Untitled
Abstract: No abstract text available
Text: Product Number: 587-10-225-07-006437 Description: BGA Header .050 Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 225-07-006 15 X 15 # Of Pins Mill-Max Part Number 225 587-10-225-07-006437 RoHS Compliant LOOSE PIN: Loose Pin Used: 8737
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C36000)
C/885
2002/95Annex
64-56A
64-22A/31A
65-17A
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Untitled
Abstract: No abstract text available
Text: Preliminary GS816218/36/72B-225/200/180/166/150/133 1M x 18, 512K x 36, 256K x 72 16Mb S/DCD Sync Burst SRAMs 119- and 209-Pin BGA Commercial Temp Industrial Temp 225 MHz–133MHz 2.5 V VDD 2.5 V or 3.3 V I/O Features Flow Through/Pipeline Reads • FT pin for user-configurable flow through or pipeline operation
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GS816218/36/72B-225/200/180/166/150/133
209-Pin
x18/x36
GS18/362
2/2000E;
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CY7C1354BV25-200BZI
Abstract: CY7C1354BV25 CY7C1354BV25-166 CY7C1354BV25-200 CY7C1354BV25-225 CY7C1356BV25 CY7C1356BV25-200 CY7C1356BV25-225
Text: CY7C1354BV25 CY7C1356BV25 256K x 36/512K x 18 Pipelined SRAM with NoBL Architecture Features Functional Description • Pin-compatible and functionally equivalent to ZBT™ • Supports 225-MHz bus operations with zero wait states — Available speed grades are 225, 200 and 166 MHz
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CY7C1354BV25
CY7C1356BV25
36/512K
225-MHz
CY7C1354BV25
CY7C1356BV25
165-ball
CY7C1356BV25.
CY7C1354BV25-200BZI
CY7C1354BV25-166
CY7C1354BV25-200
CY7C1354BV25-225
CY7C1356BV25-200
CY7C1356BV25-225
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Untitled
Abstract: No abstract text available
Text: CY7C1354B CY7C1356B 256K x 36/512K x 18 Pipelined SRAM with NoBL Architecture Features Functional Description • Pin-compatible and functionally equivalent to ZBT™ • Supports 225-MHz bus operations with zero wait states — Available speed grades are 225, 200 and 166 MHz
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CY7C1354B
CY7C1356B
36/512K
225-MHz
200-MHz
166-MHz
CY7C1354B/CY7C1356B
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Untitled
Abstract: No abstract text available
Text: CY7C1354BV25 CY7C1356BV25 256K x 36/512K x 18 Pipelined SRAM with NoBL Architecture Features Functional Description • Pin compatible and functionally equivalent to ZBT • Supports 225-MHz bus operations with zero wait states — Available speed grades are 225, 200 and 166 MHz
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CY7C1354BV25
CY7C1356BV25
36/512K
225-MHz
200-MHz
166-MHz
CY7C1356BV25/CY7C1354BV25
250-MHz
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CY7C1354B
Abstract: CY7C1356B
Text: CY7C1354B CY7C1356B 9-Mb 256K x 36/512K x 18 Pipelined SRAM with NoBL Architecture Features Functional Description • Pin-compatible and functionally equivalent to ZBT • Supports 225-MHz bus operations with zero wait states — Available speed grades are 225, 200, and 166 MHz
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CY7C1354B
CY7C1356B
36/512K
225-MHz
CY7C1354B
CY7C1356B
165-ball
CY7C1356B.
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CY7C1354BV25
Abstract: CY7C1354BV25-166 CY7C1354BV25-200 CY7C1354BV25-225 CY7C1356BV25 CY7C1356BV25-200 CY7C1356BV25-225
Text: CY7C1354BV25 CY7C1356BV25 256K x 36/512K x 18 Pipelined SRAM with NoBL Architecture Features Functional Description • Pin-compatible and functionally equivalent to ZBT™ • Supports 225-MHz bus operations with zero wait states — Available speed grades are 225, 200 and 166 MHz
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CY7C1354BV25
CY7C1356BV25
36/512K
225-MHz
CY7C1354BV25
CY7C1356BV25
165-ball
CY7C1356BV25.
