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    "EXPOSED PAD" PCB VIA Search Results

    "EXPOSED PAD" PCB VIA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    950602CGLFT Renesas Electronics Corporation VIA Mobile PL133T and PLE133T Chipsets. Visit Renesas Electronics Corporation
    9UM709BGILFT Renesas Electronics Corporation Ultra Low Power Programmable Main Clock for VIA VX900 Chipset Visit Renesas Electronics Corporation
    950602CFLF Renesas Electronics Corporation VIA Mobile PL133T and PLE133T Chipsets. Visit Renesas Electronics Corporation
    9UM709BGLF Renesas Electronics Corporation Ultra Low Power Programmable Main Clock for VIA VX900 Chipset Visit Renesas Electronics Corporation
    950602CFLFT Renesas Electronics Corporation VIA Mobile PL133T and PLE133T Chipsets. Visit Renesas Electronics Corporation

    "EXPOSED PAD" PCB VIA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    "exposed pad" PCB via

    Abstract: "thermal via" thermal pcb guidelines AIC1573 copper thermal
    Text: Thermal Design Considerations of Exposed Pad IC As the miniaturization of electronic devices, the small area and close proximity of ICs in these modules demands small packages with excellent thermal properties. Thermal performance is a system level concern, impacted by IC packaging as well as PCB design.


    Original     		PDF im1573 "exposed pad" PCB via "thermal via" thermal pcb guidelines AIC1573 copper thermal

    qfn 48 7x7 stencil

    Abstract: qfn 28 land pattern land pattern for QFN 7x7 24 leads qfn 5x5 qfn 3X3 land pattern "exposed pad" PCB via XAPP439 pcb design 0,5 mm pitch 5x5 matrix qfg48 dimensions QFN PACKAGE thermal resistance
    Text: Application Note: CoolRunner, CPLD R PCB Pad Pattern Design and SurfaceMount Considerations for QFN Packages XAPP439 v1.0 April 11, 2005 Summary Xilinx Quad Flat No-Lead (QFN) package is a robust and low profile leadframe-based plastic package that has several advantages over traditional leadframe packages.The exposed die


    Original     		PDF XAPP439 qfn 48 7x7 stencil qfn 28 land pattern land pattern for QFN 7x7 24 leads qfn 5x5 qfn 3X3 land pattern "exposed pad" PCB via XAPP439 pcb design 0,5 mm pitch 5x5 matrix qfg48 dimensions QFN PACKAGE thermal resistance

    SLUA271

    Abstract: IPC-7527 IPC7527 DUAL ROW QFN leadframe PCB design for very fine pitch csp package nozzle heater qfn Substrate design guidelines IPC-SM-782 qfn 28 land pattern Service Manual smd rework station
    Text: Application Report SLUA271 - June 2002 QFN/SON PCB Attachment PMP Portable Power ABSTRACT Quad flatpack—no leads QFN and small outline—no leads (SON) are leadless packages with electrical connections made via lands on the bottom side of the component to the surface


    Original     		PDF SLUA271 IPC-7527 IPC7527 DUAL ROW QFN leadframe PCB design for very fine pitch csp package nozzle heater qfn Substrate design guidelines IPC-SM-782 qfn 28 land pattern Service Manual smd rework station

    SAC305

    Abstract: 24 leads qfn 5x5 "thermal via" PQFN-24 rf 4 mm PQFN PQFN 8 leads PQFN SAC-305 AN3778 QFN PACKAGE Junction to PCB thermal resistance
    Text: Freescale Semiconductor Application Note AN3778 Rev. 0, 2/2010 PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat Dissipation By: Quan Li, Lu Li, Richard Rowan, and Mahesh Shah PURPOSE This document provides guidelines for printed circuit board


    Original     		PDF AN3778 SAC305 24 leads qfn 5x5 "thermal via" PQFN-24 rf 4 mm PQFN PQFN 8 leads PQFN SAC-305 AN3778 QFN PACKAGE Junction to PCB thermal resistance

    jedec footprint MO-220 VHHD-2

    Abstract: qfn 44 PACKAGE footprint QFN 64 9x9 footprint 32 pins qfn 5x5 footprint jedec package MO-220 64 9x9 WAN0118 WAN_0118 QFN footprint IPC-A-610D QFN 56 7x7 footprint
    Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the


    Original     		PDF

    rt8566

    Abstract: RC560 DS856
    Text: RT8566 High Voltage 8-CH LED Driver General Description Features The RT8566 is an 8-CH LED driver capable of delivering 120mA for each channel. The RT8566 is a current mode boost converter with an adjustable switching frequency via the RT pin from 100kHz to 1MHz and a wide VIN


