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    1156 PIN FCBGA Search Results

    1156 PIN FCBGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-DSDMDB09MF-010 Amphenol Cables on Demand Amphenol CS-DSDMDB09MF-010 9-Pin (DB9) Deluxe D-Sub Cable - Copper Shielded - Male / Female 10ft Datasheet
    CS-DSDMDB15MF-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB15MF-002.5 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Female 2.5ft Datasheet
    CS-DSDMDB15MM-025 Amphenol Cables on Demand Amphenol CS-DSDMDB15MM-025 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Male 25ft Datasheet
    CS-DSDMDB25MM-010 Amphenol Cables on Demand Amphenol CS-DSDMDB25MM-010 25-Pin (DB25) Deluxe D-Sub Cable - Copper Shielded - Male / Male 10ft Datasheet
    CS-DSDMDB37MM-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB37MM-002.5 37-Pin (DB37) Deluxe D-Sub Cable - Copper Shielded - Male / Male 2.5ft Datasheet

    1156 PIN FCBGA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    LFXP2-8E

    Abstract: LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132
    Text: Thermal Management July 2009 Introduction Thermal management is recommended as part of any sound CPLD and FPGA design methodology. To properly assess the thermal characteristics of the system, Lattice Semiconductor specifies a maximum allowable junction temperature in all device data sheets. The system designer should always complete a thermal analysis of their specific design to ensure that the device and package does not exceed the junction temperature requirements.


    Original     		PDF 64-ball 144-ball LFXP2-8E LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132

    BGA 11x11 junction to board thermal resistance

    Abstract: 45x45 mm bga BGA 64 PACKAGE thermal resistance qfn jc jb 45x45 bga BGA 23X23 PQFP 32X32 QFN 48 JC JB 35x35 bga QFN 20X20
    Text: Thermal Management February 2004 Introduction to Thermal Management Thermal considerations are rarely an issue with low-density PLDs such as the Lattice Semiconductor GAL products, however, high-density PLDs often require consideration of thermal issues as part of any sound design methodology. To avoid reliability problems, Lattice Semiconductor specifies a maximum allowable junction temperature


    Original     		PDF 320-ball 432-ball 27x27 31x31 35x35 40x40 45x45 BGA 11x11 junction to board thermal resistance 45x45 mm bga BGA 64 PACKAGE thermal resistance qfn jc jb 45x45 bga BGA 23X23 PQFP 32X32 QFN 48 JC JB 35x35 bga QFN 20X20

    fcBGA PACKAGE thermal resistance

    Abstract: FCBGA 676 BGA package tray QFP PACKAGE thermal resistance FC-BGA 1mm pitch BGA socket PEAK tray drawing nec shipping method reball tray sunrise
    Text: FCBGA Flip Chip Ball Grid Array "Leading Future PKG Technology" NEC FCBGA Contents 1. What is an FCBGA? . 3 2. Advantages . 4 3. Line up . 5


    Original     		PDF C13902EJ1V0PF00 fcBGA PACKAGE thermal resistance FCBGA 676 BGA package tray QFP PACKAGE thermal resistance FC-BGA 1mm pitch BGA socket PEAK tray drawing nec shipping method reball tray sunrise

    AT 2005A

    Abstract: L33 TRANSISTOR ATMEl 837 ARM CORE 1825 verilog code for UART with BIST capability 8 bit risc microprocessor using vhdl L33v verilog code for 32 bit risc processor 2005A-ASIC-06 MIPS64 5kf
    Text: Features • • • • • Available in Gate Array, Embedded Array or Standard Cell High-speed, 75 ps Gate Delay, 2-input NAND, FO = 2 nominal Up to 13.7 Million Used Gates and 1516 Pins 0.18µ Geometry in up to Six-level Metal System-level Integration Technology


    Original     		PDF ARM920TTM ARM946E-STM MIPS64TM AT 2005A L33 TRANSISTOR ATMEl 837 ARM CORE 1825 verilog code for UART with BIST capability 8 bit risc microprocessor using vhdl L33v verilog code for 32 bit risc processor 2005A-ASIC-06 MIPS64 5kf

