KLM8G2FE3B
Abstract: klm8g samsung eMMC 4.5 TLC nand samsung tlc nand flash KLM4G 153 ball eMMC memory SAMSUNG emmc klm8g2 Samsung KLMBG4GE2A
Text: Samsung eMMC Managed NAND Flash memory solution supports mobile applications FBGA QDP Package BROCHURE Efficiency, reduced costs and quicker time to market Expand device development with capable memory solutions Simplify mass storage designs Conventional NAND Flash memory can be challenging to
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CLKIN32
Abstract: No abstract text available
Text: CYUSB302x SD3 USB and Mass Storage Peripheral Controller Features • ■ ■ ■ ■ Latest-generation storage support ❐ SD3.0/SDXC – UHS1 SDR50 / DDR50 Master ❐ eMMC 4.4 Master ❐ SDIO 3.0 Master ■ Independent power domains for core and I/O ■
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CYUSB302x
SDR50
DDR50
CLKIN32
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samsung eMMC 4.5
Abstract: eMMC samsung* lpddr2 lpddr2 SAMSUNG emmc emmc 4.5 emmc samsung SAMSUNG moviNAND lpddr2 mcp samsung lpddr2
Text: Samsung Mobile Memory Taking Mobility to New Storage Horizons Mobile DRAM | Multi-Chip Packages | eMMC Samsung Mobile Memory Mobile DRAM The future of Mobile DRAM Performance and battery life are the key metrics upon which mobile electronics are measured. Samsung Mobile
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BRO-09-DRAM-001
samsung eMMC 4.5
eMMC
samsung* lpddr2
lpddr2
SAMSUNG emmc
emmc 4.5
emmc samsung
SAMSUNG moviNAND
lpddr2 mcp
samsung lpddr2
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XAM3359AZCZ100
Abstract: No abstract text available
Text: REF: BBONEBLK_SRM BeagleBone Black System Reference Manual BeagleBone Black System Reference Manual Revision A5.2 April 11, 2013 Author: Gerald Coley Contributing Editor: Robert P J Day Page 1 of 108 Rev A5.2 REF: BBONEBLK_SRM BeagleBone Black System Reference Manual
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imx6sl
Abstract: IMXEBOOKDC3-E SD socket
Text: Quick Start Guide i.MX 6SoloLite Evaluation Kit Quick Start Guide About the i.MX 6SoloLite Evaluation Kit The i.MX 6SoloLite evaluation kit EVK offers a solid platform to evaluate the i.MX 6 series single-core processor built on ARM Cortex -A9 technology as well as a
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d2516ec
Abstract: KE4CN2H5A kingston memory schematic
Text: REF: BBONEBLK_SRM BeagleBone Black System Reference Manual BeagleBone Black System Reference Manual Revision C.1 May 22, 2014 Author: Gerald Coley [email protected] Contributing Editor: Robert P J Day Page 1 of 126 Rev C.1 REF: BBONEBLK_SRM BeagleBone Black System
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lpddr4
Abstract: emmc pcb layout
Text: REF: BBONEBLK_SRM BeagleBone Black System Reference Manual BeagleBone Black System Reference Manual Revision A5.2 April 11, 2013 Author: Gerald Coley Contributing Editor: Robert P J Day Page 1 of 108 Rev A5.2 REF: BBONEBLK_SRM BeagleBone Black System Reference Manual
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QCA6
Abstract: No abstract text available
Text: IFC6410 Snapdragon S4 Pro Pico-ITX Single-Board Computer Processing, Power, and Performance • Qualcomm Snapdragon™ S4 Pro APQ8064 • Quad core Krait , 1.7GHz, 2MB L2 cache 2 GB on-board DDR3 Independent Clock Scaling Per Core Connectivity, Storage & I/O
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IFC6410
APQ8064
HD1080p
IFC6410
SYS6440-00-P1
IFC6400-00-P1
IFC6410-00-P1
QCA6
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EMMC
Abstract: USB2611 eMMC memory emmc controller datasheet mobile charger enhancement MTS-USB-103-05 eMMC driver emmc reader emmc operation emmc datasheet