    Original     		PDF RT8566 RT8566 120mA 100kHz DS8566-02 RC560 DS856

    JEDEC Drawing MO-220 qfn

    Abstract: 32 pins qfn 5x5 footprint QFN footprint WAN_0118 QFN 20 5x5 "recommended PCB Layout" qfn 48 7x7 stencil QFN 56 7x7 footprint 32-pin QFN PCB Layout guide MO-220 7x7 0.4 pitch qfn 44 PACKAGE footprint 7x7 DIe Size
    Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the


    Original     		PDF

    EN5360DC

    Abstract: J-STD-020A IR probe
    Text: THERMAL NOTE ENPIRION Regarding the EN5360 Family of DC-DC Converters Thermal Characteristics The Enpirion EN5360 package is constructed with a thermally enhanced laminate substrate that includes copper plated thermal vias. The device is designed to operate in the ambient temperature range of 0°C to


    Original     		PDF EN5360 EN5360DC J-STD-020A IR probe

    Untitled

    Abstract: No abstract text available
    Text: A3992 DMOS Dual Full-Bridge Microstepping PWM Motor Driver Features and Benefits Description ±1.5 A, 50 V continuous output rating Low RDS on DMOS output drivers Short-to-ground protection Shorted load protection Optimized microstepping via six bit linear DACs


    Original     		PDF A3992 A3992

    PQFN

    Abstract: DUAL ROW QFN leadframe PQFN footprint "exposed pad" PCB via JESD51-5 AN2467 PQFN package power freescale PQFN 8 leads
    Text: Freescale Semiconductor Application Note AN2467 Rev. 4.0, 4/2007 Power Quad Flat No-Lead PQFN Package 1 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance attributes such as Moisture Sensitivity


    Original     		PDF AN2467 PQFN DUAL ROW QFN leadframe PQFN footprint "exposed pad" PCB via JESD51-5 AN2467 PQFN package power freescale PQFN 8 leads

    "exposed pad" PCB via

    Abstract: exposed
    Text: PROTOTYPING AND PC BOARD LAYOUT Jun 24, 2004 Exposed Pads: A Brief Introduction Many of Maxim's recent ICs have "exposed pad" packages. As there have been many questions from our customers on dealing with the exposed pad, this note attempts to provide some general advice.


    Original     		PDF

    QFN 5x5

    Abstract: qfn stencil "exposed pad" PCB via "thermal via" solder mask P4171 X-RAY INSPECTION via diameter pitch 40-QFN QFN "exposed die"
    Text: Thermal Via Note: PCA 40 QFN 5X5 NDG 40 package QFN EXPOSED DIE PAD DIMENSIONS = 3.7 mm +- 0.10 mm QFN I/0 PAD LENGTH =0.4+-0.10 mm max QFN I/0 PAD WIDTH =0.15 mm min 0.20 mm typ 0.25 mm max PCA 40 QFN 5x5 NDG 40 package the land pattern dimensions should


    Original     		PDF com/data/tb/TB389 dwg/plastic/P4171 QFN 5x5 qfn stencil "exposed pad" PCB via "thermal via" solder mask P4171 X-RAY INSPECTION via diameter pitch 40-QFN QFN "exposed die"

    QFN 5X5

    Abstract: "thermal via" qfn land pattern
    Text: Thermal Via Note: PCA 40 QFN 5X5 NDG 40 package QFN EXPOSED DIE PAD DIMENSIONS = 3.5 mm +- 0.10 mm QFN I/0 PAD LENGTH =0.4+-0.10 mm max QFN I/0 PAD WIDTH =0.17 mm min 0.20 mm typ 0.25 mm max PCA 40 QFN 5x5 NDG 40 package the land pattern dimensions should


    Original     		PDF com/data/tb/TB389 dwg/plastic/P4171 QFN 5X5 "thermal via" qfn land pattern

    PQFN

    Abstract: PQFN footprint AN2467 DUAL ROW QFN leadframe MC33982PNA MC33982FC ADHESIVE GAP PAD PQFN 5 leads PQFN package power freescale JESD51-5
    Text: Freescale Semiconductor, Inc. Application Note AN2467/D Revision 1.0 09/2004 Topic Page Freescale Semiconductor, Inc. 1.0 Purpose . 1 2.0 Scope. 1 3.0 Power Quad Flat No-Lead PQFN


    Original     		PDF AN2467/D AN2467/D PQFN PQFN footprint AN2467 DUAL ROW QFN leadframe MC33982PNA MC33982FC ADHESIVE GAP PAD PQFN 5 leads PQFN package power freescale JESD51-5

    ics841202

    Abstract: No abstract text available
    Text: Crystal-to-HCSL Clock Synthesizer w/Spread Spectrum ICS841202-245 DATA SHEET General Description Features The ICS841202-245 is a two output clock synthesizer optimized to generate low jitter with or without spread spectrum modulation. Spread type and amount can be configured via the SSC control pins.


