Untitled
Abstract: No abstract text available
Text: SMALL OUTLINE L-LEADED PACKAGE 32 PIN PLASTIC FPT-32P-M02 EIAJ code : ∗SOP032-P-0450-1 32-pin plastic SOP Lead pitch 50mil Nominal dimensions 450mil Standard Conforms with EIAJ:TYPE IV Lead shape Gullwing Sealing method Plastic mold FPT-32P-M02 32-pin plastic SOP
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FPT-32P-M02
OP032-P-0450-1
50mil
450mil
32-pin
FPT-32P-M02)
1994IAJ
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LY621024
Abstract: LY621024SL LY621024LL 128K X 8 BIT LOW POWER CMOS SRAM
Text: LY621024 128K X 8 BIT LOW POWER CMOS SRAM Rev. 1.6 REVISION HISTORY Revision Rev. 1.0 Rev. 1.1 Rev. 1.2 Rev. 1.3 Rev. 1.4 Rev. 1.5 Rev. 1.6 Description Initial Issue Revised sym. b of 32 pin 450mil SOP package outline dimension in page 8 Added SL C-grade Spec.
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LY621024
450mil
32-pin
36-ball
LY621024
LY621024SL
LY621024LL
128K X 8 BIT LOW POWER CMOS SRAM
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LY621024PL-70LL
Abstract: LY621024PL
Text: LY621024 128K X 8 BIT LOW POWER CMOS SRAM Rev. 1.8 REVISION HISTORY Revision Rev. 1.0 Rev. 1.1 Rev. 1.2 Rev. 1.3 Rev. 1.4 Rev. 1.5 Rev. 1.6 Rev. 1.7 Rev. 1.8 Description Issue Date Initial Issue Jul.25.2004 Revised sym. b of 32 pin 450mil SOP package outline dimension Jan.17.2007
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LY621024
450mil
LY621024GL-70LLE
LY621024GL-70LLET
LY621024GL-70LLI
LY621024GL-70LLIT
LY621024PL-70LL
LY621024PL
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SSOP42-P-450-0
Abstract: No abstract text available
Text: APPENDIX 3.9 Package outline 3.9 Package outline 42P2R-A Plastic 42pin 450mil SSOP EIAJ Package Code SSOP42-P-450-0.80 Weight g 0.63 JEDEC Code – Lead Material Alloy 42/Cu Alloy e b2 22 Caution ! E HE e1 I2 42 F Symbol TBD 21 1 A D Recommended Mount Pad
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42P2R-A
42pin
450mil
SSOP42-P-450-0
42/Cu
42P2R-A
42P4in
42S1B-A
600mil
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Untitled
Abstract: No abstract text available
Text: LY621024 128K X 8 BIT LOW POWER CMOS SRAM Rev. 1.3 REVISION HISTORY Revision Rev. 1.0 Rev. 1.1 Rev. 1.2 Rev. 1.3 Description Issue Date Initial Issue Jul.25.2004 Revised sym. b of 32 pin 450mil SOP package outline dimension Jan.17.2007 in page 8 Added SL C-grade Spec.
