DS3141
Abstract: DS3141N DS3142 DS3142N DS3143 DS3143N DS3144 DS3144N
Text: DS3141/DS3142/DS3143/DS3144 Single/Dual/Triple/Quad DS3/E3 Framers www.maxim-ic.com GENERAL DESCRIPTION FEATURES The DS3141/DS3142/DS3143/DS3144 DS314_ devices include all necessary circuitry to frame and format up to four separate DS3 or E3 channels. Each
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DS3141/DS3142/DS3143/DS3144
DS314_
DS3144
DS3141/DS3142/DS3143
DS3141
DS3141N
DS3142
DS3142N
DS3143
DS3143N
DS3144N
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Untitled
Abstract: No abstract text available
Text: DESIGN KIT AVAILABLE DS3146/DS3148/DS31412 6-/8-/12-Channel DS3/E3 Framers www.maxim-ic.com GENERAL DESCRIPTION FEATURES The DS3146/DS3148/DS31412 DS314x devices include all necessary circuitry to frame and format up to 12 separate DS3 or E3 channels. Each framer in
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DS3146/DS3148/DS31412
6-/8-/12-Channel
DS314x)
DS31412
DS3146,
DS3148
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Untitled
Abstract: No abstract text available
Text: DESIGN KIT AVAILABLE DS3141/DS3142/DS3143/DS3144 Single/Dual/Triple/Quad DS3/E3 Framers www.maxim-ic.com GENERAL DESCRIPTION FEATURES The DS3141, DS3142, DS3143, and DS3144 DS314x devices include all necessary circuitry to frame and format up to four separate DS3 or E3
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DS3141/DS3142/DS3143/DS3144
DS3141,
DS3142,
DS3143,
DS3144
DS314x)
DS3144
DS3141/DS3142/DS3143
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GR-820-CORE
Abstract: BBC30 DS3141 DS3141N DS3142 DS3143 DS3143N DS3144 DS3144N GR-820
Text: DESIGN KIT AVAILABLE DS3141/DS3142/DS3143/DS3144 Single/Dual/Triple/Quad DS3/E3 Framers www.maxim-ic.com GENERAL DESCRIPTION FEATURES The DS3141, DS3142, DS3143, and DS3144 DS314x devices include all necessary circuitry to frame and format up to four separate DS3 or E3
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DS3141/DS3142/DS3143/DS3144
DS3141,
DS3142,
DS3143,
DS3144
DS314x)
DS3144
DS3141/DS3142/DS3143
GR-820-CORE
BBC30
DS3141
DS3141N
DS3142
DS3143
DS3143N
DS3144N
GR-820
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n8n1
Abstract: DS31412 DS31412N DS3146 DS3146N DS3148 DS3148N BPV10 MC3 117
Text: DESIGN KIT AVAILABLE DS3146/DS3148/DS31412 6-/8-/12-Channel DS3/E3 Framers www.maxim-ic.com GENERAL DESCRIPTION FEATURES The DS3146/DS3148/DS31412 DS314x devices include all necessary circuitry to frame and format up to 12 separate DS3 or E3 channels. Each framer in
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DS3146/DS3148/DS31412
6-/8-/12-Channel
DS314x)
DS31412
DS3146,
DS3148
n8n1
DS31412N
DS3146
DS3146N
DS3148N
BPV10
MC3 117
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Untitled
Abstract: No abstract text available
Text: DS3141/DS3142/DS3143/DS3144 Single/Dual/Triple/Quad DS3/E3 Framers www.maxim-ic.com GENERAL DESCRIPTION FEATURES The DS3141/DS3142/DS3143/DS3144 devices include all necessary circuitry to frame and format up to four separate DS3 or E3 channels. Each framer in these devices is
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DS3141/DS3142/DS3143/DS3144
DS314x
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BBC15
Abstract: DS31412 DS31412N DS3146 DS3146N DS3148 DS3148N CPE10 GR-820 BBC21
