plastic ul94v0
Abstract: 45x45 bga 45x45 mm bga 6063
Text: Model Name : MBA45001-15W/2.6 BGA Heat Sink For 45x45 Chip set MBA45001-15W/2.6 Specification: 1.Material: Heat Sink : Aluminum 6063 Clip : Plastic UL94-V0 2.Heat Sink Dimension : 44.6*44.6*14.6 mm height (with base) Base : 2.6mm, Fin height : 12mm 3.Weight: 31.2 gm
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MBA45001-15W/2
45x45
UL94-V0)
MBA45001-28W/2
plastic ul94v0
45x45 bga
45x45 mm bga
6063
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45x45 bga
Abstract: 45x45 mm bga
Text: 480 PIN PLASTIC BGA 45x45 A B B A C D Index mark J H G detail of A part C A F K L φM φP M M E C A B *1 C *2 N NOTES *1 Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of its true position (T.P.) at maximum material condition. *2 Each ball centerline is located within φ 0.10 mm (φ 0.004 inch) of
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45x45)
S480S2-K6-2
45x45 bga
45x45 mm bga
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45x45 bga
Abstract: No abstract text available
Text: 672 PIN PLASTIC BGA 45x45 A B B A C D Index mark J H G detail of A part C A K L φM φP F M M E C A B *1 C *2 N NOTES *1 Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of its true position (T.P.) at maximum material condition. *2 Each ball centerline is located within φ 0.10 mm (φ 0.004 inch) of
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45x45)
S672S2-K6-2
45x45 bga
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tray datasheet bga
Abstract: 4545
Text: TRAY CONTAINER 45.3 27.95 2 x 6 = 12 A' A 48.00 37.50 150°C MAX 135.9 80.0 BGA 45 × 45 PPE 7 HEAT PROOF Unit : mm 45.3 240.0 315.0 322.6 SECTION A – A' Applied Package 4.72 7.62 (6.35) 45.30 44.0 Quantity (pcs) BGA 45 × 45 Tray 480-pin • Plastic BGA (45×45)
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480-pin
580-pin
672-pin
756-pin
888-pin
SSD-A-H5933-3
tray datasheet bga
4545
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JEDEC tray standard
Abstract: JEDEC TRAY DIMENSIONS SSD-A-H7053-1 45374 H705 1849-pin BGA4545
Text: TRAY CONTAINER UNIT : mm HEAT PROOF 30.00 7 160°CMAX PPE 2x 6=12 45.20 75.90 BGA45 × 45× 3.74 45.20 51.00 255.0 30.00 315.0 322.6 SECTION A – A' 45.20 7.55 11.50 135.9 NEC A' A Applied Package 1849-pin Plastic BGA (45×45) (FLIP CHIP TYPE) 1752-pin Plastic BGA (45×45)
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BGA45
1849-pin
1752-pin
BGA45
SSD-A-H7053-1
JEDEC tray standard
JEDEC TRAY DIMENSIONS
SSD-A-H7053-1
45374
H705
BGA4545
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BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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BGA16A1ATTERNS
BGA676
BGA665
BGA-1156
156 QFN 12X12
LGA240
BGA-783
BGA441
BGA1024
BGA1521
7286X
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socket 1155
Abstract: 1155 socket NP352-676-103 NP352-76814 45x45 mm bga X2933 35x35 bga 45x45 bga NP352-103 ac294
Text: NP352 Series Open Top Fine Ball Grid Array (FBGA, 1.00mm Pitch) Part Number (Details) Specifications NP352 - 560 1,000MΩ min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute 100m Ω max. at 10mA/20mV max. Contact Resistance:
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NP352
10mA/20mV
NP352-1600-54-*
NP352-160018
45x45
NP352-1849-35
NP352-106426
socket 1155
1155 socket
NP352-676-103
NP352-76814
45x45 mm bga
X2933
35x35 bga
45x45 bga
NP352-103
ac294
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11 AK 30 S-2
Abstract: 45x45 mm bga
Text: 580 PIN PLASTIC BGA 45x45 A B B A 33 31 29 27 25 23 21 19 17 15 13 11 9 7 5 3 1 C D 34 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 AN AL AJ AG AE AC AA W U R N L J G E C A AP AM AK AH AF AD AB Y V T P M K H F D B Index area J H G S detail of A part A K L
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45x45)
S580S2-K6-2
11 AK 30 S-2
45x45 mm bga
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BGA 11x11 junction to board thermal resistance
Abstract: 45x45 mm bga BGA 64 PACKAGE thermal resistance qfn jc jb 45x45 bga BGA 23X23 PQFP 32X32 QFN 48 JC JB 35x35 bga QFN 20X20
