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    DIM200PHM33-F000

    Abstract: No abstract text available
    Text: DIM200PHM33-F000 Half Bridge IGBT Module DS5606-3.3 AUGUST 2008 LN26304 FEATURES Isolated MMC Base plate with AIN Substrate KEY PARAMETERS VCES VCE (sat)* (typ) IC (max) IC(PK) (max) High Thermal Cycling Capability * Soft Punch Through Silicon 10µs Short Circuit Withstand


    Original     		PDF DIM200PHM33-F000 DS5606-3 LN26304) DIM200PHM33-F000