    Original     		PDF ICS841202-245 ICS841202-245 25MHz, 100MHz, 125MHz 250MHz. 32-pin ics841202

    "exposed pad" PCB via

    Abstract: No abstract text available
    Text: Application Note, Rev. 1.0, November 2008 Thermal Evaluation: Comparison of Standard and Exposed Pad DSO Package Example of SPOC Devices BTS5682E, BTS5672E, BTS5662E Automotive Division by U. Fröhler H. Hopfgartner M. Walder Thermal Evaluation: Standard vs. Exposed Pad DSO Package


    Original     		PDF BTS5682E, BTS5672E, BTS5662E "exposed pad" PCB via

    VQFN package

    Abstract: jedec package MO-220 Die Attach epoxy stamping MO-220 "exposed pad" PCB via IPC A 610
    Text: VQFN PCB Design Guidance Notes Publication: D/VQFN/2 February 2008 General guidelines on using the CML VQFN package 2008 CML Microsystems Plc VQFN PCB Design Guidance Notes 1. Introduction VQFNs are near chip scale plastic encapsulated leadless packages that CML has adopted for a


    Original     		PDF

    land pattern for DFN

    Abstract: "exposed pad" PCB via QFN PACKAGE Junction to PCB thermal resistance "thermal via" qfn44 QFN PACKAGE thermal resistance AN-121 QFN footprint DFN PACKAGE thermal resistance QFN44-24
    Text: AN-121 Application Note Mounting Considerations for Exposed-Paddle Packages Introduction Many of AnalogicTech's products incorporate exposed paddles in their packages. The exposed paddle or exposed pad packages operationally decrease the thermal resistance, thereby providing superior heat dissipation from the die. The packages fall into two main categories: quad LLP leadless lead frame package QFN


    Original     		PDF AN-121 AN-121 land pattern for DFN "exposed pad" PCB via QFN PACKAGE Junction to PCB thermal resistance "thermal via" qfn44 QFN PACKAGE thermal resistance QFN footprint DFN PACKAGE thermal resistance QFN44-24

    AN-1187

    Abstract: MO-220 MO-229 package tray design dwg
    Text: Table of Contents Introduction . 2 Package Overview . 2


    Original     		PDF AN-1187 AN-1187 MO-220 MO-229 package tray design dwg

    0.3mm pitch csp package

    Abstract: AN-1187 DAP 08 PCB design for 0.2mm pitch csp package DAP 07 dap sot 23-5 SAC405 LDA08B MO-220 MO-229
    Text: Table of Contents Introduction . 2 Package Overview . 2


    Original     		PDF AN-1187 0.3mm pitch csp package AN-1187 DAP 08 PCB design for 0.2mm pitch csp package DAP 07 dap sot 23-5 SAC405 LDA08B MO-220 MO-229

    PCB design for 0.2mm pitch csp package

    Abstract: SAC305 reflow profile sac305 thermal conductive DAP 07 JESD22-B111 dap sot 23-5 DAP 06 dap 11 LDA08B MO-220
    Text: Table of Contents Introduction . 2 Package Overview . 2


    Original     		PDF CSP-9-111S2) CSP-9-111S2. AN-1187 PCB design for 0.2mm pitch csp package SAC305 reflow profile sac305 thermal conductive DAP 07 JESD22-B111 dap sot 23-5 DAP 06 dap 11 LDA08B MO-220

    Untitled

    Abstract: No abstract text available
    Text: APPLICATION NOTE Mounting Considerations for Exposed-Paddle Packages Introduction Many of Skyworks products incorporate exposed paddles in their packages. The exposed paddle or exposed pad packages operationally decrease the thermal resistance, which provides


    Original     		PDF 02743A

    IPC-7527

    Abstract: PCB design for 0.2mm pitch csp package IPC7527 tssop 16 exposed pad stencil metcal VPI-1000 qfn 44 PACKAGE footprint 7x7 DIe Size qfn 48 7x7 stencil QFN 16 CARSEM package outline QFN 8 CARSEM APR-5000
    Text: MLP Application Note APPLICATION NOTE Comprehensive User’s Guide April 2002 April 2002 Cover Page Page MLP Application Note CONTENTS 1.0 1.1 THE CARSEM MICRO LEADFRAME PACKAGE MLP Introduction 2.0 2.1 MANUFACTURING CONSIDERATIONS SMT Process 3.0 3.1 3.2


    Original     		PDF

    DAP 07

    Abstract: JESD22-B111 DAP 08 transistor smd sensor 80L dap 07 smd dap sot 23-5 SPA52A AN-1187 LQB08A MO-220
    Text: National Semiconductor Application Note 1187 August 27, 2010 Table of Contents Introduction . 2 Package Overview . 2


    Original     		PDF AN-1187 DAP 07 JESD22-B111 DAP 08 transistor smd sensor 80L dap 07 smd dap sot 23-5 SPA52A AN-1187 LQB08A MO-220