    Recommended land pattern smd-0.5

    Abstract: "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256
    Text: PCB Layout Recommendations for BGA Packages September 2010 Technical Note TN1074 Introduction As Ball Grid Array BGA packages become increasingly popular and become more populated across the array with higher pin count and smaller pitch, it is important to understand how they are affected by various board layout


    Original     		PDF TN1074 Recommended land pattern smd-0.5 "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256

    socket lga 1156 pinout

    Abstract: i3 processor ITE 8502 intel i3 lga 1156 switch 89HI0524G2PS socket lga 1156 DDR3 pcb layout guidelines IPMI BMC 82574L flash programming
    Text: Intel Server Board S3420GPRX Technical Product Specification Intel order number E92065-001 Revision 1.0 March 2010 Enterprise Platforms and Services Division Revision History Intel® Server Board S3420GPRX TPS Revision History Date Oct. 2009 Revision Number


    Original     		PDF S3420GPRX E92065-001 S3420GPRX 16-bit S5520HC S5520HCS5500HCV S3420GP socket lga 1156 pinout i3 processor ITE 8502 intel i3 lga 1156 switch 89HI0524G2PS socket lga 1156 DDR3 pcb layout guidelines IPMI BMC 82574L flash programming

    ATMEL 634

    Abstract: ST ARM CORE 1825 ATMEL 706 2043A credence tester ARM CORE 1825 atmel 530 atmel 532 mips64 ARM920T
    Text: ATL18 Series . Design Overview Table of Contents Section 1 ATL18 Series ASIC. 1-1 1.1


    Original     		PDF ATL18 ATMEL 634 ST ARM CORE 1825 ATMEL 706 2043A credence tester ARM CORE 1825 atmel 530 atmel 532 mips64 ARM920T

    lcmxo2-1200

    Abstract: LCMXO2-4000 DDR3 pcb layout guide DDR3 sodimm pcb layout schematic isp Cable lattice hw-dln-3c LCMXO2-640 An8077 LCMXO2-7000 vhdl spi interface wishbone LFXP2-8E
    Text: 2 W O LD NE hX-ALL P acO-IT MTHE D Product Selector Guide November 2010 FPGA • CPLD • MIXED SIGNAL • INTELLECTUAL PROPERTY • DEVELOPMENT KITS • DESIGN TOOLS CONTENTS •■ Advanced Packaging. 4


    Original     		PDF LatticeMico32, I0211 lcmxo2-1200 LCMXO2-4000 DDR3 pcb layout guide DDR3 sodimm pcb layout schematic isp Cable lattice hw-dln-3c LCMXO2-640 An8077 LCMXO2-7000 vhdl spi interface wishbone LFXP2-8E

    schematic isp Cable lattice hw-dln-3c

    Abstract: vhdl program for parallel to serial converter
    Text: PRODUCT SELECTOR GUIDE APRIL 2012 FPGA • CPLD • MIXED SIGNAL • INTELLECTUAL PROPERTY • DEVELOPMENT KITS • DESIGN TOOLS CONTENTS • Advanced ■ FPGA


    Original     		PDF LatticeMico32, I0211F schematic isp Cable lattice hw-dln-3c vhdl program for parallel to serial converter

    P/N146071

    Abstract: LC4256 camera-link to HDMI converter vhdl program for parallel to serial converter
    Text: PRODUCT SELECTOR GUIDE OCTOBER 2012 FPGA • CPLD • MIXED SIGNAL • INTELLECTUAL PROPERTY • DEVELOPMENT KITS • DESIGN TOOLS CONTENTS • Advanced ■ FPGA


    Original     		PDF LatticeMico32, I0211K P/N146071 LC4256 camera-link to HDMI converter vhdl program for parallel to serial converter

    LVDS-25

    Abstract: dmd 0.95 1080p dmd 1080p DMD .45 DAP01 LVDS25 DSP dap 1912 xilinx topside marking 1429 d DLP-7000
    Text: DLPC410 www.ti.com DLPS024A – AUGUST 2012 – REVISED SEPTEMBER 2012 DLP Discovery 4100 Digital Controller Check for Samples: DLPC410 FEATURES 1 • 2 • • • • • • Operates the Following DLP Discovery 4100 Chipset Components – DMD: DLP7000 and DLP9500