Text: DS3146/DS3148/DS31412 6-/8-/12-Channel DS3/E3 Framers www.maxim-ic.com GENERAL DESCRIPTION FEATURES The DS3146/DS3148/DS31412 DS314_ devices include all necessary circuitry to frame and format up to 12 separate DS3 or E3 channels. Each framer in these devices is independently configurable to
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DS3146/DS3148/DS31412
6-/8-/12-Channel
DS314_
DS31412
BBC15
DS31412N
DS3146
DS3146N
DS3148
DS3148N
CPE10
GR-820
BBC21
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BEC20
Abstract: BBC15 BBC10 DS3141 DS3141N DS3142 DS3143 DS3143N DS3144 DS3144N
Text: DS3141/DS3142/DS3143/DS3144 Single/Dual/Triple/Quad DS3/E3 Framers www.maxim-ic.com GENERAL DESCRIPTION FEATURES The DS3141, DS3142, DS3143, and DS3144 DS314x devices include all necessary circuitry to frame and format up to four separate DS3 or E3 channels. Each framer in these devices is
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DS3141/DS3142/DS3143/DS3144
DS3141,
DS3142,
DS3143,
DS3144
DS314x)
DS3144
DS3141/DS3142/DS3143
BEC20
BBC15
BBC10
DS3141
DS3141N
DS3142
DS3143
DS3143N
DS3144N
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stk 3120
Abstract: 80c186 obsolete date CR056 DT 8210 IC TSC 232 CPE cr038 DT 8210 stk 432 070 BT8210EPF 8210 microprocessor
Text: Advance Information This document contains information on a product under development. The parametric information contains target parameters that are subject to change. Printed exclusively for DataRace Bt8209/8210 SMDS Control and Reassembly Formatter SCARF
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Bt8209/8210
Bt8209
Bt8210
stk 3120
80c186 obsolete date
CR056
DT 8210 IC
TSC 232 CPE
cr038
DT 8210
stk 432 070
BT8210EPF
8210 microprocessor
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY PRODUCT BRIEF Rev: 071207 DS33M30/DS33M31/DS33M33 Ethernet Over SONET/SDH Mapper Features General Description The DS33M30 family of products provide a compact and efficient solution for transporting Gigabit Ethernet traffic over STM-1/OC-3 Optical networks. With the
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DS33M30/DS33M31/DS33M33
M31/M33)
512Mb
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tr/P45/marking code M31
Abstract: No abstract text available
Text: Rev 1; 010809 DS33M30/DS33M31/DS33M33 Ethernet Over SONET/SDH Mapper _ General Description _Features ♦ Support for EoS in One STS-3c/VC-4, EoS Over Up to Three Concatenated STS-1/VC-3s, and EoPoS Over Up to Three Concatenated
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DS33M30/DS33M31/DS33M33
52Mbps
512Mb
DS33M30/M31/M33
DS33M31
DS33M33
tr/P45/marking code M31
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transistor gl 1117
Abstract: smd diode f54 smd 9103 manual LM 1117 smd Transistor gl 1117 B 734A coaxial cable 212EH ds 09e smd transformer SMD-B 053 LB 11911
Text: PRODUCT BRIEF DS3170 DS3/E3 Single-Chip Transceiver www.maxim-ic.com GENERAL DESCRIPTION FEATURES The DS3170 combines a DS3/E3 framer and an LIU single-chip transceiver to interface to a DS3/E3 physical copper line. § § APPLICATIONS § Access Concentrators
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DS3170
DS3170
DS3170L
DS3170N
DS3170LN
transistor gl 1117
smd diode f54
smd 9103 manual
LM 1117
smd Transistor gl 1117 B
734A coaxial cable
212EH
ds 09e smd transformer
SMD-B 053
LB 11911
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LED IR for Tx, RX
Abstract: din en iso 10664 212eh rgc5 BPV12 818E3