CY7C1354BV25-166
CY7C1354BV25-200
CY7C1354BV25-225
CY7C1356BV25-200
CY7C1356BV25-225
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CY7C1354B
Abstract: CY7C1356B 38T5 c12761
Text: CY7C1354B CY7C1356B 9-Mb 256K x 36/512K x 18 Pipelined SRAM with NoBL Architecture Features Functional Description • Pin-compatible and functionally equivalent to ZBT • Supports 225-MHz bus operations with zero wait states — Available speed grades are 225, 200, and 166 MHz
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CY7C1354B
CY7C1356B
36/512K
225-MHz
CY7C1354B
CY7C1356B
200ms.
38T5
c12761
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Untitled
Abstract: No abstract text available
Text: CY7C1354BV25 CY7C1356BV25 256K x 36/512K x 18 Pipelined SRAM with NoBL Architecture Features Functional Description • Pin-compatible and functionally equivalent to ZBT™ • Supports 225-MHz bus operations with zero wait states — Available speed grades are 225, 200 and 166 MHz
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CY7C1354BV25
CY7C1356BV25
36/512K
225-MHz
200-MHz
166-MHz
200ms.
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CY7C1354B
Abstract: CY7C1356B
Text: CY7C1354B CY7C1356B 9-Mb 256K x 36/512K x 18 Pipelined SRAM with NoBL Architecture Features Functional Description • Pin-compatible and functionally equivalent to ZBT • Supports 225-MHz bus operations with zero wait states — Available speed grades are 225, 200, and 166 MHz
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CY7C1354B
CY7C1356B
36/512K
225-MHz
CY7C1354B
CY7C1356B
165-ball
CY7C1356B.
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Untitled
Abstract: No abstract text available
Text: BGA IC264 Series IC264-22501-1- *-* Socket Series Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: No. of Leads No Mark: Both Pins 1 & 2 PN: Only Pin 1 NP: Only Pin 2 NN: No Pins Pin Count 225 Material PEI Glass Filled UL94V-0
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IC264
IC264-22501-1-
1000M
10mA/20mV
UL94V-0
IC264-22501-1
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CY7C1354C-200BGXC
Abstract: CY7C1354C CY7C1356C CY7C1356C-200AXC B8265
Text: CY7C1354C CY7C1356C PRELIMINARY 9-Mbit 256K x 36/512K x 18 Pipelined SRAM with NoBL Architecture Features Functional Description • Pin-compatible and functionally equivalent to ZBT™ • Supports 225-MHz bus operations with zero wait states — Available speed grades are 225, 200, and 166 MHz
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CY7C1354C
CY7C1356C
36/512K
225-MHz
CY7C1354C
CY7C1356C
CY7C1354C-200BGXC
CY7C1356C-200AXC
B8265
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f6 diode
Abstract: P352 transistor 6c transistor h9 BGA 176 ball package 256-pin BGA BGA 176 ball package datasheet bga 208 PACKAGE
Text: : Available, : Under development Ceramic PGA I-Lead Type Classification Lead Pitch (mm) Pin Counts 288 528 Cavity Up 1.27 Cavity Down Plastic BGA Classification Ball Pitch (mm) Pin Counts 119 153 225 256 272 313 352 420 1.27 Cavity Up 1.5 Cavity Down 1.27
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X288R-50A-1
S64F1-CA1
S108S1-YHC
P116S1-YJC
S144S1-YKC
S176S1-2C
S224S1-3C-1
S304S1-6C
S256N7-B6
S352N7-F6-1
f6 diode
P352
transistor 6c
transistor h9
BGA 176 ball package
256-pin BGA
BGA 176 ball package datasheet
bga 208 PACKAGE
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Untitled
Abstract: No abstract text available
Text: Preliminary GS816273C-250/225/200/166/150/133 256K x 72 18Mb S/DCD Sync Burst SRAMs 209-Pin BGA Commercial Temp Industrial Temp Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive
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GS816273C-250/225/200/166/150/133
209-Pin
209-bump
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676 BGA package tray
Abstract: tray bga BGA package tray jedec bga tray NEC 2415 tray bga 27
Text: TRAY CONTAINER UNIT : mm 4x10=40 NEC 27.50 7 135°C MAX. 29.20 87.6 BGA27×27ESP A' 24.15 27.50 29.20 262.8 26.10 315.0 322.6 SECTION A – A' 27.50 (5.95) (6.35) 27.00 7.62 135.9 PPE A Applied Package 225-pin Plastic BGA (27×27) 256-pin Plastic BGA (27×27)
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BGA27
27ESP
225-pin
256-pin
272-pin
316-pin
320-pin