Text: Thermal Management February 2004 Introduction to Thermal Management Thermal considerations are rarely an issue with low-density PLDs such as the Lattice Semiconductor GAL products, however, high-density PLDs often require consideration of thermal issues as part of any sound design methodology. To avoid reliability problems, Lattice Semiconductor specifies a maximum allowable junction temperature
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320-ball
432-ball
27x27
31x31
35x35
40x40
45x45
BGA 11x11 junction to board thermal resistance
45x45 mm bga
BGA 64 PACKAGE thermal resistance
qfn jc jb
45x45 bga
BGA 23X23
PQFP 32X32
QFN 48 JC JB
35x35 bga
QFN 20X20
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MD300-10A
Abstract: P32C-100-600A p20d100 C-PGA176-S15U-2 CDIP28 LA-0543A tray bga P-TQFP100-14X20-0 0x20010 P14DH-100-300A2-1
Text: Find tool 1. Click button in the Toolbar. 2. Search dialog box is displayed. 3. Enter a NEC code to be searched and click Find . Caution Don't use the wild card *) when entering a NEC code. Ex.) Find Find What P22C-100-300A-1 Match Whole Word Only Match Case
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P22C-100-300A-1
P8C-100-300B
P-DIP8-0300-2
MD300-2A
P8CT-100-300B2-1
MD300-1A
P8C-100-300A-1
X13769XJ2V0CD00
MD300-10A
P32C-100-600A
p20d100
C-PGA176-S15U-2
CDIP28
LA-0543A
tray bga
P-TQFP100-14X20-0
0x20010
P14DH-100-300A2-1
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21x21
Abstract: MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1
Text: 検索ツール 1. ツールバーの アイコンをクリックしてください。 2. ［検索］のダイアログ・ボックスが表示されます。 3. 検索したいパッケージのNECコードを入力して， 検索 F をクリックしてください。
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P22C100300A1
P8C-100-300B
P8CT-100-300B2-1
P8C-100-300A-1
P-DIP8-0300-2
MD300-2A
MD300-1A
MD300-09A
21x21
MM554
tray bga
45x45 bga
X13769XJ2V0CD00
CPGA132
LA010
P14DH-100-300A2-1
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LFXP2-8E
Abstract: LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132
Text: Thermal Management July 2009 Introduction Thermal management is recommended as part of any sound CPLD and FPGA design methodology. To properly assess the thermal characteristics of the system, Lattice Semiconductor specifies a maximum allowable junction temperature in all device data sheets. The system designer should always complete a thermal analysis of their specific design to ensure that the device and package does not exceed the junction temperature requirements.
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64-ball
144-ball
LFXP2-8E
LFXP2-40E
LFXP2-5E
LFXP20C
theta jc FCBGA
LFXP2-17E
LFE3-17
Theta JB
LFXP15C
LFXP2-8E 132
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HLQFP 176 Package
Abstract: FBGA Package 14x14 121 bga 10x10 BGA 27X27 pitch 23X23 lfbga 12X12 1.0/Daewon BGA 7x7 hssop TQFP 14X20 TSOP 14X20
Text: IC Package Line-up As of July, 2009 ● : In mass production ○ : Under development Package name DIP SDIP Package dimensions mm mil 6.3x8.84 (300) 6.3x9.6 (300) 6.3x19 (300) 6.3x19.2 (300) 6.3x24.5 (300) 13.4x35.6 (600) 6.3x19 (300) 8.9x28 (400) 13x36.72 (600)
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13x36
13x45
14x37
17x56
17x57
O-92L
OT-25
10x10
15x15
HLQFP 176 Package
FBGA Package 14x14
121 bga 10x10
BGA 27X27 pitch
23X23
lfbga 12X12
1.0/Daewon BGA 7x7
hssop
TQFP 14X20
TSOP 14X20
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EA-190-H125-T710
Abstract: EA-425-H125-T710 EA-190-H095-T710 EA-190-H195-T710 EA-190-H145-T710 EA-190-H175-T710 EA-400-H245-T710 EA-400-H145-T710 EA-400-H175-T710 EA-400-H095-T710
Text: Aavid Clip Attach E for Series Aavid Clip Attach E-Series BGAs AAVID CLIP ATTACH E-SERIES Introducing Aavid’s line of clip attach heat sinks for BGA applications. The series utilizes an easy to mount plastic frame along with flexible wire springs. The wire springs are resistant to breakage and allow
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UL94V-0
EA-190-H125-T710
EA-425-H125-T710
EA-190-H095-T710
EA-190-H195-T710
EA-190-H145-T710
EA-190-H175-T710
EA-400-H245-T710
EA-400-H145-T710
EA-400-H175-T710
EA-400-H095-T710
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456-BGA
Abstract: 45x45 bga 8kx1 RAM LB 156 15G04K100 15G04K200 25G01K100 25G02K100
Text: Programmable Serial Interface High Speed Devices PRELIMINARY Programmable Bandwidth Features • • • • • • • • • • • • • • • • 200 Mbps–1.5 Gbps, 2.5 Gbps serial signaling rate Flexible parallel-to-serial conversion in transmit path