Text: PRODUCT BRIEF 19-5785; Rev 2; 3/11 DS3170 DS3/E3 Single-Chip Transceiver GENERAL DESCRIPTION FEATURES The DS3170 combines a DS3/E3 framer and an LIU single-chip transceiver to interface to a DS3/E3 physical copper line. • • APPLICATIONS Access Concentrators
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DS3170
DS3170
DS3170+
DS3170N
DS3170N+
LED IR for Tx, RX
din en iso 10664
212eh
rgc5
BPV12
818E3
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Untitled
Abstract: No abstract text available
Text: Rev 1; 010809 DS33M30/DS33M31/DS33M33 Ethernet Over SONET/SDH Mapper _ General Description _Features Support for EoS in One STS-3c/VC-4, EoS Over Up to Three Concatenated STS-1/VC-3s, and EoPoS Over Up to Three Concatenated
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DS33M30/DS33M31/DS33M33
52Mbps
512Mb
DS33M30/M31/M33
DS33M31
DS33M33
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SDH ADM
Abstract: MultiService Access Platform Frame structure for Multiplexing of four E2 streams into E3 stream barker code motorola STM-1 Physical interface PHY STS-3c-SPE DS33 k4h561638f trace code micron label
Text: ABRIDGED DATA SHEET Rev: 101508 DS33M30/DS33M31/DS33M33 Ethernet Over SONET/SDH Mapper _ General Description _Features ♦ Support for EoS in One STS-3c/VC-4, EoS Over Up to Three Concatenated STS-1/VC-3s,
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DS33M30/DS33M31/DS33M33
52Mbps
512Mb
DS33X11/
DS33X41
com/DS33M30.
SDH ADM
MultiService Access Platform
Frame structure for Multiplexing of four E2 streams into E3 stream
barker code motorola
STM-1 Physical interface PHY
STS-3c-SPE
DS33
k4h561638f
trace code micron label
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Untitled
Abstract: No abstract text available
Text: PRODUCT BRIEF 19-5785; Rev 2; 3/11 DS3170 DS3/E3 Single-Chip Transceiver GENERAL DESCRIPTION FEATURES The DS3170 combines a DS3/E3 framer and an LIU single-chip transceiver to interface to a DS3/E3 physical copper line. • • APPLICATIONS Access Concentrators
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DS3170
DS3170
DS3170+
DS3170N
DS3170N+
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smd Transistor gl 1117 B
Abstract: 212EH BSP19 LM 1117 HDB3 E2 transistor gl 1117 Transistor gl 1117 B DS3170 DS3170N DS3171
Text: PRODUCT BRIEF DS3170 DS3/E3 Single-Chip Transceiver www.maxim-ic.com GENERAL DESCRIPTION FEATURES The DS3170 combines a DS3/E3 framer and an LIU single-chip transceiver to interface to a DS3/E3 physical copper line. APPLICATIONS Access Concentrators Routers and Switches
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DS3170
DS3170
256in
smd Transistor gl 1117 B
212EH
BSP19
LM 1117
HDB3 E2
transistor gl 1117
Transistor gl 1117 B
DS3170N
DS3171
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Untitled
Abstract: No abstract text available
Text: PRODUCT BRIEF DS3177 DS3/E3 Single-Chip Transceiver FEATURES GENERAL DESCRIPTION The DS3177 combines a DS3/E3 framer and an LIU single-chip transceiver to interface to a DS3/E3 physical copper line. APPLICATIONS Access Concentrators Routers and Switches
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DS3177
DS3177
DS3177+
DS3177N+
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Untitled
Abstract: No abstract text available
Text: PRODUCT BRIEF DS3177 DS3/E3 Single-Chip Transceiver FEATURES GENERAL DESCRIPTION The DS3177 combines a DS3/E3 framer and an LIU single-chip transceiver to interface to a DS3/E3 physical copper line. • • APPLICATIONS Routers and Switches Multiservice Access