Text: USB2611 Sideload Accelerator Fully-Integrated Hi-Speed USB 2.0 Sideload Accelerator Featuring MTP Boost™ Technology and Multimedia Sync Capabilities SMSC’s USB2611 Hi-Speed USB 2.0 Sideload Accelerator provides ultra-fast card reader download speeds for mobile phones and
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USB2611
USB2611,
EMMC
eMMC memory
emmc controller datasheet
mobile charger enhancement
MTS-USB-103-05
eMMC driver
emmc reader
emmc operation
emmc datasheet
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movinand emmc
Abstract: samsung emmc lpddr2 moviNAND samsung eMMC 5.0 eMMC samsung emmc tlc samsung* lpddr2* pop package samsung lpddr2 SAMSUNG CL10
Text: When Less Is More: Bigger & Faster Memory in Shrinking Packages for the Mobile Market Kathy Choe Thomas, Flash Product Mktg Samsung Semiconductor, Inc. Living in the Connected World Like it or Not, We Are Connected Anytime, Anywhere Cloud Services Bio Mobile
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APQ8064
Abstract: i2c/qualcomm uart IFC6400
Text: IFC6400 Snapdragon S4 Pro Qseven™ Computing Platform Processing, Power, and Performance • Qualcomm Snapdragon S4 Pro APQ8064 • 4-core Krait , 1.7GHz, 2MB L2 cache 2 GB on-board DDR3 PCDDR 533MHz Independent Clock Scaling Per Core
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IFC6400
APQ8064
533MHz)
HD1080p
QCA6234
IFC6400
IFC6400-00-P1
SYS6440-00-P1
APQ8064
i2c/qualcomm uart
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LPDDR2 PoP
Abstract: LPDDR2 micron lpddr2 lpddr2 datasheet 216-ball LPDDR lpddr2 nand mcp Micron 512MB nand FLASH 136-Ball 168-ball LPDDR Micron NAND
Text: A Perfect Match for Matchless Performance Micron Multichip Packages Form Factor, Speed, Power. Choose All That Apply. Form factor, speed, power—your mobile customers want all three. With Micron’s MCPs, you can respond to customers’ everincreasing demands without compromising leading-edge performance. Mix and match devices, configurations, and package
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Untitled
Abstract: No abstract text available
Text: QuickLogic CSSP Solutions Guide Customer Specific Standard Product CSSP Solutions Answers to Mobile Market Designer Challenges QuickLogic Corporation helps mobile product system architects and designers face increasingly difficult design challenges such as:
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OMAP5430
Abstract: OMAP5432 MIPI CSI-2 Parallel bridge Toshiba eMMC 4.40 emmc pcb layout toshiba eMMC DS MIPI DPI CAMERA PARALLEL RGB TO MIPI CSI-2 TWL6041 emmc toshiba
Text: Version F EL I M Data Manual IN Multimedia Device Engineering Samples 2.0 AR OMAP5430 Public Version PR ADVANCE INFORMATION concerns new products in the sampling or preproduction phase of development. Characteristic data and other specifications are subject to change without notice.
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OMAP5430
SWPS052F
OMAP5430
OMAP5432
MIPI CSI-2 Parallel bridge
Toshiba eMMC 4.40
emmc pcb layout
toshiba eMMC DS
MIPI DPI
CAMERA PARALLEL RGB TO MIPI CSI-2
TWL6041
emmc toshiba
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sony IMX 161
Abstract: STMP3780 toshiba 16GB Nand flash emmc Cortex-A8 MIPI Toshiba emmc i.mx258 MC9S08GP32 sony cmos sensor imx 17 OV56 Sony IMX283
Text: TM August 2013 TM 2 Your Interface to the World i.MX families offer the most versatile platforms for multimedia and display applications, bringing personality and interactivity to a whole new world of products Auto Smart Devices TM Industrial Medical 3 New!
