Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    GLASS SEAL PGA Search Results

    GLASS SEAL PGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MD82510/B Rochester Electronics LLC Serial I/O Controller, 1 Channel(s), CMOS, CDIP28, GLASS SEALED, DIP-28 Visit Rochester Electronics LLC Buy
    5043/BEA Rochester Electronics LLC SPDT, 2 Func, 1 Channel, CMOS, CDIP16, GLASS, DIP-16 Visit Rochester Electronics LLC Buy
    MD28F010-90 Rochester Electronics LLC Flash, 128KX8, 90ns, CDIP32, HERMETIC SEALED, CERDIP-32 Visit Rochester Electronics LLC Buy
    HA7-5137A-5 Rochester Electronics LLC Operational Amplifier, 1 Func, 60uV Offset-Max, BIPolar, CDIP8, FRIT SEALED, CERDIP-8 Visit Rochester Electronics LLC Buy
    HA7-5221-5 Rochester Electronics LLC Operational Amplifier, 1 Func, 1500uV Offset-Max, BIPolar, CDIP8, FRIT SEALED, CERDIP-8 Visit Rochester Electronics LLC Buy

    GLASS SEAL PGA Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    Glass Seal PGA Altera CUSTOMER ADVISORY Glass Seal PGA Original PDF

    GLASS SEAL PGA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ADV9614

    Abstract: Glass Seal PGA
    Text: CUSTOMER ADVISORY GLASS SEAL PGA Overview In 1993 Altera converted its 68-, 84-, and 100-pin solder-seal Pin Grid Array PGA packages to a glass-sealed PGA package. However, since Altera acquired the Intel product line in 1994 the company has been supporting orders for the solder seal PGA package. Going forward, Altera


    Original     		PDF 100-pin MIL-STD-883, 9626C) ADV9614 ADV9614 Glass Seal PGA

    Alumina ceramic AI203

    Abstract: ausi die attach gold metal detectors AI203 gold melting furnace pressure low die attach spot welding schematics ausi die attach thin silicon die Dissolve Oxygen ceramic pin grid array package wire bond
    Text: Alumina & Leaded Molded Technology 3 3.1 Introduction The packaging technologies used to manufacture or assemble three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity


    Original     		PDF

    gold metal detectors

    Abstract: epoxy adhesive paste cte table 28 pin ic base socket round pin type lead spot welding schematics soft solder die bonding electrical three phase schematic riser DIAGRAM CERAMIC PIN GRID ARRAY wire lead frame ausi die attach thin silicon die soft solder wire dispensing 10 k ntc thermistor
    Text: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity


    Original     		PDF

    solid solubility

    Abstract: chemical control process block diagram
    Text: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity


    Original     		PDF

    100 series machine screw SOCKET

    Abstract: No abstract text available
    Text: 3M PGA Socket Screw Machine 200 Series • Accepts various PGA packages • Reliable four finger contact interface • Unique body design prevents air voids during soldering • Optional seal tape for closed-body configuration • Custom patterns available for quantities above


    Original     		PDF TS-2116-03 100 series machine screw SOCKET

    gold metal detectors

    Abstract: soft solder die bonding schematic diagram intel atom INCOMING RAW MATERIAL INSPECTION lead side brazed hermetic X-RAY INSPECTION ausi die attach electrical three phase schematic riser DIAGRAM epoxy adhesive paste cte table intel 24008
    Text: 2 3 Component Assembly Technology 1/22/97 9:49 AM CH03WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 3 COMPONENT ASSEMBLY TECHNOLOGY 3.1. INTRODUCTION The packaging technologies used to manufacture or assemble Intel’s three basic types of


    Original     		PDF CH03WIP gold metal detectors soft solder die bonding schematic diagram intel atom INCOMING RAW MATERIAL INSPECTION lead side brazed hermetic X-RAY INSPECTION ausi die attach electrical three phase schematic riser DIAGRAM epoxy adhesive paste cte table intel 24008

    Untitled

    Abstract: No abstract text available
    Text: 3M PGA Socket Screw Machine 200 Series ED • Accepts various PGA packages • Reliable four finger contact interface • Unique body design prevents air voids during soldering • Optional seal tape for closed-body configuration • Custom patterns available for quantities above


    Original     		PDF TS-2116-B

    Ultrasonic Cleaning Transducer

    Abstract: Ultrasonic welding circuit diagram gold metal detectors ultrasonic transducer cleaning bath Ultrasonic nozzle schematic ultrasonic motion detector gold detectors circuit INCOMING RAW MATERIAL INSPECTION soft solder wire dispensing soft solder die bonding
    Text: CHAPTER 3 IC ASSEMBLY TECHNOLOGY INTRODUCTION The material and process technology steps used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter The package families described in Chapter 1 provide the functional specialization and diversity required by our customers Material and construction attributes of individual family


    Original     		PDF

    SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY

    Abstract: MS011800 bond wire gold copper bond wire cte table epoxy substrate soft solder wire dispensing NATIONAL SEMICONDUCTOR ink MARKING AU4A cte table ic bga PCB monitor spc
    Text: Semiconductor Packaging Assembly Technology Introduction This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages. Electronic packaging provides the interconnection from the IC to the printed circuit board PCB .