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LY621024
450mil
LY621024
576-bit
32-pin
36-ball
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SOP28 package
Abstract: SOP28
Text: SANYO Semiconductor Small Outline Package 28Pin Plastic SOP28 450mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。
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28Pin
450mil)
ED-7303A
85max
SOP28 package
SOP28
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H 9311
Abstract: SSOP42-P-450-0
Text: Recommended 42P2R-A EIAJ Package Code SSOP42-P-450-0.80 JEDEC Code – Plastic 42pin 450mil SSOP Weight g 0.63 e b2 22 E Recommended Mount Pad F Symbol 1 21 A D G A2 e y A1 b L L1 HE e1 I2 42 Lead Material Alloy 42/Cu Alloy A A1 A2 b c D E e HE L L1 z Z1
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42P2R-A
SSOP42-P-450-0
42pin
450mil
42/Cu
H 9311
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SOP28D
Abstract: 450mil
Text: SANYO Semiconductor Small Outline Package 28Pin Plastic SOP28D 450mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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28Pin
OP28D
450mil)
ED-7303A)
OP28D
SOP28D
450mil
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SOP36
Abstract: SOP36-P-450-1 18AF
Text: 36P2W-A EIAJ Package Code SOP36-P-450-1.27 Plastic 36pin 450mil SOP Weight g 0.76 JEDEC Code – Lead Material Alloy 42 b2 I2 e Recommended Mount Pad E Symbol 1 18 A F D A2 e b A1 L1 y L HE e1 19 36 A A1 A2 b c D E e HE L L1 y c Detail F b2 e1 I2 Dimension in Millimeters
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36P2W-A
OP36-P-450-1
36pin
450mil
SOP36
SOP36-P-450-1
18AF
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Untitled
Abstract: No abstract text available
Text: Package Information SOP Outline Dimensions 32-pin SOP 450mil Outline Dimensions 3 2 1 7 A B 1 1 6 C C ' G H D E = F • MS-099 Symbol Dimensions in mil Min. Nom. Max. A 530 ¾ 580 B 437 ¾ 445 C 14 ¾ 20 C¢ 799 ¾ 815 D 100 ¾ 120 E ¾ 50 ¾ F 4 ¾ 14 G
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32-pin
450mil)
MS-099
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sop28
Abstract: SOP28 package
Text: 28P2W-A Plastic 28pin 450mil SOP EIAJ Package Code SOP28-P-450-1.27 JEDEC Code – Weight g 0.58 Lead Material Alloy 42 e E Recommended Mount Pad Symbol 1 14 F A A2 A1 D e L L1 HE e1 I2 15 28 b2 b c y Detail F A A1 A2 b c D E e HE L L1 y b2 e1 I2 Dimension in Millimeters
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28P2W-A
28pin
450mil
OP28-P-450-1
sop28
SOP28 package
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LY621024
Abstract: No abstract text available
Text: LY621024 128K X 8 BIT LOW POWER CMOS SRAM Rev. 1.2 REVISION HISTORY Revision Rev. 1.0 Rev. 1.1 Rev. 1.2 Description Issue Date Initial Issue Jul.25.2004 Revised sym. b of 32 pin 450mil SOP package outline dimension Jan.17.2007 in page 8 Added SL C-grade Spec.
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LY621024
450mil
LY621024
576-bit
32-pin
36-ball
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SOP28
Abstract: SOP28 package 450mil
Text: SANYO Semiconductor Small Outline Package 28Pin Plastic SOP28 450mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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28Pin
450mil)
ED-7303A)
85max
SOP28
SOP28 package
450mil
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SSOP42-P-450-0
Abstract: 42p2r-a
Text: 42P2R-A Plastic 42pin 450mil SSOP EIAJ Package Code SSOP42-P-450-0.80 JEDEC Code – Weight g 0.63 Lead Material Alloy 42/Cu Alloy e 22 E F Recommended Mount Pad Symbol 1 21 A D y b A1 L e A2 L1 HE e1 I2 42 b2 c Detail F A A1 A2 b c D E e HE L L1 y b2 e1
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42P2R-A
42pin
450mil
SSOP42-P-450-0
42/Cu
42p2r-a
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SSOP44
Abstract: No abstract text available
Text: SANYO Semiconductor Shrink Small Outline Package 44Pin Plastic SSOP44 450mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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44Pin
SSOP44
450mil)
ED-7303A)
SSOP44
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SOP24
Abstract: 24P2W