352-pin
385-pin
400-pin
676 BGA package tray
tray bga
BGA package tray
jedec bga tray
NEC 2415
tray bga 27
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Untitled
Abstract: No abstract text available
Text: Preliminary GS815218/36/72B-225/200/180/166/150/133 1M x 18, 512K x 36, 256K x 72 16Mb S/DCD Sync Burst SRAMs 119- and 209-Pin BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable
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GS815218/36/72B-225/200/180/166/150/133
209-Pin
x18/x36
an7/38
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Untitled
Abstract: No abstract text available
Text: Preliminary GS816218/36/72B-250/225/200/166/150/133 1M x 18, 512K x 36, 256K x 72 16Mb S/DCD Sync Burst SRAMs 119- and 209-Pin BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable
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GS816218/36/72B-250/225/200/166/150/133
209-Pin
x18/x36
119-Bump
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GS816273
Abstract: GS816273C GS816273C-225 GS816273C-225I GS816273C-250 GS816273C-250I
Text: GS816273C-250/225 209-Pin BGA Commercial Temp Industrial Temp 256K x 72 18Mb S/DCD Sync Burst SRAMs Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive • 2.5 or 3.3 V +10%/–10% core power supply
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GS816273C-250/225
209-Pin
209-bump
GS816273C
368-bit
GS816273
GS816273C-225
GS816273C-225I
GS816273C-250
GS816273C-250I
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Untitled
Abstract: No abstract text available
Text: Preliminary GS8162Z18/36/72B-250/225/200/166/150/133 18Mb Pipelined and Flow Through Synchronous NBT SRAM 119 and 209 BGA Commercial Temp Industrial Temp Features • NBT No Bus Turn Around functionality allows zero wait Read-Write-Read bus utilization; fully pin-compatible with
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GS8162Z18/36/72B-250/225/200/166/150/133
8162Z18
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Untitled
Abstract: No abstract text available
Text: Preliminary GS88218/36AB-250/225/200/166/150/133 119-Bump BGA Commercial Temp Industrial Temp 512K x 18, 256K x 36 8Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable
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GS88218/36AB-250/225/200/166/150/133
119-Bump
x18/x36
88218A
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Untitled
Abstract: No abstract text available
Text: Preliminary GS8162Z18/36/72B-250/225/200/166/150/133 16Mb Pipelined and Flow Through Synchronous NBT SRAM 119 and 209 BGA Commercial Temp Industrial Temp Features • NBT No Bus Turn Around functionality allows zero wait Read-Write-Read bus utilization; fully pin-compatible with
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GS8162Z18/36/72B-250/225/200/166/150/133
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13007B
Abstract: GS882V37A GS882V37AB-200 GS882V37AB-225 GS882V37AB-250
Text: GS882V37AB/D-250/225/200 119- and 165-Bump BGA Commercial Temp Industrial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive
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GS882V37AB/D-250/225/200
165-Bump
119-bump
GS882V37AB/Dions
882V37A
13007B
GS882V37A
GS882V37AB-200
GS882V37AB-225
GS882V37AB-250
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GS88237BB-200
Abstract: GS88237B GS88237BB GS88237BB-166 GS88237BB-225 GS88237BB-250 GS88237BB-250I
Text: Preliminary GS88237BB-333/300/275/250/225/200 119-Bump BGA Commercial Temp Industrial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive
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GS88237BB-333/300/275/250/225/200
119-Bump
x18/x36
GS88237BB-200
GS88237B
GS88237BB
GS88237BB-166
GS88237BB-225
GS88237BB-250
GS88237BB-250I
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Untitled
Abstract: No abstract text available
Text: Preliminary GS88218/36AB/D-250/225/200/166/150/133 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs 119- and 165-Bump BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable
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GS88218/36AB/D-250/225/200/166/150/133
165-Bump
133MHz
x18/x36
modB/D-250/225/200/166/150/133
88218A
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