    Original     		PDF

    94vo fr4

    Abstract: No abstract text available
    Text: Low Insertion Force PGA Sockets 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email [email protected] • Internet http://www.advintcorp.com Molded & FR-4 Low Insertion Force PGA Sockets .100


    Original     		PDF

    94vo fr4

    Abstract: C17200 pga socket 64 3m
    Text: cat15 5/22/01 9:40 AM Page 32 Low Insertion Force PGA Sockets 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email [email protected] • Internet http://www.advintcorp.com Molded & FR-4 Low Insertion Force PGA Sockets


    Original     		PDF cat15 C36000) 94vo fr4 C17200 pga socket 64 3m

    823B

    Abstract: DL201 motorola handbook 84 pin plcc ic base Reliability and quality handbook
    Text: MOTOROLA SEMICONDUCTOR GENERAL INFORMATION Packaging & Case Information 84-Pin PLCC CASE 780A-01 ISSUE A FN SUFFIX 181-Pin PGA CASE 795A–02 ISSUE A HI SUFFIX 128-Pin QFP CASE 862A-02 ISSUE B DD SUFFIX 208-Pin QFP CASE 872A-01 ISSUE TBD DK SUFFIX 160-Pin QFP


    Original     		PDF 84-Pin 80A-01 181-Pin 128-Pin 62A-02 208-Pin 72A-01 160-Pin 64A-03 224-Pin 823B DL201 motorola handbook 84 pin plcc ic base Reliability and quality handbook

    CONDUCTIVE INK

    Abstract: tic 719 Glob COB CHIP ON BOARD marking ic 2008 dam and fill
    Text: Comprehensive radiation effects test and support Quick-Turn Prototype IC Assembly Aeroflex RAD offers the following services: Quick-Turn Prototype IC Assembly in ceramic, etched out plastic, COB and flip chip. Quick-Turn Prototype IC Assembly Capabilities


    Original     		PDF 50-500X) MIL-PRF-38535 MIL-PRF-19500 AS9100 CONDUCTIVE INK tic 719 Glob COB CHIP ON BOARD marking ic 2008 dam and fill

    Datasheet of IC 7432

    Abstract: 7415 ic pin details data sheet IC 7432 DATASHEET OF IC 7401 7401 ic configuration IC 7409 draw pin configuration of ic 7402 INFORMATION OF IC 7424 BGA and QFP Package mounting EIA and EIAJ standards
    Text: CHAPTER 1 CHAPTER 1 1.1 PACKAGE OUTLINES AND EXPLANATION PACKAGE OUTLINES AND EXPLANATION Types of Packages 1.1.1 Classification of IC packages The following figure classifies the packages for semiconductor products: SDIP DIP QUIP SIP ZIP Through hole mount type


    Original     		PDF

    AS400

    Abstract: S390 ES9000 S390-G5 CMOS-6S S390G ibm semi
    Text: THIN FILM PGA ON S390-G5 MAINFRAME HIGH DENSITY MCMS A. K. Malhotra*, D. C. McHerron, R. Shields, B. Ghosal, G. Martin, D. Scheider, J. R. Pennacchia IBM Microelectronics Division, Rt. 52, Hopewell Junction, New York 12533 * Tel.: 914 894-3326; Email: [email protected]


    Original     		PDF S390-G5 S-390 127mm 127mm AS400 S390 ES9000 CMOS-6S S390G ibm semi

    smd transistor M7A

    Abstract: ED-7304-1 smd m7a uPD4011BG ED730 EIA and EIAJ tape standards ED-7417 EIA and EIAJ standards ED-7409 IEC-Publication-747
    Text: CONTENTS 1. STANDARDIZATION OF PACKAGES 1.1 EIAJ Standards 1.2 JEDEC Standards 1.3 IEC Standards 2. NAME'S OF NEC'S PACKAGES 3. PACKAGE CODES BY EIAJ 3.1 Construction of package code 4. DIMENSION SYMBOL AND EXAMPLE DIMENSIONS 4.1 Example of dimensions of packages