Text: 24P2W-D Plastic 24pin 450mil SOP EIAJ Package Code SOP24-P-450-1.27 Weight g 0.5 JEDEC Code – Lead Material Cu Alloy 13 E Recommended Mount Pad Symbol 1 12 F A A2 A1 D L L1 HE e1 24 b2 I2 e e b y c Detail F A A1 A2 b c D E e HE L L1 y b2 e1 I2 Dimension in Millimeters
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24P2W-D
24pin
450mil
OP24-P-450-1
SOP24
24P2W
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SSOP40-P-450-0
Abstract: SSOP40 DSA00373 40P2R-A 40p2r
Text: 40P2R-A Plastic 40pin 450mil SSOP EIAJ Package Code SSOP40-P-450-0.80 JEDEC Code – Weight g 0.62 Lead Material Alloy 42 e 21 E F Recommended Mount Pad Symbol 1 20 A A2 D y b L e A1 L1 HE e1 I2 40 b2 A A1 A2 b c D E e HE L L1 y c Detail F b2 e1 I2 Dimension in Millimeters
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40P2R-A
40pin
450mil
SSOP40-P-450-0
SSOP40
DSA00373
40P2R-A
40p2r
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SOP32
Abstract: 32P2W-A 32P2W
Text: 32P2W-A Plastic 32pin 450mil SOP EIAJ Package Code SOP32-P-450-1.27 Weight g 0.67 JEDEC Code – Lead Material Alloy 42 e1 17 E Recommended Mount Pad Symbol 1 16 A F D A2 b L e A1 L1 HE 32 b2 I2 e y c Detail F A A1 A2 b c D E e HE L L1 y b2 e1 I2 Dimension in Millimeters
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32P2W-A
32pin
450mil
OP32-P-450-1
SOP32
32P2W-A
32P2W
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Untitled
Abstract: No abstract text available
Text: 6.8 UNIT : mm 14.9 MP450-01A, LB-024 Iength : 515±2.0 thickness : 0.7 +0.3 −0.2 tolerance : ±0.4 material : plastic with antistatic finish Applied Package 28-pin QFJ (PLCC) ( 450mil) Quantity (pcs) MAX. 40
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MP450-01A,
LB-024
28-pin
450mil)
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28P2W-C
Abstract: sop28 SOP28 package
Text: 28P2W-C Plastic 28pin 450mil SOP EIAJ Package Code SOP28-P-450-1.27 JEDEC Code – Weight g 0.58 Lead Material Alloy 42 e 15 E Recommended Mount Pad 1 14 Symbol F A A1 A2 D b e L L1 HE e1 I2 28 b2 y c Detail F A A1 A2 b c D E e HE L L1 y b2 e1 I2 Dimension in Millimeters
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28P2W-C
28pin
450mil
OP28-P-450-1
28P2W-C
sop28
SOP28 package
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24P2W-A
Abstract: SOP24 24P2W
Text: 24P2W-A Plastic 24pin 450mil SOP EIAJ Package Code SOP24-P-450-1.27 JEDEC Code – Weight g 0.5 Lead Material Alloy 42 b2 I2 e Recommended Mount Pad E Symbol 1 12 F A A2 A1 D L L1 HE e1 13 24 e b y c Detail F A A1 A2 b c D E e HE L L1 y b2 e1 I2 Dimension in Millimeters
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24P2W-A
24pin
450mil
OP24-P-450-1
24P2W-A
SOP24
24P2W
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Untitled
Abstract: No abstract text available
Text: A S p AUSTIN SEMICONDUCTOR, INC. ^ m e g H s DRAM PRELIMINARY 1 D R A M M E G x 1 6 D R A M 3.3V, EDO PAGE MODE, OPTIONAL EXTENDED REFRESH AVAILABLE AS MILITARY SPECIFICATIONS PIN ASSIGNMENT Top View • M IL-STD 883 44/50-Pin SOJ/LCC/Gull Wing 450mil • SM D Planned
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44/50-Pin
450mil
024-cycle
180mW
CASTELLAT10NS
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Untitled
Abstract: No abstract text available
Text: MX23L8000 8M -BIT M ASK ROM 8 BIT OUTPUT FEATURES ORDER INFORMATION • Bit organization - 1 M x 8 (byte mode) • Fast access time - Random access: 150ns (max.) • Current - Operating: 20mA - Standby: 5uA • Supply voltage -2.7V~3.6V • Package - 32 pin SOP (450mil)
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MX23L8000
150ns
450mil)
MX23L8000MC-15
MX23L8000MC-20
200ns
MX23L8000MI-15
MX23L8000MI-20
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Untitled
Abstract: No abstract text available
Text: MX23L8000 8M -BIT M ASK ROM 8 BIT OUTPUT FEATURES ORDER INFORMATION • Bit organization - 1 M x 8 (byte mode) • Fast access time - Random access: 150ns (max.) • Current - Operating: 20mA - Standby: 5uA • Supply voltage -2.7V~3.6V • Package - 32 pin SOP (450mil)
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MX23L8000
150ns
450mil)
MX23L8000MC-15
MX23L8000MC-20
200ns
MX23L8000MI-15
MX23L8000MI-20
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