-LAND san ace cpu lga Text: CPU Cooler SAN ACE MC Intel 775-land LGA Package CPU Cooler • General Speciﬁcations ・Material ……… Frame: Plastics Flammability: UL94V-0 , Impeller: Plastics (Flammability: UL94V-1) Heatsink: Aluminum (Core: Copper) ・Lead Wire …… yellow (Connector No.2 side)	Original	PDF	775-land UL94V-0) UL94V-1 2510C888-001 5159PBT 2511-T1 109X9112PT0H016 HoneywellPCM45F AWG26 CPU COOLER WIESON 2510c888-001 109X9112PT0H016 775 cpu connector wieson intel 775 san ace cpu lga
heat sensor with fan cooling using ic LM 741 Abstract: 9GV0412P3 smr 40100 San Ace 120L 109R0624J402 109R1212H101 121 M 221 03 9cr0412s sanyo denki brushless p3 Sanyo Denki dc fan 109r0612t4h12 Text: COOLING SYSTEM San Ace Products Information 2006 ver.2 C O N T E N T S Technical Material ･････････････････････ p.3 Product Guide Instruction Manual for Fan ‥‥‥‥‥ p.20 Part Numbering System ‥‥‥‥‥‥ p.22	Original	PDF
SBC8153 Abstract: EN50081-1 P200 EN50082-1 EN50082-2 41 pin connector earth stud COM1RS-232 9 pin mini-din monitor connector P200 6pin Text: APC-Pentium User Guide 2192-09107-000-000 APC-PENTIUM Pentium/PCI Industrial PC A User Guide Page 1 2192-09107-000-000 APC-Pentium User Guide Contents Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3	Original	PDF	EN60950 SBC8153 EN50081-1 P200 EN50082-1 EN50082-2 41 pin connector earth stud COM1RS-232 9 pin mini-din monitor connector P200 6pin
Untitled Abstract: No abstract text available Text: PAPER# 2166 LOOP HEAT PIPE TECHNOLOGY FOR COOLING COMPUTER SERVERS Walter Zimbeck, Greg Slavik Technology Assessment & Transfer, Inc. 133 Defense Hwy, Suite 212 Annapolis, MD Ph: 410 224 3710 Email: [email protected] John Cennamo, Sukhvinder Kang Aavid Thermalloy	Original	PDF
tungsten slug glass diode Abstract: CERAMIC PIN GRID ARRAY wire lead frame 28F001BX 28F010 28F020 a5637 a5609 PERFORMANCE CHARACTERISTICS OF IC PACKAGES Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which	Original	PDF
intel microprocessors catalog 1977 Abstract: intel 4040 Micro Processor Intel 4040 1651826-1 EIA-364-27B EIA-364-9C P2/S18/P10 Text: Power Connectors & Interconnection Systems Voltage Regulation Module VRM Connectors Product Facts Available in latch versions for VRMs up to 3 oz. • Available with metal clip for VRMs over 3 oz. ■ VRM connectors to support a wide variety of Power Supply Standards	Original	PDF
pcm45 Abstract: honeywell pcm45 HSBGA IXP42X 10-5607 B1268 IXC1100 JESD51-1 JESD51-2 492PBGA Text: Intel IXP42X Product Line Thermal Design Application Note November 2005 Order Number: 309299, Revision: 001 November 2005 Legal Notice INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS	Original	PDF	IXP42X pcm45 honeywell pcm45 HSBGA 10-5607 B1268 IXC1100 JESD51-1 JESD51-2 492PBGA
p5ld2 Abstract: ASUS P5LD2 775 motherboard sunon fan 4 pin asus Sunon 120 x 120 x 25 fans am2 cpu MOTHERBOARD asus X23-7762 cpu Intel pentium Text: SUNON SPECIFICATION FOR APPROVAL CUSTOMER MOTOR TYPE MODEL NO P/N DESCRIPTION DIMENSIONS SUNON SPEC. NO. APPROVAL NO. APPROVED BY AUTHORIZED DRAWN jd n n & 8 /2 4 TC014-06001 WATURBO CPU COOLER 98X98X80 mm C03000010G-00 APPROVED / h - i'V i l n V ^ SPEC. NO	OCR Scan	PDF	TC014-06001 98X98X80 C03000010G-00 C03000010G-00 LGA775 95x95x50mm 3500ppm 4000ppm 20ppm p5ld2 ASUS P5LD2 775 motherboard sunon fan 4 pin asus Sunon 120 x 120 x 25 fans am2 cpu MOTHERBOARD asus X23-7762 cpu Intel pentium

INTEL LIQUID COOLING Search Results

INTEL LIQUID COOLING Result Highlights (5)

INTEL LIQUID COOLING Datasheets Context Search

intel 965 motherboard circuit diagram

a9007

gold metal detectors

Ultrasonic Cleaning Transducer

Alumina ceramic AI203

gold metal detectors

solid solubility

X23-7762

EP80579

Intel reflow soldering profile BGA

kic 125

arstech

pick and place robot

CPU COOLER

CPU COOLER

all type of motherboard 775 socket

CPU COOLER

heat sensor with fan cooling using ic LM 741

SBC8153

Untitled

tungsten slug glass diode

intel microprocessors catalog 1977

pcm45

p5ld2