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emmc spi bridge
Abstract: MMC version 4.2 SEC2410 emmc firmware emmc footprint emmc 4.43 EMMC HOST CONTROLLER SmartCard Writer usb flash drive circuit diagram usb sdxc
Text: SEC2410/SEC4410 HS Endpoint Processor with USB 2.0, Smart Card, & FMC for Secure Token & Storage PRODUCT FEATURES Data Brief General Description Hardware Features The SMSC SEC2410/SEC4410 are USB 2.0 compliant, hi-speed bulk-only mass storage class peripheral
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SEC2410/SEC4410
SEC2410/SEC4410
GPIO10/
SEC4410
64-Pin
emmc spi bridge
MMC version 4.2
SEC2410
emmc firmware
emmc footprint
emmc 4.43
EMMC HOST CONTROLLER
SmartCard Writer
usb flash drive circuit diagram
usb sdxc
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Untitled
Abstract: No abstract text available
Text: TM September 2013 • Consumers in the mass market are driving demand for seamless integration of their smart-devices to bring personal content into the vehicle • OEM software costs continue to rise due to increased resource and development needed to support higher level of
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66MHz
132MByte/sec
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emmc pcb layout
Abstract: AN10911 micro SD-Card holders IP4852CX25 IP4052CX20/LF IP4052CX20-LF emmc market trend JESD84-A43 eMMC emmc 4.5
Text: AN10911 SD HC -memory card and MMC interface conditioning Rev. 01 — 29 April 2010 Application note Document information Info Content Keywords SD-memory card, Multi Media Card (MMC), ElectroStatic Discharge (ESD) protection, ElectroMagnetic Interference (EMI) filtering,
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AN10911
AN10911
emmc pcb layout
micro SD-Card holders
IP4852CX25
IP4052CX20/LF
IP4052CX20-LF
emmc market trend
JESD84-A43
eMMC
emmc 4.5
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"EPD controller"
Abstract: EPD controller mini pcie connector emmc Card connector LPDDR2 DRAM emmc emmc sd socket ARM graphics emmc socket EMMC HOST CONTROLLER
Text: i.MX50 Applications Processor SABRE Platform for eReaders Based on i.MX50 Overview Freescale delivers the next installment in the Smart Application Blueprint for Rapid Engineering SABRE series of market-focused reference designs: the SABRE platform for eReaders based on the marketleading i.MX508 applications processor. The i.MX508 is the first system-on-a-chip (SoC) designed
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MX508
MCIMX50SABRE
IMX50ERDRFS
"EPD controller"
EPD controller
mini pcie connector
emmc Card connector
LPDDR2 DRAM
emmc
emmc sd socket
ARM graphics
emmc socket
EMMC HOST CONTROLLER
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Untitled
Abstract: No abstract text available
Text: i.MX Applications Processors Evaluation Kit for the i.MX50 Applications Processor Overview The i.MX50 Evaluation Kit EVK offers developers a price effective platform for developing products with the i.MX50 family of applications processors based on the ARM Cortex -A8 core. The EVK
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MC34708
com/iMX50EVK.
IMX50EVKFS
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ATMEL450
Abstract: No abstract text available
Text: Atmel SAMA5D3 Xplained For Prototyping and Evaluating MPUs Introducing the Atmel SAMA5D3 Xplained This evaluation kit is a fast prototyping and low cost evaluation platform for Atmel’s SAMA5D3 ARM® Cortex®-A5 processor-based microprocessor design. It comes with
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Untitled
Abstract: No abstract text available
Text: 32-bit Controller Solutions Vybrid VF5xxR Family • Connected radios Automotive solutions for connected radio, entry-level infotainment and digital instrument cluster applications • Entry-level infotainment Overview • Digital instrument clusters The Vybrid VF5xxR family is purpose-built and cost-optimized for connected radio, entry-level
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32-bit
MLB50
364-pin
17x17
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PMM-C
Abstract: micro sd card CYWB0163BB
Text: CYWB0163BB/CYWB0164BB West Bridge Bay USB and Mass Storage Controller Features • Best-in-class sideloading performance >30 MBps based on Cypress's proprietary SLIM® II technology, enabling direct path from Hi-Speed USB 2.0 to mass storage devices
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CYWB0163BB/CYWB0164BB
PMM-C
micro sd card CYWB0163BB
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infineon x-gold
Abstract: MIPI csi-2 x-gold eMMC X-GOLD613 MIPI CSI-2 Parallel MIPI csi ARM11 infineon gold arm1176 lpddr1
Text: Product Brief X-GOLD 613 TM 3G Low-Cost Solution for Mobile Internet Browsing & Messaging Main Features The Infineon X-GOLD 613 is a cellular System-on-Chip comprising of 2G/3G digital and analog baseband plus power management functionality, all monolithically integrated in 65nm CMOS technology. It is Infineon’s 3rd
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X-GOLDTM213,
X-GOLDTM613
B153-H9352-X-X-7600
NB08-1348
infineon x-gold
MIPI csi-2
x-gold
eMMC
X-GOLD613
MIPI CSI-2 Parallel
MIPI csi
ARM11 infineon gold
arm1176
lpddr1
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