    Original     		PDF PD41265L-12-E1 PD41256L PD23C32000AGX-$ PD23C32000A smd transistor M7A ED-7304-1 smd m7a uPD4011BG ED730 EIA and EIAJ tape standards ED-7417 EIA and EIAJ standards ED-7409 IEC-Publication-747

    JM7000

    Abstract: ltx credence tester ltx ts80 teradyne flex tester credence tester sic wafer j937 optocoupler NAND SiC-JFET ceramic pin grid array package wire bond
    Text: Custom Product Capabilities Micross Components formerly Austin Semiconductor has loyally served the Military & Hi-Rel custom assembly and test marketplace for over 22 years. Custom support has been the company foundation since its inception, with the philosophy that if it can be defined by the customer, Micross will support the


    Original     		PDF 800Mhz JM7000 ltx credence tester ltx ts80 teradyne flex tester credence tester sic wafer j937 optocoupler NAND SiC-JFET ceramic pin grid array package wire bond

    fr4 94v0

    Abstract: No abstract text available
    Text: ADVANCED Low Insertion Force PGA Sockets INTERCONNECTIONS. 5 Energy Way, P.O. Box 1019, West Warwick, Rl 02893 USA Tel. 800-424-9850 / 401-823-5200 •Fax 401-823-8723 ■Email [email protected] • Internet http://www.advintcorp.com Molded & FR-4 Low Insertion Force PGA Sockets


    OCR Scan     		PDF

    94v0 fr4

    Abstract: fr4 94v0
    Text: Low Insertion Force PGA Sockets ADVANCED » INTERCONNECTIONS» 5 Energy Way, P.O. Box 1019, West W arwick, Rl 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@ advlntcorp.com • Internet http://w ww .advintcorp.com Molded & FR-4 Low Insertion Force PGA Sockets


    OCR Scan     		PDF Type-150 94v0 fr4 fr4 94v0

    Untitled

    Abstract: No abstract text available
    Text: XICOR SHE INC D * m i? 4 3 aaaam? b A D V A N C E D IN FO R M A TIO N Commercial Industrial 64K X28C64 X28C64I 8K x 8 Bit Electrically Erasable PROM T~y¿-/3~Z7 DESCRIPTION FEATURES • LOW Power CMOS —60 mA Active Current Max. —200 /aA Standby Current Max.


    OCR Scan     		PDF X28C64 X28C64I 64-Byte X28C64, 32-PAD

    x2864a

    Abstract: X2864B
    Text: i m C/1kr 64K Commercial X2864B moo v a Rit Industrial_ X2864BI_ 8 19 2x 8B lt Electrically Erasable PROM _ DESCRIPTION TYPICAL FEATURES • 120 ns Access Time • High Perform ance Scaled NMOS Technology • Fast W rite Cycle Times


    OCR Scan     		PDF X2864B X2864BI_ 32-Byte X2864B X2864B, X2864BI 32-PAD x2864a

    *26C64

    Abstract: X2864B X28C64G x28c64 X23c64 INS250 X2864A x2864a ordering X2HC64 x26c
    Text: ADVANCED INFORMATION Commercial X28C64 m* Industrial_X28C64I_ 8K x 8 Blt RA1£ 64K Electrically Erasable PROM FEATURES • LOW Power CMOS — 60 mA Active Current Max. —200 jliA Standby Current Max. • Fast Write Cycle Times


    OCR Scan     		PDF X28C64 X28C64I_ --64-Byte X2-113 X28C64, X28C64I 32-PAD *26C64 X2864B X28C64G X23c64 INS250 X2864A x2864a ordering X2HC64 x26c

    X2864BP

    Abstract: x2864 x2864bd X2864B x2864bd-15 x2864BDI X2864BD-18 X2864BJ X2864BJI-18 Xicor
    Text: ü a r Commercial X2864B m oovftB i* Industrial_ X2864BI_ 8192x8 Bit 64K Electrically Erasable PROM TYPICAL FEATURES • 120 ns Access Time • High Performance Scaled NMOS Technology • Fast Write Cycle Times —32-Byte Page Write Operation


    OCR Scan     		PDF X2864B X2864BI_ 8192x8 --32-Byte 32-PAD X2864BP x2864 x2864bd x2864bd-15 x2864BDI X2864BD-18 X2864BJ X2864BJI-18 Xicor

    Untitled

    Abstract: No abstract text available
    Text: 256K Military X28C256M 32Kx8Bit _ Electrically Erasable PROM_ FEATURES • LOW Power CMOS — 60 mA Active Current Max. —200 juA Standby Current Max. • Fast Write Cycle Times


    OCR Scan     		PDF X28C256M 32Kx8Bit 64-Byte X2864A JEDE51