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    1466H Search Results

    1466H Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    68021-466HLF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 66 Positions, 2.54 mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    87901-466HLF Amphenol Communications Solutions BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 66 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail. Visit Amphenol Communications Solutions
    68481-466HLF Amphenol Communications Solutions BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 66 Positions, 2.54mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    79821-466HLF Amphenol Communications Solutions BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 66 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail. Visit Amphenol Communications Solutions
    68491-466HLF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 66 Positions, 2.54 mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    SF Impression Pixel

    1466H Price and Stock

    Pentair Equipment Protection - Hoffman PF1466HF

    EMI/RFI FRAME 1400X600X600MM
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey PF1466HF Bulk 1
    • 1 $2182.46
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    Pentair Equipment Protection - Hoffman P2K1466HF

    PKG 1400X600X600 1DR EMC
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    DigiKey P2K1466HF Bulk 1
    • 1 $3784.34
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    Pentair Equipment Protection - Hoffman P2F1466HF

    FRAME 1400X600X600 HF
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    DigiKey P2F1466HF Bulk 1
    • 1 $2314.33
    • 10 $2314.33
    • 100 $2314.33
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    Amphenol Communications Solutions 68481-466HLF

    BERGSTIK II .100CC DR ST RAIGHT
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    DigiKey 68481-466HLF Bag
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    Amphenol Communications Solutions 68691-466HLF

    CONN HEADER VERT 66POS 2.54MM
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    Find more 1466H price and stock on Findchips.com

    1466H Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    NEC asu

    Abstract: 13E3h 1442H
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


    Original     		PDF R8C/22 R8C/23 REJ09B0251-0200 NEC asu 13E3h 1442H

    09-D2

    Abstract: RGB565 to rgb888 epson 16F8H T-1228 S2D13719 T-1227 Casio 1026 casio tft T14-22 T1205A
    Text: S2D13719 Mobile Graphics Engine Hardware Functional Specification Document Number: X59A-A-002-01 Status: Revision 1.2 Issue Date: 2008/10/27 SEIKO EPSON CORPORATION 2008. All Rights Reserved. Information in this document is subject to change without notice. You may download and use this document, but only for your own use in


    Original     		PDF S2D13719 X59A-A-002-01 PQFP22-208 X59A-A-002-00 S2D13719 S1D13719 S1D13719 09-D2 RGB565 to rgb888 epson 16F8H T-1228 T-1227 Casio 1026 casio tft T14-22 T1205A

    13CD

    Abstract: MA 1360H 13BFh 1344H R5F21226JFP R5F21226KFP R5F21227JFP R5F21227KFP 1421H 1447H
    Text: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/22, R8C/23 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0097-0020 Rev.0.20 Sep 29, 2005 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is


    Original     		PDF R8C/22, R8C/23 16-BIT REJ03B0097-0020 48-pin 13CD MA 1360H 13BFh 1344H R5F21226JFP R5F21226KFP R5F21227JFP R5F21227KFP 1421H 1447H

    1N44H

    Abstract: 1a5ah 1178H 1N60H 1171H 1A86H 0m02 1b7ah 19C1H 1N14H
    Text: SONET/SDH Payload Extractor/Aligner SPECTRA-4x155 Production PM5316 SPECTRA 4x155 SONET/SDH Payload Extractor/Aligner 4 x 155 Mbit/s Datasheet Proprietary and Confidential Production Issue 4: March 2001 Proprietary and Confidential to PMC-Sierra, Inc. and for its customers’ internal use


    Original     		PDF SPECTRA-4x155) PM5316 4x155 PMC-1990822, 1n31h PMC-1990822 1N44H 1a5ah 1178H 1N60H 1171H 1A86H 0m02 1b7ah 19C1H 1N14H

    s1d13715

    Abstract: 1066H LCD sharp 320X320 T-1228 T-1227 phone 14 pin vga camera pinout T1128 T1429 1520H RGB565 to rgb888 epson
    Text: S1D13715 Mobile Graphics Engine with Megapixel Support Hardware Functional Specification Document Number: X52A-A-001-07 SEIKO EPSON CORPORATION 2002-2008. All Rights Reserved. Information in this document is subject to change without notice. You may download and use this document, but only for your own use in


    Original     		PDF S1D13715 X52A-A-001-07 X52A-A-001-02 0128h] 012Ah] X52A-A-001-01 1066H LCD sharp 320X320 T-1228 T-1227 phone 14 pin vga camera pinout T1128 T1429 1520H RGB565 to rgb888 epson

    1312H

    Abstract: 144BH 1458h 1351h 13D0H 1444H
    Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0100 Rev.1.00 Oct 27, 2006 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level


    Original     		PDF R8C/22 R8C/23 REJ03B0097-0100 48-pin 1312H 144BH 1458h 1351h 13D0H 1444H

    R5F2123

    Abstract: R5F2123CKFP 131Bh R5F2122CJFP R5F21226DFP R5F21226JFP R5F21227DFP R5F21227JFP 1428H R5F21228JFP
    Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0110 Rev.1.10 Mar 16, 2007 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level


    Original     		PDF R8C/22 R8C/23 REJ03B0097-0110 48-pin R5F2123 R5F2123CKFP 131Bh R5F2122CJFP R5F21226DFP R5F21226JFP R5F21227DFP R5F21227JFP 1428H R5F21228JFP

    1C65H

    Abstract: 1a5ah
    Text: :5 6: 55 AM SPECTRA 4x155 ASSP Telecom Standard Product Data Sheet Released m be r, 20 05 12 PM5316 es da y, 13 De ce SPECTRA 4x155 Data Sheet Released Issue No. 6: November 2005 Do wn lo ad ed by Co nt e nt Te a m of P ar tm in er In co n Tu SONET/SDH Payload Extractor/Aligner