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45x45 bga
Abstract: 15G04K100 15G04K200 25G01K100 25G02K100
Text: Programmable Serial Interface PRELIMINARY High Speed Devices Programmable Bandwidth Features • • • • • • • • • • • • • • • • 200 Mbps – 1.5 Gbps, 2.5 Gbps serial signaling rate Flexible parallel-to-serial conversion in transmit path
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384Kb
45x45 bga
15G04K100
15G04K200
25G01K100
25G02K100
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Untitled
Abstract: No abstract text available
Text: THERMAL MANAGEMENT PRODUCTS CATALOG CTS ELECTRONIC COMPONENTS www.ctscorp.com CTS ® TABLE OF CONTENTS PAGE FAN HEAT SINKS 3 ADHESIVE PEEL AND STICK HEAT SINKS 6 FORGED HEAT SINKS WITH PLATE FINS 7 FORGED HEAT SINKS WITH PIN FINS 9 CLIP AND TAPE STYLES
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O-126,
O-202,
O-218
O-220
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zif rod
Abstract: No abstract text available
Text: – THERMAL MANAGEMENT PRODUCTS CATALOG www.ctscorp.com CTS TABLE OF CONTENTS PAGE HI-TEMP FAN HEAT SINKS 3 ADHESIVE PEEL AND STICK HEAT SINKS 6 FORGED HEAT SINKS WITH PLATE FINS 7 FORGED HEAT SINKS WITH PIN FINS 9 CLIP AND TAPE STYLES 10 ZIF STANDARD CIRCUIT BOARD RETAINERS
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O-126,
O-202,
O-218
O-220
zif rod
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HTD12
Abstract: 45x45 bga CBD62 cba8 373 ic HTD24 application of microprocessor in aircrafts 6-pin plastic A6 tray 45x45 CBD43
Text: DATA SHEET MOS INTEGRATED CIRCUIT PD98410 1.2G ATM SWITCH LSI DESCRIPTION The PD98410 NEASCOT-X10TM is an LSI integrating ATM switch functions on a single chip. It has four UTOPIA level2 interfaces and can switch 24 24 circuits by using a multi-PHY connection. This LSI also realizes a switching
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PD98410
NEASCOT-X10TM)
bits/40
16Kial:
HTD12
45x45 bga
CBD62
cba8
373 ic
HTD24
application of microprocessor in aircrafts
6-pin plastic A6
tray 45x45
CBD43
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micro sd verilog MODEL
Abstract: "Single-Port RAM"
Text: Programmable Serial Interface Frequency Agile Devices PRELIMINARY Programmable Bandwidth Features • • • • • • • • • • • • • • • • • High-Speed (HS) or Frequency Agile (FA) Programmable Serial Interface (PSI) versions available
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Untitled
Abstract: No abstract text available
Text: MATRIX BGA SOCKET TYPE 1 1 MM NO. OF CONTACTS GRID DIM 16 4 0 2 4 0 - 1 256 16X16 23.50 [ . 9251 17,50 [.689] 15 , 00 [ .591] 38, 10 [ 1. 500] 20,90 [.823] 14 , 5 0 [ . 5 7 1] 2 5 ± 6 LBS 16 4 0 2 4 0 - 2 289 17X17 24.50 [ .964] 18 , 50 [.728] 16 , 00 [.630]
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16X16
17X17
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16X16
Abstract: bga 576 socket bga 24x24 576
Text: MATRIX BGA SOCKET TYPE 1 1 MM NO. OF CONTACTS G R ID 16 4 0 2 4 0 - 1 256 16X16 16 4 0 2 4 0 - 2 289 17X17 16 4 0 2 4 0 - 3 324 18X18 1640240-4 36 1 16 4 0 2 4 0 - 5 PART NO . D IM A D IM B D IM C 23.50 [.925] 24.50 C. 964] [. 6 8 9 ] 1 7,50 [.591 ] 1 5,00
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16X16
C-1640240
bga 576 socket
bga 24x24 576
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SOP48
Abstract: CF RM sot89 SOP38 14X14X2 epson QFP 216 14X14X1 45x45 mm bga 14X20X2 14x14x2.7 QFP13
Text: Plastic QFP Pin Count 44 46 48 52 60 64 80 100 120 128 144 160 176 184 208 216 232 240 256 304 Package code QFP 13 QFP4 QFP2 QFP6 QFP5 QFP12 QFP5 QFP6 QFP2 QFP6 QFP5 QFP13 QFP15 QFP6 QFP5 Plastic TQFP Body size mm 10X10X1.4 10X10X1.45 14X14X2 14X14X2.7 14X20X2.7
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QFP12
QFP13
QFP15
QFP14
12X12X1
14X20X2
14X14X1
SOP48
CF RM sot89
SOP38
14X14X2
epson QFP 216
45x45 mm bga
14x14x2.7
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EPF20K
Abstract: ep20k200 PINOUT ep20k apex board EPF20K100
Text: APEX 20K Programmable Logic Device Family February 1999. ver. 1 Features. Data Sheet Industry's first programmable logic device PLD incorporating System-on-a-Programmable-Chip (SOPC) integration MultiCore™ architecture integrating look-up table (LUT) logic,
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