    Original     		PDF DLPC410 DLPS024A DLP7000 DLP9500 DLPA200 32-kHz 64-Bit 676-Pin, LVDS-25 dmd 0.95 1080p dmd 1080p DMD .45 DAP01 LVDS25 DSP dap 1912 xilinx topside marking 1429 d DLP-7000

    Untitled

    Abstract: No abstract text available
    Text: DLPC410 www.ti.com DLPS024A – AUGUST 2012 – REVISED SEPTEMBER 2012 DLP Discovery 4100 Digital Controller Check for Samples: DLPC410 FEATURES 1 • 2 • • • • • • Operates the Following DLP Discovery 4100 Chipset Components – DMD: DLP7000 and DLP9500


    Original     		PDF DLPC410 DLPS024A DLP7000 DLP9500 DLPA200 32-kHz 64-Bit 676-Pin,

    Untitled

    Abstract: No abstract text available
    Text: 4.25 Gbps 144 x 144 Asynchronous Crosspoint Switch Features • On-chip input and output terminations • Single 2.5 V supply; 3.3 V option for control port • 144 input by 144 output crosspoint switch • 4.25 Gigabit per second Gbps non-return to zero


    Original     		PDF G52369 1-800-VITESSE

    Untitled

    Abstract: No abstract text available
    Text: DLPC410 www.ti.com DLPS024B – AUGUST 2012 – REVISED JUNE 2013 DLP Discovery 4100 Digital Controller Check for Samples: DLPC410 FEATURES APPLICATIONS • • 1 2 • • • • • • Operates the Following DLP Discovery 4100 Chipset Components


    Original     		PDF DLPC410 DLPS024B DLP7000 DLP9500 DLPA200 32-kHz 48-kHz DLPR4101) 64-Bit

    "x-ray machine"

    Abstract: LCMXO640C-3TN144C TN1074 SMD MARKING CODE k11 lattice machxo lcmxo1200c LC4256ZE LCMXO2280C reflow LCMXO2280C-3FTN256I smd marking code G16 LCMXO1200
    Text: MachXO Family Handbook HB1002 Version 02.4, September 2010 MachXO Family Handbook Table of Contents September 2010 Section I. MachXO Family Data Sheet Introduction Features . 1-1


    Original     		PDF HB1002 TN1074 TN1089 TN1091 "x-ray machine" LCMXO640C-3TN144C SMD MARKING CODE k11 lattice machxo lcmxo1200c LC4256ZE LCMXO2280C reflow LCMXO2280C-3FTN256I smd marking code G16 LCMXO1200

    LCMXO1200

    Abstract: LCMXO2280 LCMXO256 LCMXO640 LVCMOS15 LVCMOS25 LVCMOS33 LCMXO1200C-3B256C package dimension 256-FTBGA vhdl code for 4 bit ripple carry adder
    Text: MachXO Family Handbook HB1002 Version 02.5, December 2010 MachXO Family Handbook Table of Contents December 2010 Section I. MachXO Family Data Sheet Introduction Features . 1-1


    Original     		PDF HB1002 TN1091 TN1086 TN1089 TN1092 LCMXO1200 LCMXO2280 LCMXO256 LCMXO640 LVCMOS15 LVCMOS25 LVCMOS33 LCMXO1200C-3B256C package dimension 256-FTBGA vhdl code for 4 bit ripple carry adder

    land pattern BGA 0,50

    Abstract: ROM16X1 Synplify block RAM diamond verilog code for 8 bit fifo register lattice MachXO2 Pinouts files marking code diode Ebr z SMD
    Text: MachXO Family Handbook HB1002 Version 02.7, October 2011 MachXO Family Handbook Table of Contents October 2011 Section I. MachXO Family Data Sheet Introduction Features . 1-1


    Original     		PDF HB1002 TN1089 TN1074 land pattern BGA 0,50 ROM16X1 Synplify block RAM diamond verilog code for 8 bit fifo register lattice MachXO2 Pinouts files marking code diode Ebr z SMD

    1117 L

    Abstract: MachXO2 Family lfxp6c4 MACHXO2 7000 pinout file lattice MachXO2 Pinouts files
    Text: LatticeXP Family Handbook HB1001 Version 03.6, October 2011 LatticeXP Family Handbook Table of Contents September 2011 Section I. LatticeXP Family Data Sheet Introduction Features . 1-1