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DS3177
DS3177
DS3177N+
DS3177+
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smd K2F
Abstract: smd diode K2F din en iso 10664 J58-J5E K117 datasheet RGC W5 transistor k117 812e3 K117 DS3171N
Text: DS3171/DS3172/DS3173/DS3174 Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers www.maxim-ic.com GENERAL DESCRIPTION FUNCTIONAL DIAGRAM The DS3171, DS3172, DS3173, and DS3174 DS317x combine a DS3/E3 framer(s) and LIU(s) to interface to as many as four DS3/E3 physical copper
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DS3171/DS3172/DS3173/DS3174
DS3171,
DS3172,
DS3173,
DS3174
DS317x)
DS3171*
DS3171N*
DS3172*
DS3172N*
smd K2F
smd diode K2F
din en iso 10664
J58-J5E
K117 datasheet
RGC W5
transistor k117
812e3
K117
DS3171N
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CEPT-E1
Abstract: SSM 2016 E13 diode e2 framer g742 diode DS1 E2 liu E3 multiplex demultiplex HDB3 E2 PRBS23 TFRA84J13
Text: Product Description, Revision 4 April 29, 2005 TFRA84J13 Ultraframer DS3/E3/DS2/E2/DS1/E1/DS0 1 Introduction The documentation package for the TFRA84J13 Ultraframer DS3/E3/DS2/E2/DS1/E1/DS0 chip consists of the following documents: The Ultramapper Family Register Description and the Ultramapper Family System Design Guide. These documents
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TFRA84J13
DS03-076BBAC-4
DS03-076BBAC-3)
CEPT-E1
SSM 2016
E13 diode
e2 framer g742
diode DS1
E2 liu
E3 multiplex demultiplex
HDB3 E2
PRBS23
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Untitled
Abstract: No abstract text available
Text: DS3171/DS3172/DS3173/DS3174 Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers www.maxim-ic.com GENERAL DESCRIPTION FUNCTIONAL DIAGRAM The DS3171, DS3172, DS3173, and DS3174 DS317x combine a DS3/E3 framer(s) and LIU(s) to interface to as many as four DS3/E3 physical copper
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DS3171/DS3172/DS3173/DS3174
DS3171,
DS3172,
DS3173,
DS3174
DS317x)
DS3171
DS3171N
DS3172
DS3172N
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SLC-96 Modes
Abstract: DS3 multiplex demultiplex PRBS23 TFRA84J13 TS16 TSWC01622 multiplexing e1 frame to e3 frame TTC 102 coded mark inversion
Text: Product Description, Revision 2 September 3, 2003 TFRA84J13 Ultraframer DS3/E3/DS2/E2/DS1/E1/DS0 1 Introduction The documentation package for the TFRA84J13 Ultraframer DS3/E3/DS2/E2/DS1/E1/DS0 chip consists of the following documents: • ■ The Register Description and the Ultramapper Family System Design Guide. These documents are available on a
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TFRA84J13
DS03-076BBAC-2
DS03-076BBAC-1)
SLC-96 Modes
DS3 multiplex demultiplex
PRBS23
TS16
TSWC01622
multiplexing e1 frame to e3 frame
TTC 102
coded mark inversion
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rsm 2814
Abstract: No abstract text available
Text: 1.0 Product Description - The Bt8209 and Bt8210 Switched Multimegabit Data Service SMDS Control and Reassembly Formatters (SCARF) provide a single-access SMDS service ter mination for connectionless data, “datagram,” transfer according to Bellcore TRTSV-000772 and TR-TSV-000773. Customer Premise Equipment (CPE) and
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Bt8209
Bt8210
TRTSV-000772
TR-TSV-000773.
TR-TSV-000774
TR-TSV-000775
0x2000-0x3FFF)
L8210
rsm 2814
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