    Original     		PDF 4x155 PM5316 4x155 PMC-1990822, 1C65H 1a5ah

    r5f2122ckfp

    Abstract: r5f21237jfp R5F21238KFP REJ09B0251-0200 R5F21236JFP R5F2123CKFP 1342H
    Text: REJ09B0251-0200 16 R8C/22 Group, R8C/23 Group Hardware Manual RENESAS MCU R8C FAMILY / R8C/2x SERIES All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by


    Original     		PDF REJ09B0251-0200 R8C/22 R8C/23 r5f2122ckfp r5f21237jfp R5F21238KFP REJ09B0251-0200 R5F21236JFP R5F2123CKFP 1342H

    NEC 1378h

    Abstract: R5F2123CKFP 1347h 13F9H R5F21226DFP R5F21226JFP R5F2123 R5F21227JFP R5F21228DFP R5F21228JFP
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


    Original     		PDF

    145AH

    Abstract: MA 1360H 1320H 1378H ic r5f2122ckfp R5F2123CKFP 13C4H R5F2122AJFP R5F21226DFP R5F21227DFP
    Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0200 Rev.2.00 Aug 20, 2008 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of


    Original     		PDF R8C/22 R8C/23 REJ03B0097-0200 48-pin 145AH MA 1360H 1320H 1378H ic r5f2122ckfp R5F2123CKFP 13C4H R5F2122AJFP R5F21226DFP R5F21227DFP

    13D2H

    Abstract: 1429H 1332H R5F2123 1466H 1439H 1423H 1342H 13F9H 1436H
    Text: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/22, R8C/23 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0097-0010 Rev.0.10 Mar 08, 2005 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU


    Original     		PDF R8C/22, R8C/23 16-BIT REJ03B0097-0010 48-pin di5-900 Unit2607 13D2H 1429H 1332H R5F2123 1466H 1439H 1423H 1342H 13F9H 1436H

    Untitled

    Abstract: No abstract text available
    Text: 2: 03 PM SPECTRA 4x155 ASSP Telecom Standard Product Data Sheet Released m be r, 20 02 02 :4 PM5316 da y, 03 De ce SPECTRA 4x155 Data Sheet Released Issue No. 5: September 2002 Do wn lo ad ed by Pa rtM i ne rI nc of Pa rtm in er In co n Tu es SONET/SDH Payload Extractor/Aligner


    Original     		PDF 4x155 PM5316 4x155 PMC-1990822,

    Untitled

    Abstract: No abstract text available
    Text: REJ09B0251-0110 16 R8C/22 Group, R8C/23 Group Hardware Manual RENESAS MCU M16C FAMILY / R8C/Tiny SERIES All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by


    Original     		PDF REJ09B0251-0110 R8C/22 R8C/23

    HD12 DECODER

    Abstract: tr4l CYM1466 146610
    Text: CYM1466 PRELIMINARY CYPRESS SEMICONDUCTOR 512K x 8 SRAM Module Functional Description Features The CYM1466 is a high-performance 4-megabit static RAM module organized as 512K words by 8 bits. This module is constructed using four 128K x 8 RAMs in ceramic leadless chip carrier packages


    OCR Scan     		PDF CYM1466 32-pin, arM1466LHDâ CYM1466HDâ CYM1466LHDâ HD12 DECODER tr4l 146610

    Piezo Audio Transducers

    Abstract: balanced frequency discriminator 5V power supply using bridge rectifier of a bridge rectifier IC
    Text: P L E S S E Y SEMICONDUCTORS ^ 7220513 0 0 0 c1244 7 PLESSEY S em ico n d u cto rs. ZN488E T-7S-D7-// TONE RINGER GENERAL DESCRIPTION FEATURES Full rectifier bridge for direct operation from ringing supply Balanced o u tp u t fo r transducers e le ctrom ag ne tic


    OCR Scan     		PDF c1244 ZN488E ZN488E 560KHz T-75-07-JI 560KHZ 722D513 ZN488 Piezo Audio Transducers balanced frequency discriminator 5V power supply using bridge rectifier of a bridge rectifier IC

    1466HD-120M

    Abstract: 1466h 1466HD
    Text: PRELIM INARY CYM1466 pyppipcq SEMICONDUCTOR 512K x 8 SRAM Module Features Functional Description • T h e CYM 1466 is a high-perform ance 4-m cgabit static R A M module organized as 512K words by 8 bits. T his m odule is constructed using four 128K x 8 R A M s in


    OCR Scan     		PDF CYM1466 1466L 1466HD-85C 1466LH 1466H 1466LHD-85M -100C 1466HD-120M 1466HD

    Untitled

    Abstract: No abstract text available
    Text: CYM1466 PRELIMINARY CYPRESS SEMICONDUCTOR 512Kx 8 SRAM Module Features Functional Description • High-density 4-megabit SRAM module T he CY M 1466 is a high-perform ance 4-m egabit static R A M m odule organized as 512K w ords by 8 bits. T his m odule is


    OCR Scan     		PDF CYM1466 512Kx 32-pin, 100MB 1466L 120MB 1466H

    488e

    Abstract: Piezo Audio Transducers
    Text: APLESSEY W S e m ico n d u c to rs. ZN488E TONE RINGER FEATURES GENERAL DESCRIPTION • Full rectifier bridge for direct operation from ringing supply The Z N 488E integrated circuit tone ringer is intended to replace existing electromechanical bells in telephone handsets


    OCR Scan     		PDF ZN488E 560KHZ 488e Piezo Audio Transducers