    Original     		PDF HB1001 TN1049 TN1050 TN1082 TN1074 1117 L MachXO2 Family lfxp6c4 MACHXO2 7000 pinout file lattice MachXO2 Pinouts files

    LC4064ZE

    Abstract: BSDL Files infineon LFXP6C-3FN256I "x-ray machine" K4H560838E LC4064 LC4256ZE LFXP10C-3F256I LFxP3C-3TN144C PCI x1 express PCB dimensions artwork
    Text: LatticeXP Family Handbook HB1001 Version 03.4, September 2010 LatticeXP Family Handbook Table of Contents September 2010 Section I. LatticeXP Family Data Sheet Introduction Features . 1-1


    Original     		PDF HB1001 TN1050 TN1049 TN1082 TN1074 LC4064ZE BSDL Files infineon LFXP6C-3FN256I "x-ray machine" K4H560838E LC4064 LC4256ZE LFXP10C-3F256I LFxP3C-3TN144C PCI x1 express PCB dimensions artwork

    Untitled

    Abstract: No abstract text available
    Text: LatticeECP/EC Family Handbook HB1000 Version 03.8, November 2012 LatticeECP/EC Family Handbook Table of Contents November 2012 Section I. LatticeECP/EC Family Data Sheet Introduction Features . 1-1


    Original     		PDF HB1000 TN1018 TN1071 TN1074 TN1078

    A016 SMD

    Abstract: IDT DATECODE MARKINGS transistor a015 SMD a014 SMD a013 SMD smd diode marking A03 a015 SMD smd diode marking code d7 SMD marking code B21 diode pr2a
    Text: LatticeECP/EC Family Handbook HB1000 Version 03.4, September 2010 LatticeECP/EC Family Handbook Table of Contents September 2010 Section I. LatticeECP/EC Family Data Sheet Introduction Features . 1-1


    Original     		PDF HB1000 TN1052 TN1074 A016 SMD IDT DATECODE MARKINGS transistor a015 SMD a014 SMD a013 SMD smd diode marking A03 a015 SMD smd diode marking code d7 SMD marking code B21 diode pr2a

    lattice MachXO2 Pinouts files

    Abstract: st smd diode marking code aa8 4x4 unsigned multiplier VERILOG coding 3182N B313 marking v6 1317 diode infineon catalog 3 bit right left shift register verilog HDL prog SMD marking code B21 diode atmel 0928
    Text: LatticeECP/EC Family Handbook HB1000 Version 03.6, October 2011 LatticeECP/EC Family Handbook Table of Contents September 2011 Section I. LatticeECP/EC Family Data Sheet Introduction Features . 1-1


    Original     		PDF HB1000 TN1052 TN1074 lattice MachXO2 Pinouts files st smd diode marking code aa8 4x4 unsigned multiplier VERILOG coding 3182N B313 marking v6 1317 diode infineon catalog 3 bit right left shift register verilog HDL prog SMD marking code B21 diode atmel 0928

    Untitled

    Abstract: No abstract text available
    Text: LatticeECP/EC Family Handbook HB1000 Version 03.7, September 2012 LatticeECP/EC Family Handbook Table of Contents September 2012 Section I. LatticeECP/EC Family Data Sheet Introduction Features . 1-1


    Original     		PDF HB1000 TN1008 TN1010 TN1018 TN1071 TN1074 TN1078

    mdu 2653

    Abstract: mdu 2654 BGA1152 transistor Arm 3055 equivalent Gigablaze serdes CMOS h27 j1 3003 RC1800 A207 resistor R10 J 2995 FC1152
    Text: DATASHEET RapidChip Integrator Platform ASIC Family February 2005 Preliminary DB08-000237-03 This document is preliminary. As such, it contains data derived from functional simulations and performance estimates. LSI Logic has not verified either the


    Original     		PDF DB08-000237-03 DB08-000237-03, 1152-Ball mdu 2653 mdu 2654 BGA1152 transistor Arm 3055 equivalent Gigablaze serdes CMOS h27 j1 3003 RC1800 A207 resistor R10 J 2995 FC1152